{"id":"https://openalex.org/W206348236","doi":"https://doi.org/10.1007/978-0-387-76534-1_5","title":"Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies","display_name":"Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W206348236","doi":"https://doi.org/10.1007/978-0-387-76534-1_5","mag":"206348236"},"language":"en","primary_location":{"id":"doi:10.1007/978-0-387-76534-1_5","doi":"https://doi.org/10.1007/978-0-387-76534-1_5","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-0-387-76534-1_5","pdf_url":null,"source":{"id":"https://openalex.org/S4210229257","display_name":"Integrated circuits and systems","issn_l":"1558-9412","issn":["1558-9412","1558-9420"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Integrated Circuits and Systems","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W173866309","display_name":"Wafer Level 3-D ICs Process Technology"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5035619230","display_name":"Sharath Hosali","orcid":"https://orcid.org/0000-0003-4761-5857","observed_orcids":["https://orcid.org/0000-0003-4761-5857"]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Sharath Hosali","raw_affiliation_strings":["SEMATECH, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SEMATECH, Austin, TX, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103029296","display_name":"Greg Smith","orcid":"https://orcid.org/0000-0002-2551-9365","observed_orcids":["https://orcid.org/0000-0002-2551-9365"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Greg Smith","raw_affiliation_strings":["SEMATECH, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SEMATECH, Austin, TX, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110156987","display_name":"Larry D. Smith","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Larry Smith","raw_affiliation_strings":["SEMATECH, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SEMATECH, Austin, TX, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032315431","display_name":"Susan C. Vitkavage","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Susan Vitkavage","raw_affiliation_strings":["SEMATECH, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SEMATECH, Austin, TX, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5053167436","display_name":"Sitaram Arkalgud","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sitaram Arkalgud","raw_affiliation_strings":["SEMATECH, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SEMATECH, Austin, TX, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5035619230"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.9334,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.93249877,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"32"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.9150000214576721},{"id":"https://openalex.org/keywords/handle-wafer","display_name":"handle wafer","score":0.9769999980926514},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"wafer bonding","score":0.6000000238418579},{"id":"https://openalex.org/keywords/silicon-interconnects","display_name":"silicon interconnects","score":0.3869999945163727}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8910098075866699},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7353360652923584},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6282064914703369},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6175959706306458},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.5948032140731812},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.42752695083618164},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.40324991941452026},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.35663485527038574},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29057633876800537},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-0-387-76534-1_5","doi":"https://doi.org/10.1007/978-0-387-76534-1_5","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-0-387-76534-1_5","pdf_url":null,"source":{"id":"https://openalex.org/S4210229257","display_name":"Integrated circuits and systems","issn_l":"1558-9412","issn":["1558-9412","1558-9420"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Integrated Circuits and Systems","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5199999809265137}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W1564345209","https://openalex.org/W1582019369","https://openalex.org/W1596431861","https://openalex.org/W1610202792","https://openalex.org/W1670172520","https://openalex.org/W1948255855","https://openalex.org/W1985040212","https://openalex.org/W2002784171","https://openalex.org/W2017411123","https://openalex.org/W2042486368","https://openalex.org/W2045293189","https://openalex.org/W2046709975","https://openalex.org/W2066600535","https://openalex.org/W2079699561","https://openalex.org/W2100556678","https://openalex.org/W2103971070","https://openalex.org/W2111150795","https://openalex.org/W2113911387","https://openalex.org/W2120821227","https://openalex.org/W2126362014","https://openalex.org/W2143711213","https://openalex.org/W2144781237","https://openalex.org/W2157210040","https://openalex.org/W2169361733","https://openalex.org/W2171904651","https://openalex.org/W2330650364","https://openalex.org/W2544925820","https://openalex.org/W4254625992","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W193898604","https://openalex.org/W2123966895","https://openalex.org/W2604533918","https://openalex.org/W2737350259","https://openalex.org/W2569016398","https://openalex.org/W2592014933","https://openalex.org/W2575419530","https://openalex.org/W2470394033","https://openalex.org/W124571607","https://openalex.org/W2782939600"],"abstract_inverted_index":null,"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-10T09:11:00.788812","created_date":"2016-06-24T00:00:00"}