{"id":"https://openalex.org/W2033119355","doi":"https://doi.org/10.1117/12.389023","title":"Process performance comparisons on 300-mm i-line steppers, DUV stepper, and DUV scanners","display_name":"Process performance comparisons on 300-mm i-line steppers, DUV stepper, and DUV scanners","publication_year":2000,"publication_date":"2000-07-05","ids":{"openalex":"https://openalex.org/W2033119355","doi":"https://doi.org/10.1117/12.389023","mag":"2033119355"},"language":"en","primary_location":{"id":"doi:10.1117/12.389023","doi":"https://doi.org/10.1117/12.389023","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.389023","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079393940","display_name":"Thorsten Schedel","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Thorsten Schedel","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074696439","display_name":"Alain B. Charles","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Alain B. Charles","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012111778","display_name":"Dietmar Ganz","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dietmar Ganz","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035677161","display_name":"Steffen R. Hornig","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Steffen R. Hornig","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067148673","display_name":"Guenther Hraschan","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Guenther Hraschan","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027881672","display_name":"Wolfram Koestler","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Wolfram Koestler","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088347174","display_name":"John G. Maltabes","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"John G. Maltabes","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058937597","display_name":"Karl E. Mautz","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Karl E. Mautz","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036954426","display_name":"Thomas Metzdorf","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Thomas Metzdorf","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078285820","display_name":"Ralf Otto","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ralf Otto","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103020362","display_name":"Sebastian W. Schmidt","orcid":"https://orcid.org/0000-0003-4408-6697","observed_orcids":["https://orcid.org/0000-0003-4408-6697"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sebastian Schmidt","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5075515860","display_name":"Ralf Schuster","orcid":"https://orcid.org/0000-0003-3998-2219","observed_orcids":["https://orcid.org/0000-0003-3998-2219"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ralf Schuster","raw_affiliation_strings":["Semiconductor300 GmbH (Germany)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semiconductor300 GmbH (Germany)","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.20655598,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"4000","issue":null,"first_page":"335","last_page":"335"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/300-mm-wafers","display_name":"300 mm wafers","score":0.9629999995231628},{"id":"https://openalex.org/keywords/i-line-stepper","display_name":"i-line stepper","score":0.7879999876022339},{"id":"https://openalex.org/keywords/critical-dimension-uniformity","display_name":"critical dimension uniformity","score":0.8949999809265137},{"id":"https://openalex.org/keywords/process-capability","display_name":"process capability","score":0.574999988079071},{"id":"https://openalex.org/keywords/scanner-resolution","display_name":"scanner resolution","score":0.5849999785423279},{"id":"https://openalex.org/keywords/rework","display_name":"rework","score":0.6940000057220459},{"id":"https://openalex.org/keywords/in-line-metrology","display_name":"in-line metrology","score":0.7940000295639038}],"concepts":[{"id":"https://openalex.org/C187504802","wikidata":"https://www.wikidata.org/wiki/Q1751548","display_name":"Stepper","level":2,"score":0.8384076356887817},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6618513464927673},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.5912531614303589},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5570827722549438},{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.5104002356529236},{"id":"https://openalex.org/C2776543023","wikidata":"https://www.wikidata.org/wiki/Q2147046","display_name":"Rework","level":2,"score":0.5069410800933838},{"id":"https://openalex.org/C2779751349","wikidata":"https://www.wikidata.org/wiki/Q1474480","display_name":"Scanner","level":2,"score":0.5038959383964539},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.4976826012134552},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.4627871811389923},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4261651039123535},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.42158904671669006},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.417593389749527},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.40314915776252747},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3722326159477234},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3484894633293152},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3289511799812317},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.24004575610160828},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.23283547163009644},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20015749335289001},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.19733399152755737},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.15774103999137878},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.14081865549087524},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.389023","doi":"https://doi.org/10.1117/12.389023","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.389023","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2006946064"],"related_works":["https://openalex.org/W2011057915","https://openalex.org/W2046922218","https://openalex.org/W2006946064","https://openalex.org/W1994626197","https://openalex.org/W1990579567","https://openalex.org/W2142543453","https://openalex.org/W2009051685","https://openalex.org/W2323287381","https://openalex.org/W2013078782","https://openalex.org/W2124541212"],"abstract_inverted_index":{"SEMICONDUCTOR300":[0],"was":[1,115,123,168,172],"the":[2,11,64,92,108,137,147,155,178],"first":[3],"pilot":[4],"production":[5],"facility":[6],"for":[7,82,96],"300mm":[8,29,128],"wafers":[9,129],"in":[10,145,176],"world.":[12],"This":[13],"company,":[14],"a":[15,27,39],"joint":[16],"venture":[17],"between":[18,67],"Infineon":[19],"Technologies":[20],"and":[21,42,55,70,78,99,118,135,159,182],"Motorola,":[22],"is":[23],"working":[24],"to":[25,50,132,162,174],"develop":[26],"manufacturable":[28],"wafer":[30,80,138,165],"tool":[31,84,94],"set.":[32],"The":[33,88,152],"lithography":[34],"tools":[35,47],"include":[36],"I-line":[37,71],"steppers,":[38],"DUV":[40,44,68],"stepper,":[41],"two":[43],"scanners.":[45],"These":[46],"are":[48,130],"used":[49,173],"build":[51],"64M":[52],"DRAM":[53],"devices":[54,102],"aggressive":[56],"test":[57],"vehicles.":[58],"Data":[59],"will":[60],"be":[61],"presented":[62],"on":[63,75],"mix-and-matching":[65],"performance":[66,106,122,153],"scanners":[69],"steppers.":[72],"Process-related":[73],"data":[74,171],"CD":[76],"within-field":[77],"across":[79],"sampling":[81],"selected":[83],"types":[85,158],"were":[86,103],"investigated.":[87],"process":[89],"capability":[90],"of":[91,107,154],"current":[93],"set":[95],"0.25":[97],"micrometers":[98,101],"0.18":[100],"compared.":[104],"Resolution":[105],"scanner":[109],"with":[110,125],"its":[111],"0.68":[112],"numerical":[113],"aperture":[114],"studied.":[116,169],"Dense":[117],"isolated":[119],"printed":[120],"pattern":[121,149],"measured":[124],"in-line":[126],"metrology.":[127],"sensitive":[131],"backside":[133,164],"defectivity,":[134],"therefore":[136],"chuck":[139,157,183],"design":[140],"plays":[141],"an":[142],"important":[143],"role":[144],"achieving":[146],"desired":[148],"transfer":[150],"performance.":[151,185],"different":[156],"their":[160],"sensitivity":[161],"incoming":[163],"contamination":[166],"levels":[167],"Rework":[170],"assist":[175],"characterizing":[177],"exposure":[179],"dose":[180],"matching":[181],"type":[184]},"counts_by_year":[],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2016-06-24T00:00:00"}