{"id":"https://openalex.org/W2053326656","doi":"https://doi.org/10.1117/12.896886","title":"NGL masks: development status and issue","display_name":"NGL masks: development status and issue","publication_year":2011,"publication_date":"2011-02-02","ids":{"openalex":"https://openalex.org/W2053326656","doi":"https://doi.org/10.1117/12.896886","mag":"2053326656"},"language":"en","primary_location":{"id":"doi:10.1117/12.896886","doi":"https://doi.org/10.1117/12.896886","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.896886","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5077380899","display_name":"Naoya Hayashi","orcid":"https://orcid.org/0009-0007-7748-0494","observed_orcids":["https://orcid.org/0009-0007-7748-0494"]},"institutions":[{"id":"https://openalex.org/I126913320","display_name":"Dai Nippon Printing (Japan)","ror":"https://ror.org/01be2k939","country_code":"JP","type":"company","lineage":["https://openalex.org/I126913320"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Naoya Hayashi","raw_affiliation_strings":["Dai Nippon Printing Co., Ltd. (Japan)","Dai Nippon Printing Co., Ltd., Japan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd. (Japan)","institution_ids":["https://openalex.org/I126913320"]},{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd., Japan#TAB#","institution_ids":["https://openalex.org/I126913320"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072517591","display_name":"Tsukasa Abe","orcid":"https://orcid.org/0000-0002-2400-3797","observed_orcids":["https://orcid.org/0000-0002-2400-3797"]},"institutions":[{"id":"https://openalex.org/I126913320","display_name":"Dai Nippon Printing (Japan)","ror":"https://ror.org/01be2k939","country_code":"JP","type":"company","lineage":["https://openalex.org/I126913320"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tsukasa Abe","raw_affiliation_strings":["Dai Nippon Printing Co., Ltd. (Japan)","Dai Nippon Printing Co., Ltd., Japan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd. (Japan)","institution_ids":["https://openalex.org/I126913320"]},{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd., Japan#TAB#","institution_ids":["https://openalex.org/I126913320"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Takeya Shimomura","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Takeya Shimomura","raw_affiliation_strings":["DNP Corp. USA (United States)","DNP Corp. USA (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DNP Corp. USA (United States)","institution_ids":[]},{"raw_affiliation_string":"DNP Corp. USA (USA)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113542209","display_name":"Yuichi Inazuki","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I126913320","display_name":"Dai Nippon Printing (Japan)","ror":"https://ror.org/01be2k939","country_code":"JP","type":"company","lineage":["https://openalex.org/I126913320"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuichi Inazuki","raw_affiliation_strings":["Dai Nippon Printing Co., Ltd. (Japan)","Dai Nippon Printing Co., Ltd., Japan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd. (Japan)","institution_ids":["https://openalex.org/I126913320"]},{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd., Japan#TAB#","institution_ids":["https://openalex.org/I126913320"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013395160","display_name":"Tadahiko Takikawa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I126913320","display_name":"Dai Nippon Printing (Japan)","ror":"https://ror.org/01be2k939","country_code":"JP","type":"company","lineage":["https://openalex.org/I126913320"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tadahiko Takikawa","raw_affiliation_strings":["Dai Nippon Printing Co., Ltd. (Japan)","Dai Nippon Printing Co., Ltd., Japan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd. (Japan)","institution_ids":["https://openalex.org/I126913320"]},{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd., Japan#TAB#","institution_ids":["https://openalex.org/I126913320"]}]},{"author_position":"last","author":{"id":null,"display_name":"Hiroshi Mohri","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I126913320","display_name":"Dai Nippon Printing (Japan)","ror":"https://ror.org/01be2k939","country_code":"JP","type":"company","lineage":["https://openalex.org/I126913320"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroshi Mohri","raw_affiliation_strings":["Dai Nippon Printing Co., Ltd. (Japan)","Dai Nippon Printing Co., Ltd., Japan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd. (Japan)","institution_ids":["https://openalex.org/I126913320"]},{"raw_affiliation_string":"Dai Nippon Printing Co., Ltd., Japan#TAB#","institution_ids":["https://openalex.org/I126913320"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4244,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.52655671,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"7985","issue":null,"first_page":"798505","last_page":"798505"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11183","display_name":"Advanced X-ray Imaging Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3108","display_name":"Radiation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/euv-lithography-masks","display_name":"EUV lithography masks","score":0.7310000061988831},{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.7519999742507935},{"id":"https://openalex.org/keywords/193-nm-lithography","display_name":"193 nm lithography","score":0.7390000224113464},{"id":"https://openalex.org/keywords/nanoimprint-lithography","display_name":"nanoimprint lithography","score":0.8659999966621399},{"id":"https://openalex.org/keywords/maskless-lithography","display_name":"maskless lithography","score":0.6010000109672546},{"id":"https://openalex.org/keywords/high-volume-manufacturing","display_name":"high-volume manufacturing","score":0.8019999861717224}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9269384741783142},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6905195713043213},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6599034070968628},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.5465084314346313},{"id":"https://openalex.org/C136197465","wikidata":"https://www.wikidata.org/wiki/Q1729295","display_name":"Variety (cybernetics)","level":2,"score":0.5374038815498352},{"id":"https://openalex.org/C2777601897","wikidata":"https://www.wikidata.org/wiki/Q3409113","display_name":"Presentation (obstetrics)","level":2,"score":0.512495756149292},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.49078163504600525},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.4875895380973816},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.461041659116745},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.3989240527153015},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.24444067478179932},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24419504404067993},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.20251959562301636},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.11608204245567322},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09433102607727051},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C126838900","wikidata":"https://www.wikidata.org/wiki/Q77604","display_name":"Radiology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.896886","doi":"https://doi.org/10.1117/12.896886","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.896886","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2037053396","https://openalex.org/W2095466418","https://openalex.org/W3214572977","https://openalex.org/W1971610143","https://openalex.org/W2057756730","https://openalex.org/W4392124641","https://openalex.org/W3183795730","https://openalex.org/W7214121162","https://openalex.org/W2004510539","https://openalex.org/W2766076200"],"abstract_inverted_index":{"Semiconductor":[0],"lithography":[1],"candidates":[2],"toward":[3],"2xnm":[4],"node":[5],"and":[6,20,45],"beyond":[7],"include":[8],"wide":[9],"variety":[10],"of":[11,16,23],"options,":[12],"such":[13],"as":[14],"extension":[15],"193i,":[17],"EUVL,":[18],"NIL,":[19],"ML2.":[21],"Most":[22],"those":[24],"candidates,":[25],"except":[26],"ML2,":[27],"need":[28],"critical":[29],"mask":[30,42],"feature":[31],"to":[32],"realize":[33],"effective":[34],"high":[35],"volume":[36],"manufacturing.":[37],"In":[38],"this":[39],"presentation,":[40],"EUVL":[41],"technology":[43],"update":[44],"future":[46],"issues":[47],"will":[48],"be":[49],"presented.":[50]},"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}