{"id":"https://openalex.org/W2018448630","doi":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","title":"Joining Mechanisms in Electrostatic Bonding","display_name":"Joining Mechanisms in Electrostatic Bonding","publication_year":2004,"publication_date":"2004-05-15","ids":{"openalex":"https://openalex.org/W2018448630","doi":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","mag":"2018448630"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/kem.264-268.649","doi":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5069681310","display_name":"Antonius T. J. van Helvoort","orcid":"https://orcid.org/0000-0001-6437-1474","observed_orcids":["https://orcid.org/0000-0001-6437-1474"]},"institutions":[{"id":"https://openalex.org/I241749","display_name":"University of Cambridge","ror":"https://ror.org/013meh722","country_code":"GB","type":"education","lineage":["https://openalex.org/I241749"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"A.T.J. Van Helvoort","raw_affiliation_strings":["University of Cambridge"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cambridge","institution_ids":["https://openalex.org/I241749"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102495349","display_name":"Kevin M. Knowles","orcid":"https://orcid.org/0009-0006-1980-0341","observed_orcids":["https://orcid.org/0009-0006-1980-0341"]},"institutions":[{"id":"https://openalex.org/I241749","display_name":"University of Cambridge","ror":"https://ror.org/013meh722","country_code":"GB","type":"education","lineage":["https://openalex.org/I241749"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"K.M. Knowles","raw_affiliation_strings":["University of Cambridge"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cambridge","institution_ids":["https://openalex.org/I241749"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029600985","display_name":"John A. Fernie","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2802201010","display_name":"AWE Nuclear Security Technologies","ror":"https://ror.org/02gv4h649","country_code":"GB","type":"facility","lineage":["https://openalex.org/I2802201010"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"J.A. Fernie","raw_affiliation_strings":["AWE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AWE","institution_ids":["https://openalex.org/I2802201010"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.26917681,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":92},"biblio":{"volume":"264-268","issue":null,"first_page":"649","last_page":"654"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.6904000043869019,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.6904000043869019,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.07890000194311142,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0560000017285347,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electrostatic-bonding","display_name":"electrostatic bonding","score":0.9739999771118164},{"id":"https://openalex.org/keywords/joining-mechanism","display_name":"joining mechanism","score":0.9890000224113464},{"id":"https://openalex.org/keywords/adhesive-bonding","display_name":"adhesive bonding","score":0.4749999940395355},{"id":"https://openalex.org/keywords/surface-energy","display_name":"surface energy","score":0.3019999861717224},{"id":"https://openalex.org/keywords/interfacial-adhesion","display_name":"interfacial adhesion","score":0.7059999704360962}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5503024458885193},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3592621088027954},{"id":"https://openalex.org/C77595967","wikidata":"https://www.wikidata.org/wiki/Q3151013","display_name":"Forensic engineering","level":1,"score":0.3537294268608093},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.33124351501464844},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25625723600387573}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/kem.264-268.649","doi":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4028/www.scientific.net/kem.264-268.649","doi":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.264-268.649","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320320273","display_name":"University of Cambridge","ror":"https://ror.org/013meh722"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W147611281","https://openalex.org/W1983416426","https://openalex.org/W1986620377","https://openalex.org/W1995058309","https://openalex.org/W2011911729","https://openalex.org/W2015364574","https://openalex.org/W2029720821","https://openalex.org/W2031504198","https://openalex.org/W2044898045","https://openalex.org/W2081710071","https://openalex.org/W2089948568","https://openalex.org/W2151028652","https://openalex.org/W2158152193","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2107140496","https://openalex.org/W2067131503","https://openalex.org/W4242277694","https://openalex.org/W4235068961","https://openalex.org/W1968191252","https://openalex.org/W4248796498","https://openalex.org/W4300460922","https://openalex.org/W843328275","https://openalex.org/W269563657","https://openalex.org/W3145083775"],"abstract_inverted_index":null,"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}