{"id":"https://openalex.org/W2083385605","doi":"https://doi.org/10.1063/1.3548430","title":"Nissin Ion Doping System\u2014H[sub 2]+] Implantation for Silicon Layer Exfoliation","display_name":"Nissin Ion Doping System\u2014H[sub 2]+] Implantation for Silicon Layer Exfoliation","publication_year":2011,"publication_date":"2011-01-01","ids":{"openalex":"https://openalex.org/W2083385605","doi":"https://doi.org/10.1063/1.3548430","mag":"2083385605"},"language":"en","primary_location":{"id":"doi:10.1063/1.3548430","doi":"https://doi.org/10.1063/1.3548430","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.3548430","pdf_url":null,"source":{"id":"https://openalex.org/S2764696622","display_name":"AIP conference proceedings","issn_l":"0094-243X","issn":["0094-243X","1551-7616","1935-0465"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"AIP Conference Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020915724","display_name":"Sarko Cherekdjian","orcid":"https://orcid.org/0000-0002-9645-3404","observed_orcids":["https://orcid.org/0000-0002-9645-3404"]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"S. Cherekdjian","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077852120","display_name":"Richard O. Maschmeyer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"R. O. Maschmeyer","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110212649","display_name":"Jeffery Cites","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"J. Cites","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017282382","display_name":"Junichi Tatemichi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"J. Tatemichi","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110138570","display_name":"Yutaka Inouchi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Y. Inouchi","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047778593","display_name":"Masatoshi Onoda","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"M. Onoda","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026240589","display_name":"Kohichi Orihira","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"K. Orihira","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054079223","display_name":"Takeshi Matsumoto","orcid":"https://orcid.org/0000-0002-1517-0761","observed_orcids":["https://orcid.org/0000-0002-1517-0761"]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"T. Matsumoto","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110079314","display_name":"Morikazu Konishi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"M. Konishi","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":null,"display_name":"M. Naito","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I4405273606","display_name":"Nissin Ion Equipment Co., Ltd. (Japan)","ror":"https://ror.org/004fszq46","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273606"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"M. Naito","raw_affiliation_strings":["aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","bCorning Incorporated, Corning NY 14831, USA","cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"aPrO Unlimited (on assignment at Corning Incorporated) Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"bCorning Incorporated, Corning NY 14831, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"cNissin Ion Equipment Co., Ltd., 29, Hinokigaoka, Minakuchi\u2010cho, Koka, Shiga, 528\u20100068888, Japan","institution_ids":["https://openalex.org/I4405273606"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018101394","display_name":"Jiro Matsuo","orcid":"https://orcid.org/0000-0003-0684-3677","observed_orcids":["https://orcid.org/0000-0003-0684-3677"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jiro Matsuo","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074923815","display_name":"Masataka Kase","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Masataka Kase","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020399656","display_name":"Takaaki Aoki","orcid":"https://orcid.org/0000-0002-5926-4903","observed_orcids":["https://orcid.org/0000-0002-5926-4903"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Takaaki Aoki","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5073910564","display_name":"Toshio Seki","orcid":"https://orcid.org/0000-0002-0834-1657","observed_orcids":["https://orcid.org/0000-0002-0834-1657"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Toshio Seki","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.9904,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.77456299,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"392","last_page":"395"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12166","display_name":"Ion-surface interactions and analysis","score":0.8535000085830688,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12166","display_name":"Ion-surface interactions and analysis","score":0.8535000085830688,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.054999999701976776,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Low-Pressure Plasma Processing and