{"id":"https://openalex.org/W2077856478","doi":"https://doi.org/10.1115/imece2002-32827","title":"Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests","display_name":"Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests","publication_year":2002,"publication_date":"2002-01-01","ids":{"openalex":"https://openalex.org/W2077856478","doi":"https://doi.org/10.1115/imece2002-32827","mag":"2077856478"},"language":"en","primary_location":{"id":"doi:10.1115/imece2002-32827","doi":"https://doi.org/10.1115/imece2002-32827","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2002-32827","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050287880","display_name":"T. E. Wong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4388891764","display_name":"Raytheon (United States)","ror":"https://ror.org/03gkvrb60","country_code":"US","type":"company","lineage":["https://openalex.org/I1306686416","https://openalex.org/I4388891764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. E. Wong","raw_affiliation_strings":["Raytheon Electronic Systems, El Segundo, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Raytheon Electronic Systems, El Segundo, CA","institution_ids":["https://openalex.org/I4388891764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052553354","display_name":"Chun\u2010Sean Lau","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4388891764","display_name":"Raytheon (United States)","ror":"https://ror.org/03gkvrb60","country_code":"US","type":"company","lineage":["https://openalex.org/I1306686416","https://openalex.org/I4388891764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Y. Lau","raw_affiliation_strings":["Raytheon Electronic Systems, El Segundo, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Raytheon Electronic Systems, El Segundo, CA","institution_ids":["https://openalex.org/I4388891764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033349027","display_name":"L. A. Kachatorian","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4388891764","display_name":"Raytheon (United States)","ror":"https://ror.org/03gkvrb60","country_code":"US","type":"company","lineage":["https://openalex.org/I1306686416","https://openalex.org/I4388891764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"L. A. Kachatorian","raw_affiliation_strings":["Raytheon Electronic Systems, El Segundo, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Raytheon Electronic Systems, El Segundo, CA","institution_ids":["https://openalex.org/I4388891764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051663119","display_name":"H. S. Fenger","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4388891764","display_name":"Raytheon (United States)","ror":"https://ror.org/03gkvrb60","country_code":"US","type":"company","lineage":["https://openalex.org/I1306686416","https://openalex.org/I4388891764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. S. Fenger","raw_affiliation_strings":["Raytheon Electronic Systems, El Segundo, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Raytheon Electronic Systems, El Segundo, CA","institution_ids":["https://openalex.org/I4388891764"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083264080","display_name":"I. C. Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4388891764","display_name":"Raytheon (United States)","ror":"https://ror.org/03gkvrb60","country_code":"US","type":"company","lineage":["https://openalex.org/I1306686416","https://openalex.org/I4388891764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"I. C. Chen","raw_affiliation_strings":["Raytheon Electronic Systems, El Segundo, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Raytheon Electronic Systems, El Segundo, CA","institution_ids":["https://openalex.org/I4388891764"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4388891764"],"apc_list":null,"apc_paid":null,"fwci":0.356,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.51660593,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"221","last_page":"227"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"ball grid array","score":0.9179999828338623},{"id":"https://openalex.org/keywords/thermal-fatigue-life","display_name":"thermal fatigue life","score":0.8220000267028809},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.8270000219345093},{"id":"https://openalex.org/keywords/electronic-packaging-design","display_name":"electronic packaging design","score":0.8069999814033508},{"id":"https://openalex.org/keywords/conformal-coating","display_name":"conformal coating","score":0.9980000257492065},{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.8040000200271606},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.9259999990463257},{"id":"https://openalex.org/keywords/failure-mechanisms","display_name":"failure mechanisms","score":0.7670000195503235},{"id":"https://openalex.org/keywords/experimental-design","display_name":"experimental design","score":0.7080000042915344}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.9856889843940735},{"id":"https://openalex.org/C2776543023","wikidata":"https://www.wikidata.org/wiki/Q2147046","display_name":"Rework","level":2,"score":0.8337914943695068},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8130055665969849},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.73610520362854},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6529927253723145},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.5154879689216614},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.48909813165664673},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.45233747363090515},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4477165937423706},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.44103366136550903},{"id":"https://openalex.org/C2781122048","wikidata":"https://www.wikidata.org/wiki/Q15983064","display_name":"Fixture","level":2,"score":0.42464709281921387},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.4047946333885193},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3846299648284912},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.31981223821640015},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.28561103343963623},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.22880086302757263},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.20578131079673767},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17712008953094482},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.11053934693336487},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08138665556907654},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/imece2002-32827","doi":"https://doi.org/10.1115/imece2002-32827","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2002-32827","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.651199996471405}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2108210472","https://openalex.org/W4310818168","https://openalex.org/W1992916264","https://openalex.org/W4310904645","https://openalex.org/W2469737802","https://openalex.org/W2076673959","https://openalex.org/W4388213987","https://openalex.org/W2743251584","https://openalex.org/W1795931167","https://openalex.org/W2742870310"],"abstract_inverted_index":{"The":[0,29,94],"objective":[1],"of":[2,11,22,57,67,90,96,127,137],"the":[3,9,18,103,119,124,128,135,147,154],"present":[4,104],"study":[5],"is":[6,73,100,114,144],"to":[7,81,85,116],"evaluate":[8],"impact":[10],"electronic":[12],"packaging":[13],"design/manufacturing":[14],"process":[15],"parameters":[16,32,140],"on":[17,42,63,107,141,146],"thermal":[19],"fatigue":[20,142,155],"life":[21,143,156],"ball":[23],"grid":[24],"array":[25],"(BGA)":[26],"solder":[27,39,91,129],"joints.":[28,130],"four":[30],"selected":[31],"are":[33,71],"BGA":[34,47,68],"under-fill":[35],"materials,":[36],"conformal":[37],"coating,":[38],"pad":[40],"sizes":[41,66],"printed":[43],"wiring":[44],"board,":[45],"and":[46,76,78,122],"rework,":[48],"with":[49,87],"each":[50],"having":[51],"either":[52],"two":[53],"or":[54],"three":[55],"levels":[56],"variation.":[58],"A":[59],"test":[60],"vehicle":[61],"(TV),":[62],"which":[64],"various":[65],"daisy-chained":[69],"packages":[70],"soldered,":[72],"first":[74],"designed":[75],"fabricated,":[77],"then":[79],"subjected":[80],"temperature":[82],"cycling":[83],"(\u221255\u00b0C":[84],"+125\u00b0C)":[86],"continuous":[88],"monitoring":[89],"joint":[92],"integrity.":[93],"total":[95],"15":[97],"experimental":[98],"cases":[99],"used":[101],"in":[102,150],"study.":[105],"Based":[106],"monitored":[108],"results,":[109],"a":[110],"destructive":[111],"physical":[112],"analysis":[113],"conducted":[115],"further":[117],"isolate":[118],"failure":[120,125],"locations":[121],"determine":[123],"mechanisms":[126],"Test":[131],"results":[132],"indicate":[133],"that":[134],"influence":[136],"these":[138],"design":[139],"dependent":[145],"particular":[148],"package,":[149],"some":[151],"instances":[152],"improving":[153],"tenfold.":[157]},"counts_by_year":[],"updated_date":"2026-11-02T09:45:03.842371","created_date":"2016-06-24T00:00:00"}