{"id":"https://openalex.org/W2061967213","doi":"https://doi.org/10.1109/ectc.2014.6897437","title":"Study of electro-migration resistivity of micro bump using SnBi solder","display_name":"Study of electro-migration resistivity of micro bump using SnBi solder","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W2061967213","doi":"https://doi.org/10.1109/ectc.2014.6897437","mag":"2061967213"},"language":"en","primary_location":{"id":"doi:10.1109/ectc.2014.6897437","doi":"https://doi.org/10.1109/ectc.2014.6897437","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc.2014.6897437","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 64th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028889202","display_name":"Kei Murayama","orcid":"https://orcid.org/0000-0002-1877-9900","observed_orcids":["https://orcid.org/0000-0002-1877-9900"]},"institutions":[{"id":"https://openalex.org/I4210119777","display_name":"Shinko Electric Industries (Japan)","ror":"https://ror.org/02pz14q94","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210119777"]},{"id":"https://openalex.org/I4405275304","display_name":"Shinko Electric Co., Ltd. (Japan)","ror":"https://ror.org/03bb99324","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275304"]},{"id":"https://openalex.org/I4405283338","display_name":"Shinko (Japan)","ror":"https://ror.org/01fkqcq84","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210093476","https://openalex.org/I4405283338"]},{"id":"https://openalex.org/I4405284468","display_name":"Shinko (Japan)","ror":"https://ror.org/03m9qx522","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405284468"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kei Murayama","raw_affiliation_strings":["Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., Japan","Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., 36, Kita Owaribe Nagano-shi, 381-0014, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., Japan","institution_ids":["https://openalex.org/I4210119777","https://openalex.org/I4405275304","https://openalex.org/I4405283338","https://openalex.org/I4405284468"]},{"raw_affiliation_string":"Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., 36, Kita Owaribe Nagano-shi, 381-0014, Japan","institution_ids":["https://openalex.org/I4210119777","https://openalex.org/I4405275304"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063180401","display_name":"Mitsuhiro Aizawa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210119777","display_name":"Shinko Electric Industries (Japan)","ror":"https://ror.org/02pz14q94","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210119777"]},{"id":"https://openalex.org/I4405275304","display_name":"Shinko Electric Co., Ltd. (Japan)","ror":"https://ror.org/03bb99324","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275304"]},{"id":"https://openalex.org/I4405283338","display_name":"Shinko (Japan)","ror":"https://ror.org/01fkqcq84","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210093476","https://openalex.org/I4405283338"]},{"id":"https://openalex.org/I4405284468","display_name":"Shinko (Japan)","ror":"https://ror.org/03m9qx522","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405284468"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Mitsuhiro Aizawa","raw_affiliation_strings":["Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., Japan","Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., 36, Kita Owaribe Nagano-shi, 381-0014, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., Japan","institution_ids":["https://openalex.org/I4210119777","https://openalex.org/I4405275304","https://openalex.org/I4405283338","https://openalex.org/I4405284468"]},{"raw_affiliation_string":"Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., 36, Kita Owaribe Nagano-shi, 381-0014, Japan","institution_ids":["https://openalex.org/I4210119777","https://openalex.org/I4405275304"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111930141","display_name":"Mitsutoshi Higashi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210119777","display_name":"Shinko Electric Industries (Japan)","ror":"https://ror.org/02pz14q94","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210119777"]},{"id":"https://openalex.org/I4405275304","display_name":"Shinko Electric Co., Ltd. (Japan)","ror":"https://ror.org/03bb99324","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275304"]},{"id":"https://openalex.org/I4405283338","display_name":"Shinko (Japan)","ror":"https://ror.org/01fkqcq84","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210093476","https://openalex.org/I4405283338"]},{"id":"https://openalex.org/I4405284468","display_name":"Shinko (Japan)","ror":"https://ror.org/03m9qx522","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405284468"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Mitsutoshi Higashi","raw_affiliation_strings":["Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., Japan","Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., 36, Kita Owaribe Nagano-shi, 381-0014, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., Japan","institution_ids":["https://openalex.org/I4210119777","https://openalex.org/I4405275304","https://openalex.org/I4405283338","https://openalex.org/I4405284468"]},{"raw_affiliation_string":"Interconnect Technology Development Dept. Research & Development Div., SHINKO ELECTRIC INDUSTRIES CO., LTD., 36, Kita Owaribe Nagano-shi, 381-0014, Japan","institution_ids":["https://openalex.org/I4210119777","https://openalex.org/I4405275304"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.0055,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.84163292,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1166","last_page":"1172"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.8370000123977661},{"id":"https://openalex.org/keywords/sn-bi-solder","display_name":"Sn-Bi