Diagnostics","score":0.010099999606609344,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/hydrogen-implantation","display_name":"hydrogen implantation","score":0.8289999961853027},{"id":"https://openalex.org/keywords/silicon-on-glass","display_name":"silicon-on-glass","score":0.8769999742507935},{"id":"https://openalex.org/keywords/ion-optics","display_name":"ion optics","score":0.8309999704360962},{"id":"https://openalex.org/keywords/risk-reduction","display_name":"risk mitigation","score":0.42399999499320984},{"id":"https://openalex.org/keywords/production-readiness","display_name":"production readiness","score":0.5659999847412109}],"concepts":[{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.7624218463897705},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7369825839996338},{"id":"https://openalex.org/C41823505","wikidata":"https://www.wikidata.org/wiki/Q1436752","display_name":"Ion implantation","level":3,"score":0.5235195755958557},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.49329203367233276},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4843693673610687},{"id":"https://openalex.org/C50774322","wikidata":"https://www.wikidata.org/wiki/Q644248","display_name":"Ion beam","level":3,"score":0.4815578758716583},{"id":"https://openalex.org/C129162502","wikidata":"https://www.wikidata.org/wiki/Q1200889","display_name":"Exfoliation joint","level":3,"score":0.43430477380752563},{"id":"https://openalex.org/C168834538","wikidata":"https://www.wikidata.org/wiki/Q3705329","display_name":"Beam (structure)","level":2,"score":0.29520294070243835},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.20960110425949097},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.20707502961158752},{"id":"https://openalex.org/C145148216","wikidata":"https://www.wikidata.org/wiki/Q36496","display_name":"Ion","level":2,"score":0.19392961263656616},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.11547473073005676},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1063/1.3548430","doi":"https://doi.org/10.1063/1.3548430","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.3548430","pdf_url":null,"source":{"id":"https://openalex.org/S2764696622","display_name":"AIP conference proceedings","issn_l":"0094-243X","issn":["0094-243X","1551-7616","1935-0465"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"AIP Conference Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5378999710083008,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1967929639","https://openalex.org/W2034333965","https://openalex.org/W2054030674","https://openalex.org/W3093199531"],"related_works":["https://openalex.org/W2054030674","https://openalex.org/W2033305762","https://openalex.org/W3764743","https://openalex.org/W2100316296","https://openalex.org/W2903637246","https://openalex.org/W3083737238","https://openalex.org/W2604751017","https://openalex.org/W2163329745","https://openalex.org/W2072834047","https://openalex.org/W2087543564"],"abstract_inverted_index":{"A":[0,49],"Nissin":[1,82],"iG4":[2,85,158],"ion":[3,78,117,171],"doping":[4],"system":[5,95,178],"(termed":[6],"iG4)":[7],"utilizes":[8],"broad":[9,83],"beam":[10,77,84,172],"technology":[11],"to":[12,42,58,80,121,145,163],"implant":[13,70,93,147,154],"GEN":[14,30],"4":[15,31],"sheets":[16],"of":[17,66,190],"glass":[18,32,132],"for":[19,29,98,127,156,185],"LCD":[20],"production.":[21],"The":[22,87,102,116,150],"mechanical":[23],"scanned":[24],"end\u2010station":[25,39,90,103],"with":[26,167],"robotic":[27],"handling":[28],"substrates":[33],"was":[34,40,56,96,119],"redesigned,":[35],"and":[36,62,100,143],"a":[37,74],"new":[38],"built":[41],"handle":[43],"rectangular":[44,105,194],"silicon":[45,88,106,114,130,193],"tiles":[46,107],"(23\u00d718":[47],"cm).":[48],"three":[50],"sub\u2010system":[51],"modular":[52],"risk":[53],"reduction":[54],"process":[55,139,160],"used":[57],"test":[59],"production":[60,189],"solutions,":[61],"maximize":[63],"the":[64,68,81,92,128,146,157,168,177,186],"success":[65],"transferring":[67],"R&D":[69,169],"recipes":[71],"developed":[72],"on":[73,131],"standard":[75],"focused":[76,170],"implanter":[79],"solution.":[86],"tile":[89],"including":[91],"scanning":[94],"tested":[97],"reliability":[99],"durability.":[101],"handled":[104],"reliably":[108],"without":[109],"detrimental":[110],"edge":[111],"chipping":[112],"or":[113],"breakage.":[115],"optics":[118],"demonstrated":[120],"successfully":[122],"provide":[123],"stable":[124],"hydrogen":[125,191],"ions":[126],"Corning\u00ae":[129],"layer":[133,137],"transfer":[134,138],"process.":[135],"This":[136,174],"is":[140],"very":[141],"susceptible":[142],"sensitive":[144],"processing":[148,155],"temperature.":[149],"temperature":[151],"excursions":[152],"during":[153],"exfoliation":[159],"were":[161],"found":[162],"be":[164],"in":[165,180],"line":[166],"system.":[173],"data":[175],"confirmed":[176],"production\u2010readiness":[179],"providing":[181],"an":[182],"efficient":[183],"solution":[184],"high":[187],"volume":[188],"implanted":[192],"tiles.":[195]},"counts_by_year":[],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}