{"id":"https://openalex.org/W2024030438","doi":"https://doi.org/10.1149/06406.0417ecst","title":"Fast and Accurate in-Line Monitor of Boron Implantation Energy and Dose by Spectroscopic Ellipsometry","display_name":"Fast and Accurate in-Line Monitor of Boron Implantation Energy and Dose by Spectroscopic Ellipsometry","publication_year":2014,"publication_date":"2014-08-12","ids":{"openalex":"https://openalex.org/W2024030438","doi":"https://doi.org/10.1149/06406.0417ecst","mag":"2024030438"},"language":"en","primary_location":{"id":"doi:10.1149/06406.0417ecst","doi":"https://doi.org/10.1149/06406.0417ecst","is_oa":false,"landing_page_url":"https://doi.org/10.1149/06406.0417ecst","pdf_url":null,"source":{"id":"https://openalex.org/S4210205149","display_name":"ECS Transactions","issn_l":"1938-5862","issn":["1938-5862","1938-6737","2151-2051"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1","poland-20"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Transactions","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037787019","display_name":"Tsai-Yu Wen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I77566578","display_name":"United Microelectronics (United States)","ror":"https://ror.org/00vrhw316","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tsai-Yu Wen","raw_affiliation_strings":["United Microelectronics Corp. (UMC)","#N##N#aUnited Microelectronics Corp. (UMC)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"United Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]},{"raw_affiliation_string":"#N##N#aUnited Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113946987","display_name":"Tsuo-Wen Lu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I77566578","display_name":"United Microelectronics (United States)","ror":"https://ror.org/00vrhw316","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tsuo-Wen Lu","raw_affiliation_strings":["United Microelectronics Corp. (UMC)","#N##N#aUnited Microelectronics Corp. (UMC)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"United Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]},{"raw_affiliation_string":"#N##N#aUnited Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101406400","display_name":"Yuren Wang","orcid":"https://orcid.org/0000-0002-6136-4030","observed_orcids":["https://orcid.org/0000-0002-6136-4030"]},"institutions":[{"id":"https://openalex.org/I77566578","display_name":"United Microelectronics (United States)","ror":"https://ror.org/00vrhw316","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu-Ren Wang","raw_affiliation_strings":["United Microelectronics Corp. (UMC)","#N##N#aUnited Microelectronics Corp. (UMC)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"United Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]},{"raw_affiliation_string":"#N##N#aUnited Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111570837","display_name":"Chin-Fu Lin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I77566578","display_name":"United Microelectronics (United States)","ror":"https://ror.org/00vrhw316","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chin-Fu Lin","raw_affiliation_strings":["United Microelectronics Corp. (UMC)","#N##N#aUnited Microelectronics Corp. (UMC)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"United Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]},{"raw_affiliation_string":"#N##N#aUnited Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101599536","display_name":"Jianchuan Wu","orcid":"https://orcid.org/0000-0002-2380-5800","observed_orcids":["https://orcid.org/0000-0002-2380-5800"]},"institutions":[{"id":"https://openalex.org/I77566578","display_name":"United Microelectronics (United States)","ror":"https://ror.org/00vrhw316","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J Y Wu","raw_affiliation_strings":["United Microelectronics Corp. (UMC)","#N##N#aUnited Microelectronics Corp. (UMC)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"United Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]},{"raw_affiliation_string":"#N##N#aUnited Microelectronics Corp. (UMC)","institution_ids":["https://openalex.org/I77566578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103975529","display_name":"Shao-Ju Chang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shao-Ju Chang","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111682187","display_name":"Sheng-Min Chiu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheng-Min Chiu","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110100304","display_name":"Chien-Jen Huang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chien-Jen Huang","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109200771","display_name":"Chao-Yu H. Cheng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chao-Yu Cheng","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020718629","display_name":"Juli Cheng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Juli Cheng","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033913459","display_name":"Getin Raphael","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Getin Raphael","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Zhiming Jiang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhiming Jiang","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111584537","display_name":"Zhengquan Tan","orcid":"https://orcid.org/0009-0001-8935-0116","observed_orcids":["https://orcid.org/0009-0001-8935-0116"]},"institutions":[{"id":"https://openalex.org/I70745867","display_name":"KLA (United States)","ror":"https://ror.org/02rqhpa98","country_code":"US","type":"company","lineage":["https://openalex.org/I70745867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhengquan Tan","raw_affiliation_strings":["KLA-Tencor