{"id":"https://openalex.org/W2063549554","doi":"https://doi.org/10.1109/impact.2010.5699606","title":"Process and characterization of ultra-thin film packages","display_name":"Process and characterization of ultra-thin film packages","publication_year":2010,"publication_date":"2010-10-01","ids":{"openalex":"https://openalex.org/W2063549554","doi":"https://doi.org/10.1109/impact.2010.5699606","mag":"2063549554"},"language":"en","primary_location":{"id":"doi:10.1109/impact.2010.5699606","doi":"https://doi.org/10.1109/impact.2010.5699606","is_oa":false,"landing_page_url":"https://doi.org/10.1109/impact.2010.5699606","pdf_url":null,"source":{"id":"https://openalex.org/S4306420016","display_name":"International Microsystems, Packaging, Assembly and Circuits Technology Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112225723","display_name":"Tzu-Ying Kuo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tzu-Ying Kuo","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111492865","display_name":"Zhi-Cheng Hsiao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Zhi-Cheng Hsiao","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088109393","display_name":"Yin-Po Hung","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yin-Po Hung","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100317996","display_name":"Wei Li","orcid":"https://orcid.org/0000-0001-7114-0869","observed_orcids":["https://orcid.org/0000-0001-7114-0869"]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wei Li","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011097996","display_name":"Kuo-Chyuan Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuo-Chyuan Chen","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102136883","display_name":"Chao-Kai Hsu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chao-Kai Hsu","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111948705","display_name":"Cheng-Ta Ko","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Ta Ko","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100384519","display_name":"Yuhua Chen","orcid":"https://orcid.org/0000-0002-6407-9649","observed_orcids":["https://orcid.org/0000-0002-6407-9649"]},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Hua Chen","raw_affiliation_strings":["Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Opto-electronics Research Laboratories, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17,195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C","institution_ids":["https://openalex.org/I4210148468"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210148468"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9746000170707703,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9746000170707703,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.020600000396370888,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"flexible electronics","score":0.7580000162124634},{"id":"https://openalex.org/keywords/flexible-substrates","display_name":"flexible substrates","score":0.6069999933242798},{"id":"https://openalex.org/keywords/flip-chip-bonding","display_name":"flip-chip bonding","score":0.8309999704360962},{"id":"https://openalex.org/keywords/thermal-cycling-reliability","display_name":"thermal cycling reliability","score":0.5960000157356262},{"id":"https://openalex.org/keywords/package-miniaturization","display_name":"package miniaturization","score":0.6050000190734863}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7806010842323303},{"id":"https://openalex.org/C59014099","wikidata":"https://www.wikidata.org/wiki/Q1157702","display_name":"Daisy chain","level":2,"score":0.5903300046920776},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.5726321935653687},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5626041293144226},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5302963852882385},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.49238526821136475},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4790814518928528},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4591519236564636},{"id":"https://openalex.org/C184788189","wikidata":"https://www.wikidata.org/wiki/Q130652","display_name":"Package on package","level":4,"score":0.4388425052165985},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.43832919001579285},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.42549705505371094},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4155203700065613},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.31790006160736084},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.26609107851982117},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22398698329925537},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.21802324056625366},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.15236425399780273},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.11078479886054993},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/impact.2010.5699606","doi":"https://doi.org/10.1109/impact.2010.5699606","is_oa":false,"landing_page_url":"https://doi.org/10.1109/impact.2010.5699606","pdf_url":null,"source":{"id":"https://openalex.org/S4306420016","display_name":"International