{"id":"https://openalex.org/W2047985019","doi":"https://doi.org/10.4028/www.scientific.net/ssp.187.113","title":"Using the Background Signal of a Light Scattering Tool for I/I Photo Resist Strip Optimization and Monitoring","display_name":"Using the Background Signal of a Light Scattering Tool for I/I Photo Resist Strip Optimization and Monitoring","publication_year":2012,"publication_date":"2012-04-01","ids":{"openalex":"https://openalex.org/W2047985019","doi":"https://doi.org/10.4028/www.scientific.net/ssp.187.113","mag":"2047985019"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/ssp.187.113","doi":"https://doi.org/10.4028/www.scientific.net/ssp.187.113","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.187.113","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027487134","display_name":"Sandip Halder","orcid":"https://orcid.org/0000-0002-6314-2685","observed_orcids":["https://orcid.org/0000-0002-6314-2685"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Sandip Halder","raw_affiliation_strings":["IMEC Interuniversity Microelectronics Center"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC Interuniversity Microelectronics Center","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030807663","display_name":"Rita Vos","orcid":"https://orcid.org/0000-0003-2610-3406","observed_orcids":["https://orcid.org/0000-0003-2610-3406"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Rita Vos","raw_affiliation_strings":["IMEC Interuniversity Microelectronics Center"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC Interuniversity Microelectronics Center","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Masayuki Wada","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Masayuki Wada","raw_affiliation_strings":["Dainippon Screen MFG Company Limited"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dainippon Screen MFG Company Limited","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080161336","display_name":"Martine Claes","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Martine Claes","raw_affiliation_strings":["IMEC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061145610","display_name":"Karine Kenis","orcid":"https://orcid.org/0000-0001-7116-7498","observed_orcids":["https://orcid.org/0000-0001-7116-7498"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Karine Kenis","raw_affiliation_strings":["IMEC Interuniversity Microelectronics Center"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC Interuniversity Microelectronics Center","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109196979","display_name":"Paul Mertens","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Paul W. Mertens","raw_affiliation_strings":["IMEC Interuniversity Microelectronics Center"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC Interuniversity Microelectronics Center","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113004176","display_name":"Prasanna Dighe","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Prasanna Dighe","raw_affiliation_strings":["KLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091858991","display_name":"Sanda Radovanovi\u0107","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sanda Radovanovic","raw_affiliation_strings":["KLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041801029","display_name":"Gavin Simpson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gavin Simpson","raw_affiliation_strings":["KLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5007372403","display_name":"Roger Sonnemans","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I116272418","display_name":"Axcelis Technologies (United States)","ror":"https://ror.org/018pfae44","country_code":"US","type":"company","lineage":["https://openalex.org/I116272418"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Roger Sonnemans","raw_affiliation_strings":["Axcelis Technolgies Inc"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Axcelis Technolgies Inc","institution_ids":["https://openalex.org/I116272418"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"187","issue":null,"first_page":"113","last_page":"116"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.7354000210762024,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.7354000210762024,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.07150000333786011,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.044599998742341995,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/background-signal","display_name":"background signal","score":0.8820000290870667},{"id":"https://openalex.org/keywords/photoresist-stripping","display_name":"photoresist stripping","score":0.8220000267028809},{"id":"https://openalex.org/keywords/process-monitoring","display_name":"process monitoring","score":0.7139999866485596},{"id":"https://openalex.org/keywords/feature-size-reduction","display_name":"feature size reduction","score":0.5260000228881836}],"concepts":[{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.8301786780357361},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.7411137819290161},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.6833218336105347},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.6811702847480774},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5961840152740479},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4869478940963745},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46796566247940063},{"id":"https://openalex.org/C120456961","wikidata":"https://www.wikidata.org/wiki/Q210028","display_name":"Light scattering","level":3,"score":0.4661484956741333},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.4631041884422302},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.4517079293727875},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4500558376312256},{"id":"https://openalex.org/C115952470","wikidata":"https://www.wikidata.org/wiki/Q332172","display_name":"Process optimization","level":2,"score":0.424360990524292},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.41125819087028503},{"id":"https://openalex.org/C191486275","wikidata":"https://www.wikidata.org/wiki/Q210028","display_name":"Scattering","level":2,"score":0.39318931102752686},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.36175772547721863},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.28020960092544556},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13435357809066772},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12411558628082275},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11849901080131531},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C87717796","wikidata":"https://www.wikidata.org/wiki/Q146326","display_name":"Environmental engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/ssp.187.113","doi":"https://doi.org/10.4028/www.scientific.net/ssp.187.113","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.187.113","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4943999946117401}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2313386940"],"related_works":["https://openalex.org/W1602583071","https://openalex.org/W2001519180","https://openalex.org/W2189331863","https://openalex.org/W2035934575","https://openalex.org/W4321259796","https://openalex.org/W2021560213","https://openalex.org/W4244934750","https://openalex.org/W2020545347","https://openalex.org/W2099352213","https://openalex.org/W1978875189"],"abstract_inverted_index":{"With":[0],"the":[1,20,29,36,44,72,93],"continuous":[2],"decrease":[3],"of":[4,7,19,47,55,62,75],"feature":[5],"size":[6],"semiconductor":[8],"devices":[9],"new":[10],"process":[11,38,81],"related":[12],"challenges":[13],"must":[14],"be":[15,86],"overcome":[16],"continuously.":[17],"One":[18],"key":[21],"issues":[22],"for":[23],"technology":[24],"development":[25],"is":[26,51,65],"to":[27,34,66],"have":[28],"proper":[30],"metrology":[31,50],"in":[32,104],"place":[33],"evaluate":[35],"myriad":[37],"steps":[39],"fast":[40],"and":[41,57,83],"accurately.":[42],"Sometimes":[43],"mere":[45],"existence":[46],"a":[48,76],"particular":[49],"not":[52],"enough":[53],"because":[54],"cost":[56,94],"throughput":[58],"issues.":[59],"The":[60],"goal":[61],"this":[63,105],"paper":[64],"show":[67],"that":[68],"simply":[69],"by":[70],"monitoring":[71,84],"background":[73],"signal":[74],"light":[77],"scattering":[78],"tool,":[79],"certain":[80],"optimizations":[82],"can":[85],"done":[87],"much":[88],"faster":[89],"while":[90],"bringing":[91],"down":[92],"significantly.":[95],"We":[96],"focus":[97],"particularly":[98],"on":[99],"post":[100],"I/I":[101],"strip":[102],"optimization":[103],"paper.":[106]},"counts_by_year":[],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}