{"id":"https://openalex.org/W2024531237","doi":"https://doi.org/10.1117/12.604401","title":"Effect of hard bake process on LER","display_name":"Effect of hard bake process on LER","publication_year":2005,"publication_date":"2005-05-04","ids":{"openalex":"https://openalex.org/W2024531237","doi":"https://doi.org/10.1117/12.604401","mag":"2024531237"},"language":"en","primary_location":{"id":"doi:10.1117/12.604401","doi":"https://doi.org/10.1117/12.604401","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.604401","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019850151","display_name":"Munirathna Padmanaban","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Munirathna Padmanaban","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019639028","display_name":"David Rentkiewicz","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"David Rentkiewicz","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113522261","display_name":"Sangho Lee","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"SangHo Lee","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089166446","display_name":"Chisun Hong","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chisun Hong","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081424907","display_name":"Dongkwan Lee","orcid":"https://orcid.org/0000-0002-7620-3600","observed_orcids":["https://orcid.org/0000-0002-7620-3600"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dongkwan Lee","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109971246","display_name":"Dalil Rahman","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dalil Rahman","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067125539","display_name":"Raj Sakamuri","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Raj Sakamuri","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030609261","display_name":"Ralph R. Dammel","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ralph R. Dammel","raw_affiliation_strings":["AZ Electronic Materials (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ Electronic Materials (United States)","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.6929,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.80612077,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"5753","issue":null,"first_page":"862","last_page":"862"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/line-edge-roughness","display_name":"line edge roughness","score":0.9980000257492065},{"id":"https://openalex.org/keywords/chemically-amplified-resists","display_name":"chemically amplified resists","score":0.8230000138282776},{"id":"https://openalex.org/keywords/248-nm-lithography","display_name":"248 nm lithography","score":0.8069999814033508},{"id":"https://openalex.org/keywords/193-nm-lithography","display_name":"193 nm lithography","score":1.0},{"id":"https://openalex.org/keywords/glass-transition-temperature","display_name":"glass transition temperature","score":0.8569999933242798},{"id":"https://openalex.org/keywords/lighting-conditions","display_name":"lighting conditions","score":0.6710000038146973}],"concepts":[{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.9324328899383545},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.661094069480896},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5537331700325012},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5491533279418945},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.5118746161460876},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.4243961572647095},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3791329860687256},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3335551619529724},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.32056766748428345},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2054138481616974},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.10349595546722412},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09857052564620972},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.07471418380737305},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.604401","doi":"https://doi.org/10.1117/12.604401","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.604401","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2116742526","https://openalex.org/W2017839737","https://openalex.org/W1996628572","https://openalex.org/W2084216123","https://openalex.org/W2064764800","https://openalex.org/W2044211195","https://openalex.org/W4403674196","https://openalex.org/W2011520884","https://openalex.org/W2050620269","https://openalex.org/W2040280437"],"abstract_inverted_index":{"Line-edge":[0],"roughness":[1],"(LER)":[2],"continues":[3],"to":[4,17,72,105,117,134],"be":[5,62],"one":[6],"of":[7,37,81,120,128,146,157],"the":[8,12,53,74,77,88,93,106,110,121,125,129,137,144,155,158],"biggest":[9],"challenges":[10],"as":[11,27,29],"CD":[13],"size":[14],"shrinks":[15],"down":[16,119],"sub":[18],"100":[19],"nm.":[20],"It":[21],"is":[22,56],"shown":[23],"that":[24],"resist":[25,38,47,99],"components":[26,39],"well":[28],"illumination":[30],"conditions":[31],"play":[32],"a":[33,82,97],"big":[34],"role.":[35],"Influence":[36],"in":[40],"both":[41],"248":[42],"and":[43,60,152,154],"193nm":[44],"chemically":[45],"amplified":[46],"formulations":[48],"has":[49],"been":[50],"reported":[51],"but":[52],"root":[54],"cause":[55],"not":[57],"fully":[58],"understood":[59],"may":[61],"platform":[63],"or":[64],"even":[65],"specific":[66],"formulation":[67],"dependent.":[68],"This":[69],"paper":[70],"attempts":[71],"tackle":[73],"issue":[75],"from":[76],"processing":[78],"side.":[79],"Effects":[80],"simple":[83],"hard":[84,94,139,149],"bake":[85,95,140,150],"process":[86,159],"on":[87,143],"LER":[89,113],"were":[90],"studied.":[91],"In":[92],"process,":[96],"given":[98],"pattern":[100],"was":[101],"typically":[102],"baked":[103],"close":[104],"glass-transition":[107],"temperature":[108,151],"after":[109],"development":[111],"process.":[112],"improved":[114],"dramatically":[115],"due":[116],"melting":[118],"rough":[122],"surface.":[123],"However,":[124],"wall":[126],"angle":[127],"edge":[130],"lines":[131],"also":[132],"started":[133],"degrade":[135],"at":[136],"optimum":[138],"temperature.":[141],"Studies":[142],"effects":[145],"polymer":[147],"Tg,":[148],"time":[153],"issues":[156],"are":[160],"discussed.":[161]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-01T08:54:57.152042","created_date":"2016-06-24T00:00:00"}