{"id":"https://openalex.org/W2058715701","doi":"https://doi.org/10.1109/estc.2012.6542067","title":"Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique","display_name":"Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique","publication_year":2012,"publication_date":"2012-09-01","ids":{"openalex":"https://openalex.org/W2058715701","doi":"https://doi.org/10.1109/estc.2012.6542067","mag":"2058715701"},"language":"en","primary_location":{"id":"doi:10.1109/estc.2012.6542067","doi":"https://doi.org/10.1109/estc.2012.6542067","is_oa":false,"landing_page_url":"https://doi.org/10.1109/estc.2012.6542067","pdf_url":null,"source":{"id":"https://openalex.org/S4306497785","display_name":"Electronic System-Integration Technology Conference (ESTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 4th Electronic System-Integration Technology Conference","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://orbi.uliege.be/handle/2268/170682","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070055225","display_name":"Serguei Stoukatch","orcid":"https://orcid.org/0000-0002-5060-4086","observed_orcids":["https://orcid.org/0000-0002-5060-4086"]},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"S. Stoukatch","raw_affiliation_strings":["EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","institution_ids":["https://openalex.org/I157674565"]},{"raw_affiliation_string":"EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"middle","author":{"id":null,"display_name":"P. Laurent","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"P. Laurent","raw_affiliation_strings":["EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","institution_ids":["https://openalex.org/I157674565"]},{"raw_affiliation_string":"EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035906940","display_name":"Samuel Dricot","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"S. Dricot","raw_affiliation_strings":["EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","institution_ids":["https://openalex.org/I157674565"]},{"raw_affiliation_string":"EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070967127","display_name":"Fabrice Axisa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"F. Axisa","raw_affiliation_strings":["EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","institution_ids":["https://openalex.org/I157674565"]},{"raw_affiliation_string":"EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045927844","display_name":"Laurent Seronveaux","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I91993116","display_name":"Sirris","ror":"https://ror.org/01qr26m26","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I91993116"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"L. Seronveaux","raw_affiliation_strings":["SIRRIS, Collective Centre, Belgium Technology Industry, Belgium","SIRRIS, Collective Centre of the Belgium Technology Industry, 4102, Liege Science park, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SIRRIS, Collective Centre, Belgium Technology Industry, Belgium","institution_ids":["https://openalex.org/I91993116"]},{"raw_affiliation_string":"SIRRIS, Collective Centre of the Belgium Technology Industry, 4102, Liege Science park, Belgium","institution_ids":["https://openalex.org/I91993116"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041321693","display_name":"Denis Vandormael","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I91993116","display_name":"Sirris","ror":"https://ror.org/01qr26m26","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I91993116"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"D. Vandormael","raw_affiliation_strings":["SIRRIS, Collective Centre, Belgium Technology Industry, Belgium","SIRRIS, Collective Centre of the Belgium Technology Industry, 4102, Liege Science park, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SIRRIS, Collective Centre, Belgium Technology Industry, Belgium","institution_ids":["https://openalex.org/I91993116"]},{"raw_affiliation_string":"SIRRIS, Collective Centre of the Belgium Technology Industry, 4102, Liege Science park, Belgium","institution_ids":["https://openalex.org/I91993116"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090771867","display_name":"E. Beeckman","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I91993116","display_name":"Sirris","ror":"https://ror.org/01qr26m26","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I91993116"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"E. Beeckman","raw_affiliation_strings":["SIRRIS, Collective Centre, Belgium Technology Industry, Belgium","SIRRIS, Collective Centre of the Belgium Technology Industry, 4102, Liege Science park, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SIRRIS, Collective Centre, Belgium Technology Industry, Belgium","institution_ids":["https://openalex.org/I91993116"]},{"raw_affiliation_string":"SIRRIS, Collective Centre of the Belgium Technology Industry, 4102, Liege Science park, Belgium","institution_ids":["https://openalex.org/I91993116"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081989219","display_name":"Bruno Heusdens","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"B. Heusdens","raw_affiliation_strings":["TAIPRO Engineering, Seraing, Belgium","TAIPRO Engineering, Rue du Bois Saint Jean, 15/17, 4102 Seraing, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TAIPRO Engineering, Seraing, Belgium","institution_ids":[]},{"raw_affiliation_string":"TAIPRO Engineering, Rue du Bois Saint Jean, 15/17, 4102 Seraing, Belgium","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029907264","display_name":"Jacques Destin\u00e9","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"J. Destine","raw_affiliation_strings":["EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EMMI, Microsys, University of Li\u00e8ge, Liege, Belgium","institution_ids":["https://openalex.org/I157674565"]},{"raw_affiliation_string":"EMMI/Microsys, University of Li\u00e8ge, 4000 Li\u00e8ge, Belgium","institution_ids":["https://openalex.org/I157674565"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2188,"has_fulltext":false,"cited_by_count":44,"citation_normalized_percentile":{"value":0.76541184,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6884999871253967,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6884999871253967,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.3061999976634979,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.003000000026077032,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/aerosol-jet-printing","display_name":"aerosol