{"id":"https://openalex.org/W2051533014","doi":"https://doi.org/10.1016/0925-9635(94)90128-7","title":"An innovative semiconductor base\u2014 diamond/(carbon-carbon) composite","display_name":"An innovative semiconductor base\u2014 diamond/(carbon-carbon) composite","publication_year":1994,"publication_date":"1994-10-01","ids":{"openalex":"https://openalex.org/W2051533014","doi":"https://doi.org/10.1016/0925-9635(94)90128-7","mag":"2051533014"},"language":"en","primary_location":{"id":"doi:10.1016/0925-9635(94)90128-7","doi":"https://doi.org/10.1016/0925-9635(94)90128-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/0925-9635(94)90128-7","pdf_url":null,"source":{"id":"https://openalex.org/S124577123","display_name":"Diamond and Related Materials","issn_l":"0925-9635","issn":["0925-9635","1879-0062"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Diamond and Related Materials","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016432370","display_name":"Jyh\u2010Ming Ting","orcid":"https://orcid.org/0000-0002-9155-7706","observed_orcids":["https://orcid.org/0000-0002-9155-7706","https://orcid.org/0000-0001-9057-0741"]},"institutions":[{"id":"https://openalex.org/I4210161331","display_name":"Applied Sciences (United States)","ror":"https://ror.org/04zd6dy90","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161331"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jyh-Ming Ting","raw_affiliation_strings":["Applied Sciences, Inc., PO Box 579, Cedarville, OH 45314 USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Applied Sciences, Inc., PO Box 579, Cedarville, OH 45314 USA","institution_ids":["https://openalex.org/I4210161331"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5015955076","display_name":"Max L. Lake","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210161331","display_name":"Applied Sciences (United States)","ror":"https://ror.org/04zd6dy90","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161331"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Max L. Lake","raw_affiliation_strings":["Applied Sciences, Inc., PO Box 579, Cedarville, OH 45314 USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Applied Sciences, Inc., PO Box 579, Cedarville, OH 45314 USA","institution_ids":["https://openalex.org/I4210161331"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210161331"],"apc_list":{"value":2690,"currency":"USD","value_usd":2690},"apc_paid":null,"fwci":0.6755,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.66271209,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"3","issue":"10","first_page":"1243","last_page":"1248"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10478","display_name":"Diamond and Carbon-based Materials Research","score":0.9775000214576721,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10478","display_name":"Diamond and Carbon-based Materials Research","score":0.9775000214576721,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.012199999764561653,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.0012000000569969416,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/diamond-films","display_name":"diamond films","score":0.847000002861023},{"id":"https://openalex.org/keywords/carbon-carbon-composites","display_name":"carbon/carbon composites","score":0.8600000143051147},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.8009999990463257},{"id":"https://openalex.org/keywords/galvanic-isolation","display_name":"galvanic isolation","score":0.781000018119812},{"id":"https://openalex.org/keywords/surface-metallization","display_name":"surface metallization","score":0.7549999952316284},{"id":"https://openalex.org/keywords/metal-adhesion","display_name":"metal adhesion","score":0.722000002861023},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.9440000057220459},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.5609999895095825}],"concepts":[{"id":"https://openalex.org/C140205800","wikidata":"https://www.wikidata.org/wiki/Q5860","display_name":"Carbon fibers","level":3,"score":0.713929295539856},{"id":"https://openalex.org/C2776921476","wikidata":"https://www.wikidata.org/wiki/Q5283","display_name":"Diamond","level":2,"score":0.7046256065368652},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.6388636827468872},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.6279654502868652},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.5737595558166504},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5186483263969421},{"id":"https://openalex.org/C123380192","wikidata":"https://www.wikidata.org/wiki/Q4389419","display_name":"Diamond-like carbon","level":3,"score":0.45573386549949646},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.43979620933532715},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3787303566932678},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2526834011077881},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12926578521728516},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.09909829497337341},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.07161101698875427}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/0925-9635(94)90128-7","doi":"https://doi.org/10.1016/0925-9635(94)90128-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/0925-9635(94)90128-7","pdf_url":null,"source":{"id":"https://openalex.org/S124577123","display_name":"Diamond and Related Materials","issn_l":"0925-9635","issn":["0925-9635","1879-0062"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Diamond and Related Materials","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1980187655","https://openalex.org/W2026296921","https://openalex.org/W2075911864","https://openalex.org/W2080096062","https://openalex.org/W2130489782","https://openalex.org/W2132597039","https://openalex.org/W2133370799"],"related_works":["https://openalex.org/W1489709671","https://openalex.org/W2050214238","https://openalex.org/W3080823829","https://openalex.org/W1980187655","https://openalex.org/W2793826791","https://openalex.org/W2389621833","https://openalex.org/W4407491011","https://openalex.org/W4384564359","https://openalex.org/W4220688355","https://openalex.org/W2036680871"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2016-06-24T00:00:00"}