Corporation","#N##N#bKLA-Tencor Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]},{"raw_affiliation_string":"#N##N#bKLA-Tencor Corporation","institution_ids":["https://openalex.org/I70745867"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1780216,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"64","issue":"6","first_page":"417","last_page":"422"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12050","display_name":"Optical Polarization and Ellipsometry","score":0.36469998955726624,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12050","display_name":"Optical Polarization and Ellipsometry","score":0.36469998955726624,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12166","display_name":"Ion-surface interactions and analysis","score":0.19130000472068787,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.1324000060558319,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/boron-implantation","display_name":"boron implantation","score":0.9409999847412109},{"id":"https://openalex.org/keywords/online-process-monitoring","display_name":"real-time process monitoring","score":0.75},{"id":"https://openalex.org/keywords/spectroscopic-ellipsometry","display_name":"spectroscopic ellipsometry","score":0.9369999766349792},{"id":"https://openalex.org/keywords/ultrashallow-junctions","display_name":"ultra-shallow junctions","score":0.7559999823570251},{"id":"https://openalex.org/keywords/nondestructive-measurement","display_name":"non-destructive measurement","score":0.6959999799728394},{"id":"https://openalex.org/keywords/queuing-time","display_name":"queue waiting time","score":0.6100000143051147},{"id":"https://openalex.org/keywords/semiconductor-doping","display_name":"semiconductor doping","score":0.5559999942779541}],"concepts":[{"id":"https://openalex.org/C501308230","wikidata":"https://www.wikidata.org/wiki/Q618","display_name":"Boron","level":2,"score":0.8243101835250854},{"id":"https://openalex.org/C191952053","wikidata":"https://www.wikidata.org/wiki/Q15119237","display_name":"Dopant","level":3,"score":0.7766945362091064},{"id":"https://openalex.org/C41823505","wikidata":"https://www.wikidata.org/wiki/Q1436752","display_name":"Ion implantation","level":3,"score":0.758169412612915},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.641150951385498},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.578827440738678},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.5565513968467712},{"id":"https://openalex.org/C18293161","wikidata":"https://www.wikidata.org/wiki/Q898774","display_name":"Ellipsometry","level":3,"score":0.5558724999427795},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5156768560409546},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.5048125982284546},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.48281678557395935},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.3838997781276703},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.28902217745780945},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.19143718481063843},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.18437552452087402},{"id":"https://openalex.org/C145148216","wikidata":"https://www.wikidata.org/wiki/Q36496","display_name":"Ion","level":2,"score":0.17172697186470032},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.13024291396141052},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11550033092498779},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1149/06406.0417ecst","doi":"https://doi.org/10.1149/06406.0417ecst","is_oa":false,"landing_page_url":"https://doi.org/10.1149/06406.0417ecst","pdf_url":null,"source":{"id":"https://openalex.org/S4210205149","display_name":"ECS Transactions","issn_l":"1938-5862","issn":["1938-5862","1938-6737","2151-2051"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1","poland-20"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Transactions","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7100842172","https://openalex.org/W4311270813","https://openalex.org/W2016651839","https://openalex.org/W438312201","https://openalex.org/W2101804456","https://openalex.org/W1965264626","https://openalex.org/W7071209439","https://openalex.org/W1673817952","https://openalex.org/W2113631991","https://openalex.org/W2017769925"],"abstract_inverted_index":{"Boron":[0,51],"is":[1],"a":[2,44],"specified":[3],"dopant":[4],"applied":[5],"at":[6,22,100],"semiconductor":[7],"manufacturing,":[8],"which":[9],"used":[10],"for":[11,49,84],"ultra-shallow":[12],"junction":[13],"(USJ)":[14],"formation":[15],"and":[16,39,46,54,102],"stable":[17,85],"SiGe":[18],"stressed":[19],"channel":[20],"configuration":[21],"advanced":[23],"generation.":[24],"Aggressive":[25],"device":[26],"scaling":[27],"over":[28],"the":[29,33,73],"last":[30],"decade":[31],"leads":[32],"precise":[34],"implantation":[35],"control":[36],"much":[37],"important":[38],"critical.":[40],"In":[41],"this":[42],"paper,":[43],"non-destructive":[45],"fast":[47],"technology":[48],"inline":[50],"implanted":[52,74],"depth":[53],"dose":[55],"concentration":[56],"measurement":[57],"was":[58,80],"presented":[59],"using":[60],"Spectroscopic":[61],"Ellipsometry":[62],"(SE)":[63],"methodology.":[64],"Excellent":[65],"correlation":[66],"with":[67],"SIMS":[68],"reference":[69],"result":[70],"achieved.":[71],"Further,":[72],"processes":[75],"quene":[76],"time":[77],"(Q-time)":[78],"issue":[79],"also":[81],"be":[82],"considered":[83],"production":[86],"monitor":[87],"in":[88],"foundry":[89],"side.":[90],"The":[91],"metrology":[92],"theory":[93],"could":[94],"extend":[95],"to":[96],"other":[97],"doping":[98],"species":[99],"medium":[101],"low":[103],"energy":[104],"application":[105],"field.":[106]},"counts_by_year":[],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2016-06-24T00:00:00"}