jet printing","score":0.9990000128746033},{"id":"https://openalex.org/keywords/silver-ink","display_name":"silver ink","score":0.6060000061988831},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.703000009059906},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"wire bonding","score":0.7459999918937683},{"id":"https://openalex.org/keywords/gold-wire-bonding","display_name":"gold wire bonding","score":0.6850000023841858},{"id":"https://openalex.org/keywords/aluminum-wire-bonding","display_name":"aluminum wire bonding","score":0.9539999961853027},{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"surface mount technology","score":0.9300000071525574},{"id":"https://openalex.org/keywords/organic-substrates","display_name":"organic substrates","score":0.7940000295639038},{"id":"https://openalex.org/keywords/conductive-tracks","display_name":"conductive tracks","score":0.5860000252723694},{"id":"https://openalex.org/keywords/electrical-characterization","display_name":"electrical characterization","score":0.6869999766349792},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"printed electronics","score":0.8309999704360962}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.788814902305603},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.571721076965332},{"id":"https://openalex.org/C119947313","wikidata":"https://www.wikidata.org/wiki/Q5596635","display_name":"Jet (fluid)","level":2,"score":0.5646485090255737},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.4944572448730469},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4784831404685974},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.4100790023803711},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3727225661277771},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.33405566215515137},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.31795135140419006},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3059889078140259},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2712143659591675},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.263388991355896},{"id":"https://openalex.org/C28490314","wikidata":"https://www.wikidata.org/wiki/Q189436","display_name":"Speech recognition","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/estc.2012.6542067","doi":"https://doi.org/10.1109/estc.2012.6542067","is_oa":false,"landing_page_url":"https://doi.org/10.1109/estc.2012.6542067","pdf_url":null,"source":{"id":"https://openalex.org/S4306497785","display_name":"Electronic System-Integration Technology Conference (ESTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 4th Electronic System-Integration Technology Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:orbi.ulg.ac.be:2268/170682","doi":null,"is_oa":true,"landing_page_url":"https://orbi.uliege.be/handle/2268/170682","pdf_url":null,"source":{"id":"https://openalex.org/S4306400651","display_name":"Open Repository and Bibliography (University of Li\u00e8ge)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I157674565","host_organization_name":"University of Li\u00e8ge","host_organization_lineage":["https://openalex.org/I157674565"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Proc. The 4th Electronics System Integration Technology Conferences (ESTC 2012), Amsterdam, Netherlands [NL], Sept 17-20, 2012","raw_type":"info:eu-repo/semantics/conferencePaper"}],"best_oa_location":{"id":"pmh:oai:orbi.ulg.ac.be:2268/170682","doi":null,"is_oa":true,"landing_page_url":"https://orbi.uliege.be/handle/2268/170682","pdf_url":null,"source":{"id":"https://openalex.org/S4306400651","display_name":"Open Repository and Bibliography (University of Li\u00e8ge)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I157674565","host_organization_name":"University of Li\u00e8ge","host_organization_lineage":["https://openalex.org/I157674565"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Proc. The 4th Electronics System Integration Technology Conferences (ESTC 2012), Amsterdam, Netherlands [NL], Sept 17-20, 2012","raw_type":"info:eu-repo/semantics/conferencePaper"},"sustainable_development_goals":[{"score":0.6773999929428101,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320318621","display_name":"Waalse Gewest","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W45047440","https://openalex.org/W2114977151","https://openalex.org/W2188604152","https://openalex.org/W2525507652","https://openalex.org/W4235625050"],"related_works":["https://openalex.org/W2808096482","https://openalex.org/W4407640723","https://openalex.org/W2280842037","https://openalex.org/W2220604597","https://openalex.org/W2520600493","https://openalex.org/W2059608626","https://openalex.org/W3088531546","https://openalex.org/W3048820680","https://openalex.org/W4390966037","https://openalex.org/W4400998989"],"abstract_inverted_index":{"We":[0,45,57,66],"evaluated":[1,47],"suitability":[2,48],"of":[3,13,49,61,73],"AJP":[4,31,50,63,80],"(Aerosol":[5],"Jet":[6],"Printing)":[7],"deposited":[8],"silver":[9,32,51,64,81],"layer":[10,33,52],"on":[11],"variety":[12],"organic":[14],"substrates":[15],"for":[16,23,53],"the":[17,30,62],"most":[18],"common":[19],"interconnect":[20],"techniques":[21],"used":[22],"electronic":[24],"packaging.":[25],"Specifically,":[26],"we":[27],"checked":[28],"if":[29],"can":[34],"be":[35],"electrically":[36],"interconnected":[37],"by":[38],"Au":[39],"and":[40],"Al":[41],"wires":[42],"bonding":[43],"technique.":[44],"also":[46],"surface-mount":[54],"technology":[55],"(SMT).":[56],"performed":[58],"electrical":[59,86],"characterization":[60],"layer.":[65],"realized":[67],"a":[68],"fully":[69],"functional":[70],"working":[71],"prototype":[72],"Autonomous":[74],"Wireless":[75],"Sensor":[76],"Node":[77],"system":[78],"using":[79],"conductive":[82],"track":[83],"as":[84],"an":[85],"interconnection.":[87]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":7},{"year":2019,"cited_by_count":7},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":3}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}