Microsystems, Packaging, Assembly and Circuits Technology Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4943999946117401,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2055417107","https://openalex.org/W2089661040","https://openalex.org/W2133088268","https://openalex.org/W2137931169","https://openalex.org/W2139503719","https://openalex.org/W2148477962"],"related_works":["https://openalex.org/W2133088268","https://openalex.org/W2103948276","https://openalex.org/W2139503719","https://openalex.org/W7108221946","https://openalex.org/W2412928147","https://openalex.org/W2025756861","https://openalex.org/W2156086078","https://openalex.org/W2063636724","https://openalex.org/W2149334398","https://openalex.org/W2529782979"],"abstract_inverted_index":{"Flexible":[0],"electronic":[1,79],"system":[2,80],"package":[3,20,62,205,231,300,319],"technology":[4,70],"was":[5,193,198,209,255],"developed":[6],"to":[7,24,37,57,150,155,218,242,264],"meet":[8],"the":[9,16,19,78,157,252,266,297,326,363],"needs":[10],"of":[11,15,40,53,77,86,95,186,229,268,286],"flexible":[12,17,49,91,169,204,284,305,321],"application.":[13],"Because":[14],"characteristic,":[18],"can":[21,65,81,143,178,238],"be":[22,66,82,144,239,353,360],"attached":[23],"a":[25,31,108,117,124,304],"flat,":[26],"curve":[27],"surface":[28],"and":[29,44,101,183,188,195,202,236,276,312,333,355],"even":[30],"dynamic":[32,334],"surface.":[33],"It":[34,147],"is":[35,56,148,232,301],"important":[36],"provide":[38,184],"protection":[39],"ultra-thin":[41,60,88,96,141,161,201,298],"semiconductor":[42],"chip":[43,162,208,299],"integrate":[45],"these":[46],"chips":[47,97,142,165],"with":[48,98,112,206,307,320],"substrate.":[50],"The":[51,212,226,345],"aim":[52],"this":[54,180,230],"paper":[55],"develop":[58],"an":[59,200],"film":[61,115,192],"(UTFP)":[63],"which":[64,71,128],"bended":[67,241],"easily.":[68],"This":[69,318],"has":[72,129,289,324],"highly":[73,203],"potential":[74],"for":[75,160,223,330,337],"miniaturization":[76],"realized":[83],"by":[84],"means":[85],"embedding":[87,94],"components":[89],"into":[90,168],"materials.":[92],"Successful":[93],"18um":[99,113],"thickness":[100,228],"testing":[102,260],"results":[103,358],"are":[104],"shown.":[105],"To":[106],"use":[107],"3um":[109],"Cu":[110,126],"layer":[111,127],"carrier":[114,191],"as":[116,271],"base,":[118],"solder":[119],"balls":[120],"were":[121,166,215,262,316],"formed":[122],"on":[123,303,348],"laser-hatched":[125],"better":[130],"wettability":[131],"than":[132],"other":[133],"area":[134],"without":[135,247],"laser":[136],"hatching.":[137],"By":[138],"flip-chip":[139],"method,":[140],"directly":[145],"assembled.":[146],"necessary":[149],"do":[151],"dry":[152],"plasma":[153],"treatment":[154],"enhance":[156],"chips'":[158],"strength":[159],"manufacturing.":[163],"Subsequently,":[164],"embedded":[167,174,207],"organic":[170],"material.":[171],"With":[172],"proper":[173],"material":[175],"chose,":[176],"it":[177,237],"make":[179],"UTFP":[181,253,288],"bendable":[182],"functions":[185],"support":[187],"protection.":[189],"After":[190],"removed":[194],"metallization":[196],"process":[197,254,346],"done,":[199],"carried":[210],"out.":[211],"electrical":[213,224],"path":[214],"connected":[216,323],"together":[217],"form":[219],"daisy":[220],"chain":[221],"structure":[222],"measurement.":[225],"total":[227],"less":[233],"then":[234],"100um":[235],"easily":[240],"10mm":[243,341],"bending":[244,314,328,335,342],"curvature":[245,343],"radius":[246],"any":[248],"cracks.":[249],"Not":[250],"only":[251],"developed,":[256],"but":[257],"also":[258],"some":[259,313,356],"methods":[261],"executed":[263],"examine":[265],"reliability":[267],"package,":[269],"such":[270],"TCT":[272],"(Thermal":[273],"cycling":[274],"test)":[275],"THST":[277],"(thermal":[278],"&":[279],"humidity":[280],"storage":[281],"test).":[282],"Good":[283],"property":[285],"single":[287],"been":[290],"verified":[291],"in":[292,362],"our":[293],"previous":[294],"study.":[295],"Furthermore,":[296],"assembled":[302],"substrate":[306,322],"ACP":[308],"(Anisotropic":[309],"Conductive":[310],"Paste)":[311],"tests":[315],"performed.":[317],"passed":[325],"static":[327],"test":[329,336,357],"200":[331],"hours":[332],"1000":[338],"cycles":[339],"under":[340],"radius.":[344],"details":[347],"each":[349],"core":[350],"technique":[351],"will":[352,359],"disclosed,":[354],"presented":[361],"paper.":[364]},"counts_by_year":[{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}