{"id":"https://openalex.org/W2056084864","doi":"https://doi.org/10.4028/www.scientific.net/kem.326-328.357","title":"Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties","display_name":"Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties","publication_year":2006,"publication_date":"2006-12-01","ids":{"openalex":"https://openalex.org/W2056084864","doi":"https://doi.org/10.4028/www.scientific.net/kem.326-328.357","mag":"2056084864"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/kem.326-328.357","doi":"https://doi.org/10.4028/www.scientific.net/kem.326-328.357","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.326-328.357","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"parent_works":[],"lineage":["https://openalex.org/W2056084864"],"child_works_count":0,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113650409","display_name":"Rwei-Ching Chang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I142823887","display_name":"St. John's University","ror":"https://ror.org/00bgtad15","country_code":"US","type":"education","lineage":["https://openalex.org/I142823887"]},{"id":"https://openalex.org/I4210097625","display_name":"St. John's University","ror":"https://ror.org/00wyq5s37","country_code":"TW","type":"education","lineage":["https://openalex.org/I4210097625"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Rwei Ching Chang","raw_affiliation_strings":["St. John\u2019s University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"St. John\u2019s University","institution_ids":["https://openalex.org/I142823887","https://openalex.org/I4210097625"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035896161","display_name":"Feng Yuan Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405258395","display_name":"LeeMing Institute of Technology","ror":"https://ror.org/00k2r9g11","country_code":"TW","type":"education","lineage":["https://openalex.org/I4405258395"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Feng Yuan Chen","raw_affiliation_strings":["Lee-Ming Istitute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lee-Ming Istitute of Technology","institution_ids":["https://openalex.org/I4405258395"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5050489912","display_name":"Chang En Sun","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I142823887","display_name":"St. John's University","ror":"https://ror.org/00bgtad15","country_code":"US","type":"education","lineage":["https://openalex.org/I142823887"]},{"id":"https://openalex.org/I4210097625","display_name":"St. John's University","ror":"https://ror.org/00wyq5s37","country_code":"TW","type":"education","lineage":["https://openalex.org/I4210097625"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Chang En Sun","raw_affiliation_strings":["St. John's University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"St. John's University","institution_ids":["https://openalex.org/I142823887","https://openalex.org/I4210097625"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"326-328","issue":null,"first_page":"357","last_page":"360"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper-thin-films","display_name":"copper thin films","score":0.9869999885559082},{"id":"https://openalex.org/keywords/mechanical-properties-of-thin-films","display_name":"mechanical properties of thin films","score":0.7770000100135803},{"id":"https://openalex.org/keywords/young-s-modulus","display_name":"Young's modulus","score":0.8569999933242798},{"id":"https://openalex.org/keywords/hardness","display_name":"hardness","score":0.9950000047683716},{"id":"https://openalex.org/keywords/nanoscratching","display_name":"nanoscratching","score":0.7350000143051147},{"id":"https://openalex.org/keywords/friction-factor","display_name":"friction factor","score":0.843999981880188},{"id":"https://openalex.org/keywords/film-thickness-dependence","display_name":"film thickness dependence","score":0.8709999918937683},{"id":"https://openalex.org/keywords/substrate-effects","display_name":"substrate effects","score":0.7440000176429749},{"id":"https://openalex.org/keywords/evaporation-deposition","display_name":"evaporation deposition","score":0.703000009059906},{"id":"https://openalex.org/keywords/silicon-substrate","display_name":"silicon substrate","score":0.5109999775886536}],"concepts":[{"id":"https://openalex.org/C49326732","wikidata":"https://www.wikidata.org/wiki/Q1549892","display_name":"Nanoindentation","level":2,"score":0.9401236176490784},{"id":"https://openalex.org/C2780569836","wikidata":"https://www.wikidata.org/wiki/Q1306226","display_name":"Nanoindenter","level":3,"score":0.9130113124847412},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.842825174331665},{"id":"https://openalex.org/C2780902562","wikidata":"https://www.wikidata.org/wiki/Q1154141","display_name":"Indentation","level":2,"score":0.7185376882553101},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6697123646736145},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.66704261302948},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.619388997554779},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.5393450260162354},{"id":"https://openalex.org/C2781235140","wikidata":"https://www.wikidata.org/wiki/Q275131","display_name":"Scratch","level":2,"score":0.5219530463218689},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4834216833114624},{"id":"https://openalex.org/C167310744","wikidata":"https://www.wikidata.org/wiki/Q193870","display_name":"Tribology","level":2,"score":0.48045557737350464},{"id":"https://openalex.org/C61441594","wikidata":"https://www.wikidata.org/wiki/Q132814","display_name":"Evaporation","level":2,"score":0.41134917736053467},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1887493133544922},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/kem.326-328.357","doi":"https://doi.org/10.4028/www.scientific.net/kem.326-328.357","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.326-328.357","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1546762838","https://openalex.org/W1973013664","https://openalex.org/W2079508597","https://openalex.org/W2081233584","https://openalex.org/W2086933933","https://openalex.org/W2089053378","https://openalex.org/W2130958463","https://openalex.org/W2147266005"],"related_works":["https://openalex.org/W2042024172","https://openalex.org/W2908674449","https://openalex.org/W2327931992","https://openalex.org/W2947367822","https://openalex.org/W4376138858","https://openalex.org/W2335614155","https://openalex.org/W2185695810","https://openalex.org/W986941941","https://openalex.org/W1987390206","https://openalex.org/W2133021280"],"abstract_inverted_index":{"This":[0],"work":[1],"uses":[2],"nanoindentation":[3],"and":[4,48,55,70,100,128],"nanoscratch":[5,114],"to":[6,77,85,93],"measure":[7],"the":[8,28,62,71,79,88,97,101,105,108,113,118,124,141,148,152],"mechanical":[9,40,149],"properties":[10,41,150],"of":[11,107,151],"evaporation":[12],"copper":[13,63],"thin":[14,17,64,109,153],"films.":[15,154],"The":[16,39,57,138],"film":[18,65,110,131],"is":[19,66],"deposited":[20],"on":[21,147],"a":[22,35,129,134,144],"silicon":[23],"wafer":[24],"substrate":[25,142],"by":[26,34,45,53],"using":[27],"physical":[29],"vapor":[30],"deposition":[31],"method":[32],"provided":[33],"resistive":[36],"heating":[37],"evaporator.":[38],"are":[42],"then":[43],"determined":[44],"indentation":[46,72],"test":[47,51],"lateral":[49],"force":[50],"produced":[52],"nanoindenter":[54],"nanoscratch.":[56],"results":[58,115,139],"show":[59,116],"that,":[60],"as":[61,104,123],"500nm":[67],"in":[68],"thickness":[69,106,132],"depth":[73,126],"increases":[74,82,90,122],"from":[75,83,91],"100nm":[76],"400nm,":[78],"Young\u2019s":[80,98],"modulus":[81,99],"151GPa":[84],"160GPa":[86],"while":[87],"hardness":[89,102],"2.8GPa":[92],"3.5GPa.":[94],"Moreover,":[95],"both":[96],"decrease":[103],"increases.":[111],"Besides,":[112],"that":[117],"friction":[119,136],"factor":[120],"also":[121],"scratch":[125],"increases,":[127],"thinner":[130],"makes":[133],"larger":[135],"factor.":[137],"represent":[140],"has":[143],"significant":[145],"effect":[146]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}