solder","score":0.9269999861717224},{"id":"https://openalex.org/keywords/microbumps","display_name":"microbumps","score":0.7049999833106995},{"id":"https://openalex.org/keywords/flip-chip","display_name":"flip-chip packaging","score":0.7760000228881836},{"id":"https://openalex.org/keywords/interconnect-resistance","display_name":"interconnect resistance","score":0.7480000257492065},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.796999990940094},{"id":"https://openalex.org/keywords/current-density-distribution","display_name":"current density distribution","score":0.6299999952316284},{"id":"https://openalex.org/keywords/electromagnetic-simulation","display_name":"electromagnetic simulation","score":0.8389999866485596},{"id":"https://openalex.org/keywords/low-temperature-solder","display_name":"low-temperature solder","score":0.7300000190734863}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8412775993347168},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8390784859657288},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.6927972435951233},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.6372658014297485},{"id":"https://openalex.org/C89395315","wikidata":"https://www.wikidata.org/wiki/Q181232","display_name":"Anode","level":3,"score":0.6072449684143066},{"id":"https://openalex.org/C49110097","wikidata":"https://www.wikidata.org/wiki/Q175233","display_name":"Cathode","level":2,"score":0.5910221934318542},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5831472277641296},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5754244327545166},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4912418723106384},{"id":"https://openalex.org/C105289051","wikidata":"https://www.wikidata.org/wiki/Q1930094","display_name":"Pillar","level":2,"score":0.46159669756889343},{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.4328955113887787},{"id":"https://openalex.org/C125619702","wikidata":"https://www.wikidata.org/wiki/Q7783038","display_name":"Thermal copper pillar bump","level":5,"score":0.4307299852371216},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.38358697295188904},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.2802165150642395},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.2273394763469696},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20161405205726624},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.08521091938018799},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ectc.2014.6897437","doi":"https://doi.org/10.1109/ectc.2014.6897437","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc.2014.6897437","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 64th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1987400221","https://openalex.org/W1989683188","https://openalex.org/W2042541309","https://openalex.org/W2053709945","https://openalex.org/W2086108177","https://openalex.org/W2104387151","https://openalex.org/W2119405099","https://openalex.org/W2123833062","https://openalex.org/W2132997691","https://openalex.org/W2162740481","https://openalex.org/W2260611039","https://openalex.org/W2262563805","https://openalex.org/W2266789222","https://openalex.org/W2325450027","https://openalex.org/W6692772016","https://openalex.org/W6693492442"],"related_works":["https://openalex.org/W2094766339","https://openalex.org/W2266789222","https://openalex.org/W3190457114","https://openalex.org/W2086108177","https://openalex.org/W2325450027","https://openalex.org/W274860733","https://openalex.org/W2886491886","https://openalex.org/W2012248822","https://openalex.org/W1974316702","https://openalex.org/W2743504598"],"abstract_inverted_index":{"There":[0,115],"has":[1,14,32],"been":[2,15,33],"a":[3,46],"great":[4],"discussion":[5],"about":[6,112],"electro-migration":[7,19,38,54],"behavior":[8,20,39],"in":[9,139],"semiconductor":[10],"area.":[11],"And":[12,101],"it":[13,122,172,189],"often":[16],"discussed":[17],"that":[18,196,213],"of":[21,40,56,77,127,142,148,201,214,232],"the":[22,37,75,87,96,136,140,197,202,229],"flip":[23],"chip":[24],"package":[25],"using":[26,71,221],"Sn-Ag":[27],"bump.":[28],"However,":[29],"little":[30],"study":[31],"done":[34],"to":[35,95,153],"explore":[36],"low":[41],"temperature":[42],"solder":[43,224],"such":[44],"as":[45],"Sn-Bi":[47],"solder.":[48,73],"In":[49,74],"this":[50],"report,":[51],"we":[52],"investigated":[53],"behaviors":[55],"micro":[57,66,78,145,205,219],"pillar":[58,79],"bump":[59,67,206,220],"(100":[60],"\u03bcm":[61,69],"diameter)":[62,70],"and":[63,84,92,121,181],"fine":[64,143,203],"pitch":[65,144,204,218],"(25":[68],"Sn57wt%Bi":[72],"case":[76,141],"bump,":[80,146],"Bi":[81,223],"quickly":[82,105],"migrated":[83,94],"accumulated":[85],"on":[86],"anode":[88],"side":[89,98],"(Cu":[90],"pillar)":[91],"Sn":[93,149],"cathode":[97],"(substrate":[99],"pad).":[100],"interconnect":[102],"resistance":[103,129,165],"was":[104,116,123,167],"increased":[106],"80":[107],"%":[108],"from":[109,192],"initial":[110,128],"during":[111],"150":[113],"hours.":[114,134],"no":[117,184],"electrically":[118,185],"break":[119,186],"failure":[120],"stabilized":[124,174],"at":[125],"80%":[126],"for":[130,176,228],"more":[131,177],"than":[132,169,178,209],"2800":[133],"On":[135],"other":[137],"hand,":[138],"almost":[147],"atoms":[150],"were":[151,183],"consumed":[152],"form":[154],"Cu-Sn":[155],"or":[156],"Ni-Sn":[157],"intermetallic":[158],"compounds":[159],"(IMCs)":[160],"after":[161],"bonding":[162,230],"process.":[163],"The":[164],"increase":[166],"less":[168,208],"9":[170],"%,":[171],"is":[173,190,225],"even":[175],"2200":[179],"hours":[180],"there":[182],"failure.":[187],"Additionally,":[188],"evident":[191],"electromagnetic":[193],"field":[194],"simulation":[195],"maximum":[198],"current":[199],"density":[200],"are":[207],"half":[210],"compared":[211],"with":[212],"Cu-pillar":[215],"bumps.":[216],"Fine":[217],"Sn57":[222],"promising":[226],"candidates":[227],"technology":[231],"high":[233],"performance":[234],"packages.":[235]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2016-06-24T00:00:00"}