{"id":"https://openalex.org/W2045249356","doi":"https://doi.org/10.1007/s00542-014-2314-5","title":"Design and implementation of a 700\u20132,600 MHz RF SiP module for micro base station","display_name":"Design and implementation of a 700\u20132,600 MHz RF SiP module for micro base station","publication_year":2014,"publication_date":"2014-09-16","ids":{"openalex":"https://openalex.org/W2045249356","doi":"https://doi.org/10.1007/s00542-014-2314-5","mag":"2045249356"},"language":"en","primary_location":{"id":"doi:10.1007/s00542-014-2314-5","doi":"https://doi.org/10.1007/s00542-014-2314-5","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00542-014-2314-5","pdf_url":null,"source":{"id":"https://openalex.org/S54043040","display_name":"Microsystem Technologies","issn_l":"0946-7076","issn":["0946-7076","1432-1858"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystem Technologies","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Yi He","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yi He","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075413332","display_name":"Fengman Liu","orcid":"https://orcid.org/0000-0002-3579-1151","observed_orcids":["https://orcid.org/0000-0002-3579-1151","https://orcid.org/0000-0001-5134-3079"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengman Liu","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016382823","display_name":"Fengze Hou","orcid":"https://orcid.org/0000-0002-4029-5750","observed_orcids":["https://orcid.org/0000-0002-4029-5750"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengze Hou","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019366663","display_name":"Peng Wu","orcid":"https://orcid.org/0000-0001-9834-3535","observed_orcids":["https://orcid.org/0000-0001-9834-3535"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peng Wu","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100362041","display_name":"Jun Li","orcid":"https://orcid.org/0000-0003-1613-9448","observed_orcids":["https://orcid.org/0000-0003-1613-9448","https://orcid.org/0000-0002-9781-8954","https://orcid.org/0009-0009-9854-9694","https://orcid.org/0000-0003-1693-0264"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Li","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083314215","display_name":"Liqiang Cao","orcid":"https://orcid.org/0000-0002-0859-1437","observed_orcids":["https://orcid.org/0000-0002-0859-1437"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liqiang Cao","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5081291112","display_name":"Dongkai Shangguan","orcid":"https://orcid.org/0000-0001-6066-6072","observed_orcids":["https://orcid.org/0000-0001-6066-6072"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongkai Shangguan","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China","institution_ids":["https://openalex.org/I4210151511"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392","https://openalex.org/I4210151511"],"apc_list":{"value":2790,"currency":"USD","value_usd":2790},"apc_paid":null,"fwci":0.4865,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.67139017,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"20","issue":"12","first_page":"2295","last_page":"2300"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.43799999356269836,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.43799999356269836,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.36250001192092896,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.07930000126361847,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/micro-base-stations","display_name":"micro base stations","score":0.9769999980926514},{"id":"https://openalex.org/keywords/vertical-stacking","display_name":"vertical stacking","score":0.5910000205039978},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"insertion loss","score":0.8289999961853027},{"id":"https://openalex.org/keywords/return-loss","display_name":"return loss","score":0.9909999966621399},{"id":"https://openalex.org/keywords/thermal-simulation","display_name":"thermal simulation","score":0.9539999961853027},{"id":"https://openalex.org/keywords/small-form-factor","display_name":"small form factor","score":0.8130000233650208}],"concepts":[{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.7425781488418579},{"id":"https://openalex.org/C47798520","wikidata":"https://www.wikidata.org/wiki/Q190157","display_name":"Transmitter","level":3,"score":0.6058885455131531},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.528727114200592},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.5187575817108154},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.4889887571334839},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.44425395131111145},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.43964022397994995},{"id":"https://openalex.org/C8480308","wikidata":"https://www.wikidata.org/wiki/Q244948","display_name":"Intermediate frequency","level":3,"score":0.4363551139831543},{"id":"https://openalex.org/C196901423","wikidata":"https://www.wikidata.org/wiki/Q3933836","display_name":"Return loss","level":3,"score":0.42398083209991455},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.41903188824653625},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.41262906789779663},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.390097975730896},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3620530366897583},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2995544373989105},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2163175642490387},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.08648207783699036},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s00542-014-2314-5","doi":"https://doi.org/10.1007/s00542-014-2314-5","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00542-014-2314-5","pdf_url":null,"source":{"id":"https://openalex.org/S54043040","display_name":"Microsystem Technologies","issn_l":"0946-7076","issn":["0946-7076","1432-1858"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystem Technologies","raw_type":"journal-article"},{"id":"mag:2560508054","doi":null,"is_oa":false,"landing_page_url":"http://www.irgrid.ac.cn/handle/1471x/1092678","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.651199996471405,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320329860","display_name":"National Science and Technology Major Project","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1829790967","https://openalex.org/W2007565547","https://openalex.org/W2116576439","https://openalex.org/W2118312588","https://openalex.org/W2135610889","https://openalex.org/W2152700488","https://openalex.org/W2160329059","https://openalex.org/W2543596598"],"related_works":["https://openalex.org/W2082539325","https://openalex.org/W2809463094","https://openalex.org/W2905414618","https://openalex.org/W2525074919","https://openalex.org/W7171766916","https://openalex.org/W2515624134","https://openalex.org/W1557631556","https://openalex.org/W2513138823","https://openalex.org/W3107559228","https://openalex.org/W2056733735"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}