{"id":"https://openalex.org/W2071532344","doi":"https://doi.org/10.1115/mnht2008-52043","title":"Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat Pipe","display_name":"Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat Pipe","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W2071532344","doi":"https://doi.org/10.1115/mnht2008-52043","mag":"2071532344"},"language":"en","primary_location":{"id":"doi:10.1115/mnht2008-52043","doi":"https://doi.org/10.1115/mnht2008-52043","is_oa":false,"landing_page_url":"https://doi.org/10.1115/mnht2008-52043","pdf_url":null,"source":{"id":"https://openalex.org/S4306503394","display_name":"ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064190432","display_name":"Hani Hussain Sait","orcid":"https://orcid.org/0000-0002-8163-6224","observed_orcids":["https://orcid.org/0000-0002-8163-6224"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hani H. Sait","raw_affiliation_strings":["Jeddah College of Technology, Jeddah, Saudi Arabia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jeddah College of Technology, Jeddah, Saudi Arabia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045429524","display_name":"Steven M. Demsky","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I76835614","display_name":"University of Missouri","ror":"https://ror.org/02ymw8z06","country_code":"US","type":"education","lineage":["https://openalex.org/I76835614"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Steve M. Demsky","raw_affiliation_strings":["University of Missouri, Columbia, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Missouri, Columbia, MO","institution_ids":["https://openalex.org/I76835614"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043145009","display_name":"Hongbin Ma","orcid":"https://orcid.org/0000-0003-0930-517X","observed_orcids":["https://orcid.org/0000-0003-0930-517X"]},"institutions":[{"id":"https://openalex.org/I76835614","display_name":"University of Missouri","ror":"https://ror.org/02ymw8z06","country_code":"US","type":"education","lineage":["https://openalex.org/I76835614"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"HongBin Ma","raw_affiliation_strings":["University of Missouri, Columbia, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Missouri, Columbia, MO","institution_ids":["https://openalex.org/I76835614"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.19674134,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"941","last_page":"962"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11382","display_name":"Fluid Dynamics and Heat Transfer","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/micro-heat-pipes","display_name":"micro heat pipes","score":0.9290000200271606},{"id":"https://openalex.org/keywords/thin-film-evaporation","display_name":"thin film evaporation","score":0.8429999947547913},{"id":"https://openalex.org/keywords/operating-temperature","display_name":"operating temperature","score":0.7419999837875366},{"id":"https://openalex.org/keywords/surface-tension","display_name":"surface tension","score":0.7440000176429749},{"id":"https://openalex.org/keywords/frictional-shear-stress","display_name":"frictional shear stress","score":0.9200000166893005},{"id":"https://openalex.org/keywords/wettability","display_name":"wettability","score":0.8820000290870667},{"id":"https://openalex.org/keywords/disjoining-pressure","display_name":"disjoining pressure","score":0.9990000128746033},{"id":"https://openalex.org/keywords/heat-flux-removal","display_name":"heat flux removal","score":0.7559999823570251},{"id":"https://openalex.org/keywords/heat-transfer-mechanisms","display_name":"heat transfer mechanisms","score":0.7329999804496765}],"concepts":[{"id":"https://openalex.org/C2778626634","wikidata":"https://www.wikidata.org/wiki/Q4390154","display_name":"Disjoining pressure","level":3,"score":0.8114739060401917},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7636744976043701},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.7226864099502563},{"id":"https://openalex.org/C159188206","wikidata":"https://www.wikidata.org/wiki/Q1478382","display_name":"Heat flux","level":3,"score":0.6835284233093262},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.6498416662216187},{"id":"https://openalex.org/C37728375","wikidata":"https://www.wikidata.org/wiki/Q600568","display_name":"Heat pipe","level":3,"score":0.6401107311248779},{"id":"https://openalex.org/C61441594","wikidata":"https://www.wikidata.org/wiki/Q132814","display_name":"Evaporation","level":2,"score":0.636664628982544},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.5954470634460449},{"id":"https://openalex.org/C131321042","wikidata":"https://www.wikidata.org/wiki/Q656685","display_name":"Operating temperature","level":2,"score":0.567221999168396},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5527780652046204},{"id":"https://openalex.org/C2779301550","wikidata":"https://www.wikidata.org/wiki/Q217236","display_name":"Working fluid","level":2,"score":0.5186837911605835},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4945323169231415},{"id":"https://openalex.org/C8892853","wikidata":"https://www.wikidata.org/wiki/Q170749","display_name":"Surface tension","level":2,"score":0.4376331567764282},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.3697110116481781},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.06972575187683105},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/mnht2008-52043","doi":"https://doi.org/10.1115/mnht2008-52043","is_oa":false,"landing_page_url":"https://doi.org/10.1115/mnht2008-52043","pdf_url":null,"source":{"id":"https://openalex.org/S4306503394","display_name":"ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320309568","display_name":"University of Missouri","ror":"https://ror.org/02ymw8z06"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1975314920","https://openalex.org/W2029345594","https://openalex.org/W2032472521","https://openalex.org/W2053801390","https://openalex.org/W2061673460","https://openalex.org/W2081954712","https://openalex.org/W2085080346","https://openalex.org/W2094879072","https://openalex.org/W2129133566"],"related_works":["https://openalex.org/W2090270663","https://openalex.org/W2110834393","https://openalex.org/W2128996055","https://openalex.org/W4401343921","https://openalex.org/W1985091761","https://openalex.org/W2744703717","https://openalex.org/W2086028072","https://openalex.org/W2008852746","https://openalex.org/W1551161725","https://openalex.org/W7009632346"],"abstract_inverted_index":{"An":[0],"analytical":[1],"model":[2],"describing":[3],"thin":[4,38,67,75,96],"film":[5,39,68,76,97],"evaporation":[6,98],"is":[7],"developed":[8],"that":[9,47],"includes":[10],"the":[11,36,49,53,65,74,80,83,91,101],"effects":[12,25],"of":[13,26,29,52,95,108],"surface":[14],"tension,":[15],"frictional":[16],"shear":[17],"stress,":[18],"wetting":[19],"characteristics":[20],"and":[21,32],"disjoining":[22],"pressure.":[23],"The":[24,44,70,78,93],"thermal":[27,50],"conductivity":[28,51],"working":[30,54],"fluids":[31],"operating":[33,71,81],"temperature":[34,72],"on":[35],"evaporating":[37,66],"region":[40],"are":[41],"also":[42],"studied.":[43],"results":[45,103],"indicate":[46],"when":[48],"fluid":[55],"increases,":[56],"a":[57,105],"high":[58],"heat":[59,85,109,115],"flux":[60,86],"can":[61,87],"be":[62,88],"removed":[63,89],"from":[64,90],"region.":[69,92],"affects":[73],"evaporation.":[77],"higher":[79],"temperature,":[82],"more":[84],"information":[94],"presented":[99],"in":[100,104,113],"paper":[102],"better":[106],"understanding":[107],"transfer":[110],"mechanism":[111],"occurring":[112],"micro":[114],"pipes.":[116]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-09-25T08:18:29.962427","created_date":"2016-06-24T00:00:00"}