{"id":"https://openalex.org/W2023667828","doi":"https://doi.org/10.1364/ipr.1994.sae3","title":"Submicron accuracy fiber fixing using a commercial welding laser","display_name":"Submicron accuracy fiber fixing using a commercial welding laser","publication_year":1994,"publication_date":"1994-01-01","ids":{"openalex":"https://openalex.org/W2023667828","doi":"https://doi.org/10.1364/ipr.1994.sae3","mag":"2023667828"},"language":"en","primary_location":{"id":"doi:10.1364/ipr.1994.sae3","doi":"https://doi.org/10.1364/ipr.1994.sae3","is_oa":false,"landing_page_url":"https://doi.org/10.1364/ipr.1994.sae3","pdf_url":null,"source":{"id":"https://openalex.org/S4363604315","display_name":"Integrated Photonics Research","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Integrated Photonics Research","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108423142","display_name":"Bernd Valk","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2802226979","display_name":"Ascom (Switzerland)","ror":"https://ror.org/03p2wmp96","country_code":"CH","type":"company","lineage":["https://openalex.org/I2802226979"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"B. Valk","raw_affiliation_strings":["Ascom Tech AG, Morgenstr. 129, CH-3018 Bern, Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Ascom Tech AG, Morgenstr. 129, CH-3018 Bern, Switzerland","institution_ids":["https://openalex.org/I2802226979"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048383753","display_name":"O. Anthamatten","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2802226979","display_name":"Ascom (Switzerland)","ror":"https://ror.org/03p2wmp96","country_code":"CH","type":"company","lineage":["https://openalex.org/I2802226979"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"O. Anthamatten","raw_affiliation_strings":["Ascom Tech AG, Morgenstr. 129, CH-3018 Bern, Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Ascom Tech AG, Morgenstr. 129, CH-3018 Bern, Switzerland","institution_ids":["https://openalex.org/I2802226979"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110234711","display_name":"Rainer K. B\u00e4ttig","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2802226979","display_name":"Ascom (Switzerland)","ror":"https://ror.org/03p2wmp96","country_code":"CH","type":"company","lineage":["https://openalex.org/I2802226979"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"R. Battig","raw_affiliation_strings":["Ascom Tech AG, Morgenstr. 129, CH-3018 Bern, Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Ascom Tech AG, Morgenstr. 129, CH-3018 Bern, Switzerland","institution_ids":["https://openalex.org/I2802226979"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I2802226979"],"apc_list":null,"apc_paid":null,"fwci":1.6091,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.74322381,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"SaE3","last_page":"SaE3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.951200008392334,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.951200008392334,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.026399999856948853,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.007400000002235174,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fiber-to-chip-coupling","display_name":"fiber-to-chip coupling","score":0.6800000071525574},{"id":"https://openalex.org/keywords/single-mode-fiber","display_name":"single-mode fiber","score":0.5080000162124634},{"id":"https://openalex.org/keywords/semiconductor-optoelectronic-devices","display_name":"semiconductor optoelectronic devices","score":0.652999997138977},{"id":"https://openalex.org/keywords/laser-welding","display_name":"laser welding","score":0.7099999785423279},{"id":"https://openalex.org/keywords/hermetic-packaging","display_name":"hermetic packaging","score":0.7179999947547913},{"id":"https://openalex.org/keywords/nd-yag-laser","display_name":"Nd:YAG laser","score":0.8920000195503235},{"id":"https://openalex.org/keywords/readjustment","display_name":"readjustment","score":0.6110000014305115}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8260276317596436},{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.8235596418380737},{"id":"https://openalex.org/C89344249","wikidata":"https://www.wikidata.org/wiki/Q937468","display_name":"Laser