{"id":"https://openalex.org/W2020368209","doi":"https://doi.org/10.1116/1.1321752","title":"Multisource optimization of a column for electron lithography","display_name":"Multisource optimization of a column for electron lithography","publication_year":2000,"publication_date":"2000-11-01","ids":{"openalex":"https://openalex.org/W2020368209","doi":"https://doi.org/10.1116/1.1321752","mag":"2020368209"},"language":"en","primary_location":{"id":"doi:10.1116/1.1321752","doi":"https://doi.org/10.1116/1.1321752","is_oa":false,"landing_page_url":"https://doi.org/10.1116/1.1321752","pdf_url":null,"source":{"id":"https://openalex.org/S4210169477","display_name":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","issn_l":"1071-1023","issn":["1071-1023","1520-8567"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","poland-70"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061174644","display_name":"Mari\u00e1n Ma\u0148ko\u0161","orcid":"https://orcid.org/0000-0003-2207-4898","observed_orcids":["https://orcid.org/0000-0003-2207-4898"]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Mankos","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109171760","display_name":"Stephen F. Coyle","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Coyle","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062928228","display_name":"Andres J. Fernandez","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Fernandez","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015403142","display_name":"Allan L. Sagle","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Sagle","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110921717","display_name":"Peyton E. Allen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Allen","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":null,"display_name":"W. Owens","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. Owens","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":null,"display_name":"J. Sullivan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Sullivan","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044428625","display_name":"T. H. P. Chang","orcid":"https://orcid.org/0009-0003-9821-4700","observed_orcids":["https://orcid.org/0009-0003-9821-4700"]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. H. P. Chang","raw_affiliation_strings":["Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Incorporated, an Applied Materials Company, 26460 Corporate Avenue, Hayward, California\u200994545","institution_ids":["https://openalex.org/I193427800"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I193427800"],"apc_list":null,"apc_paid":null,"fwci":3.3808,"has_fulltext":false,"cited_by_count":27,"citation_normalized_percentile":{"value":0.91623267,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"18","issue":"6","first_page":"3010","last_page":"3016"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.57669997215271,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.57669997215271,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13418","display_name":"Photocathodes and Microchannel Plates","score":0.38749998807907104,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12039","display_name":"Electron and X-Ray Spectroscopy Techniques","score":0.00930000003427267,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electron-lithography","display_name":"electron lithography","score":0.9810000061988831},{"id":"https://openalex.org/keywords/photocathode-electron-sources","display_name":"photocathode electron sources","score":0.7820000052452087},{"id":"https://openalex.org/keywords/electron-optics","display_name":"electron optics","score":0.6150000095367432},{"id":"https://openalex.org/keywords/electron-electron-interaction","display_name":"electron-electron interaction","score":0.8149999976158142},{"id":"https://openalex.org/keywords/negative-electron-affinity","display_name":"negative electron affinity","score":0.8920000195503235},{"id":"https://openalex.org/keywords/gold-photocathode","display_name":"gold photocathode","score":0.9890000224113464}],"concepts":[{"id":"https://openalex.org/C13115443","wikidata":"https://www.wikidata.org/wiki/Q1891923","display_name":"Photocathode","level":3,"score":0.9951136708259583},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.7717820405960083},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7103909254074097},{"id":"https://openalex.org/C147120987","wikidata":"https://www.wikidata.org/wiki/Q2225","display_name":"Electron","level":2,"score":0.7015184164047241},{"id":"https://openalex.org/C95312477","wikidata":"https://www.wikidata.org/wiki/Q207340","display_name":"Cathode ray","level":3,"score":0.6200499534606934},{"id":"https://openalex.org/C179156687","wikidata":"https://www.wikidata.org/wiki/Q1128174","display_name":"Electron gun","level":4,"score":0.5924522280693054},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5238682627677917},{"id":"https://openalex.org/C2780551164","wikidata":"https://www.wikidata.org/wiki/Q2306599","display_name":"Column (typography)","level":3,"score":0.5191344618797302},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.5060145258903503},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.49664241075515747},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4535442888736725},{"id":"https://openalex.org/C41794268","wikidata":"https://www.wikidata.org/wiki/Q1408939","display_name":"X-ray lithography","level":4,"score":0.41140344738960266},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2837907075881958},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.26439976692199707},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.25969088077545166},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.24303492903709412},{"id":"https://openalex.org/C185544564","wikidata":"https://www.wikidata.org/wiki/Q81197","display_name":"Nuclear physics","level":1,"score":0.0895649790763855},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08555638790130615},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.07369765639305115},{"id":"https://openalex.org/C126042441","wikidata":"https://www.wikidata.org/wiki/Q1324888","display_name":"Frame (networking)","level":2,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1116/1.1321752","doi":"https://doi.org/10.1116/1.1321752","is_oa":false,"landing_page_url":"https://doi.org/10.1116/1.1321752","pdf_url":null,"source":{"id":"https://openalex.org/S4210169477","display_name":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","issn_l":"1071-1023","issn":["1071-1023","1520-8567"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","poland-70"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1993456049","https://openalex.org/W1997951166","https://openalex.org/W2009138062","https://openalex.org/W2013135333","https://openalex.org/W2032538883","https://openalex.org/W2043112911","https://openalex.org/W2048020442","https://openalex.org/W2051608001","https://openalex.org/W2073876612","https://openalex.org/W2075970100","https://openalex.org/W2085545489","https://openalex.org/W2090027547","https://openalex.org/W2146430823","https://openalex.org/W2146679500"],"related_works":["https://openalex.org/W2030124524","https://openalex.org/W2200670180","https://openalex.org/W2332246194","https://openalex.org/W2090027547","https://openalex.org/W2077387775","https://openalex.org/W2737557482","https://openalex.org/W2082421066","https://openalex.org/W2055548169","https://openalex.org/W2146679500","https://openalex.org/W2029379693"],"abstract_inverted_index":{"The":[0,34],"optimization":[1],"of":[2,8,43,90],"key":[3,91],"parameters":[4],"determining":[5],"the":[6,45,49,87],"performance":[7],"a":[9,22,40],"multisource":[10,18,35],"electron":[11,50,72],"column":[12],"is":[13,58],"discussed.":[14],"A":[15],"50":[16,84],"keV":[17],"test":[19,36],"bed":[20,37],"incorporating":[21],"photocathode":[23,46],"and":[24,32,48,57,74],"multiple":[25],"modulated":[26],"light":[27],"beams":[28],"has":[29],"been":[30,66],"developed":[31],"tested.":[33],"allows":[38],"for":[39,52],"detailed":[41],"evaluation":[42,89],"both":[44],"sources":[47],"optics":[51],"sub-100":[53],"nm":[54],"lithography":[55],"applications":[56],"designed":[59],"to":[60,83],"reduce":[61],"electron\u2013electron":[62],"interactions.":[63],"Results":[64],"have":[65],"obtained":[67],"using":[68],"cesiated":[69],"GaAs":[70],"negative":[71],"affinity":[73],"gold":[75],"photocathodes":[76],"at":[77],"beam":[78],"energies":[79],"varying":[80],"from":[81],"10":[82],"kV,":[85],"allowing":[86],"experimental":[88],"design":[92],"parameters.":[93]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-11-03T10:50:19.383937","created_date":"2016-06-24T00:00:00"}