{"id":"https://openalex.org/W2048835472","doi":"https://doi.org/10.1109/isse.2011.6053581","title":"Studies of surface mount technology and its risk analysis","display_name":"Studies of surface mount technology and its risk analysis","publication_year":2011,"publication_date":"2011-05-01","ids":{"openalex":"https://openalex.org/W2048835472","doi":"https://doi.org/10.1109/isse.2011.6053581","mag":"2048835472"},"language":"en","primary_location":{"id":"doi:10.1109/isse.2011.6053581","doi":"https://doi.org/10.1109/isse.2011.6053581","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isse.2011.6053581","pdf_url":null,"source":{"id":"https://openalex.org/S4306420071","display_name":"International Spring Seminar on Electronics Technology","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108500586","display_name":"Jan Jirsa","orcid":"https://orcid.org/0000-0001-7574-8046","observed_orcids":["https://orcid.org/0000-0001-7574-8046"]},"institutions":[{"id":"https://openalex.org/I44504214","display_name":"Czech Technical University in Prague","ror":"https://ror.org/03kqpb082","country_code":"CZ","type":"education","lineage":["https://openalex.org/I44504214"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"Jan Jirsa","raw_affiliation_strings":["Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague, Czech Republic","Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Technick\u00e1 2, Prague 6, 166 27, Czech Republic"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague, Czech Republic","institution_ids":["https://openalex.org/I44504214"]},{"raw_affiliation_string":"Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Technick\u00e1 2, Prague 6, 166 27, Czech Republic","institution_ids":["https://openalex.org/I44504214"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057988431","display_name":"Karel Du\u0161ek","orcid":"https://orcid.org/0000-0003-0552-3241","observed_orcids":["https://orcid.org/0000-0003-0552-3241"]},"institutions":[{"id":"https://openalex.org/I44504214","display_name":"Czech Technical University in Prague","ror":"https://ror.org/03kqpb082","country_code":"CZ","type":"education","lineage":["https://openalex.org/I44504214"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"Karel Dusek","raw_affiliation_strings":["Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague, Czech Republic","Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Technick\u00e1 2, Prague 6, 166 27, Czech Republic"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague, Czech Republic","institution_ids":["https://openalex.org/I44504214"]},{"raw_affiliation_string":"Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Technick\u00e1 2, Prague 6, 166 27, Czech Republic","institution_ids":["https://openalex.org/I44504214"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I44504214"],"apc_list":null,"apc_paid":null,"fwci":0.4237,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.46083656,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"216","last_page":"219"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9487000107765198,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9487000107765198,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.018699999898672104,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.011099999770522118,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"surface mount technology","score":1.0},{"id":"https://openalex.org/keywords/risk-analysis","display_name":"risk analysis","score":0.847000002861023},{"id":"https://openalex.org/keywords/electronics-assembly","display_name":"electronics assembly","score":0.9919999837875366},{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.9829999804496765},{"id":"https://openalex.org/keywords/production-problems","display_name":"production problems","score":0.6940000057220459},{"id":"https://openalex.org/keywords/quality-management","display_name":"quality management","score":0.6800000071525574},{"id":"https://openalex.org/keywords/hazard-identification","display_name":"hazard identification","score":0.48500001430511475}],"concepts":[{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.8624367713928223},{"id":"https://openalex.org/C2778091609","wikidata":"https://www.wikidata.org/wiki/Q14713","display_name":"Mount","level":2,"score":0.7698161602020264},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7168099880218506},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.7074103951454163},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.5129391551017761},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4840928316116333},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.47878873348236084},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.4292258620262146},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4212886095046997},{"id":"https://openalex.org/C112930515","wikidata":"https://www.wikidata.org/wiki/Q4389547","display_name":"Risk analysis (engineering)","level":1,"score":0.41888168454170227},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.35292714834213257},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.32628530263900757},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24710455536842346},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.24094408750534058},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.08181306719779968},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isse.2011.6053581","doi":"https://doi.org/10.1109/isse.2011.6053581","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isse.2011.6053581","pdf_url":null,"source":{"id":"https://openalex.org/S4306420071","display_name":"International Spring Seminar on Electronics Technology","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2364623135","https://openalex.org/W2063908777","https://openalex.org/W2370943206","https://openalex.org/W2351690489","https://openalex.org/W2013244299","https://openalex.org/W4245599653","https://openalex.org/W2510794228","https://openalex.org/W4252176047","https://openalex.org/W2386123301","https://openalex.org/W2377486151"],"abstract_inverted_index":{"Surface":[0],"mount":[1,35,93],"technology":[2,6,36,94],"is":[3,11,55,66],"commonly":[4],"used":[5],"in":[7,37,68,90],"electronics":[8,38,99],"assembly.":[9,39],"It":[10],"a":[12,73],"method":[13],"where":[14],"the":[15,21,48,77,91,96,104,108,117],"components":[16],"are":[17],"mounted":[18],"directly":[19],"onto":[20],"surface":[22,34,92],"of":[23,33,45,59,98],"printed":[24],"circuit":[25],"board.":[26],"This":[27],"article":[28,81],"deals":[29],"with":[30,47],"risk":[31],"analysis":[32,41,46],"Risk":[40,65],"applies":[42],"many":[43],"methods":[44],"focus":[49],"on":[50,76,107],"potential":[51],"hazards.":[52],"Its":[53],"aim":[54],"to":[56,84,113],"improve":[57,62],"understanding":[58],"process":[60],"and":[61,101],"managing":[63],"it.":[64],"acceptable":[67],"case":[69],"that":[70],"it":[71],"has":[72],"low":[74],"impact":[75],"process.":[78],"In":[79],"this":[80],"we":[82],"try":[83,112],"highlight":[85,114],"several":[86],"problems,":[87],"which":[88,102],"happen":[89],"during":[95,116],"design":[97],"circuits":[100],"have":[103],"bad":[105],"influence":[106],"total":[109],"quality.":[110],"We":[111],"problems":[115],"production":[118],"as":[119],"well.":[120]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2016-06-24T00:00:00"}