beam welding","level":3,"score":0.7189319133758545},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.6473615765571594},{"id":"https://openalex.org/C21792228","wikidata":"https://www.wikidata.org/wiki/Q5178039","display_name":"Coupling loss","level":3,"score":0.5298713445663452},{"id":"https://openalex.org/C194232370","wikidata":"https://www.wikidata.org/wiki/Q162","display_name":"Optical fiber","level":2,"score":0.514523446559906},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.46190863847732544},{"id":"https://openalex.org/C17163034","wikidata":"https://www.wikidata.org/wiki/Q390528","display_name":"Fiber laser","level":3,"score":0.4589565396308899},{"id":"https://openalex.org/C2777441419","wikidata":"https://www.wikidata.org/wiki/Q16969460","display_name":"Process window","level":3,"score":0.4514445960521698},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.44725045561790466},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.4343870282173157},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3360012173652649},{"id":"https://openalex.org/C519885992","wikidata":"https://www.wikidata.org/wiki/Q161","display_name":"Fiber","level":2,"score":0.32893961668014526},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.09523433446884155},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1364/ipr.1994.sae3","doi":"https://doi.org/10.1364/ipr.1994.sae3","is_oa":false,"landing_page_url":"https://doi.org/10.1364/ipr.1994.sae3","pdf_url":null,"source":{"id":"https://openalex.org/S4363604315","display_name":"Integrated Photonics Research","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Integrated Photonics Research","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1973607315","https://openalex.org/W1545816508","https://openalex.org/W7002249280","https://openalex.org/W7098932484","https://openalex.org/W2141589802","https://openalex.org/W1994811548","https://openalex.org/W1984100198","https://openalex.org/W1996181848","https://openalex.org/W2121359733","https://openalex.org/W2090336695"],"abstract_inverted_index":{"Optical":[0],"coupling":[1],"from":[2],"single":[3],"mode":[4],"fibers":[5],"to":[6,29,84,110],"integrated":[7],"waveguides":[8],"of":[9,27,66,72,101,115,134,143,147,159],"semiconductor":[10],"optoelectronic":[11],"devices":[12],"with":[13,79],"less":[14],"than":[15],"0.5":[16],"dB":[17],"packaging":[18,53],"loss":[19],"generally":[20,89],"requires":[21],"positioning":[22,65],"accuracies":[23],"on":[24,59],"the":[25,48,60,67,85,102,105,116,120,135,148,153,157],"order":[26],"\u00b10.5":[28],"\u00b11.5":[30],"\u03bcm.":[31],"Laser":[32],"welding":[33,86,136,160],"is":[34,47,88],"widely":[35],"used":[36],"for":[37,51,171],"fixing":[38],"because":[39],"it":[40,46,170],"guarantees":[41],"long":[42],"term":[43],"stability,":[44],"and":[45,63,113,127],"preferred":[49],"method":[50],"hermetic":[52],"[1-3].":[54],"Furthermore,":[55],"no":[56],"thermal":[57],"strain":[58],"module":[61],"parts":[62],"precise":[64],"welds":[68],"are":[69],"attractive":[70],"features":[71],"this":[73],"technique.":[74],"A":[75],"Nd:YAG":[76],"laser":[77,93],"equipped":[78],"fiber":[80],"guided":[81],"energy":[82,103],"distribution":[83,100],"heads":[87],"used.":[90],"However,":[91,156],"commercial":[92],"systems":[94],"do":[95],"not":[96],"guarantee":[97],"a":[98,124,141,144],"stable":[99],"into":[104,165],"different":[106,111],"arms.":[107],"This":[108],"leads":[109],"volumes":[112],"temperatures":[114],"melted":[117],"material":[118],"in":[119,140],"weld":[121],"spots,":[122],"preventing":[123],"simultaneous":[125],"solidification":[126],"cooling":[128],"process.":[129],"Hence,":[130],"an":[131,166],"unequal":[132],"shrinking":[133,158],"spots":[137,161],"occurs,":[138],"resulting":[139],"shift":[142],"few":[145],"microns":[146],"welded":[149],"parts,":[150],"strongly":[151],"increasing":[152],"assembly":[154],"loss.":[155],"can":[162],"be":[163],"turned":[164],"advantage":[167],"by":[168],"using":[169],"readjustment":[172],"purposes.":[173]},"counts_by_year":[],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2016-06-24T00:00:00"}