{"id":"https://openalex.org/W2017397987","doi":"https://doi.org/10.1039/b302118a","title":"Multi-layer plastic/glass microfluidic systems containing electrical and mechanical functionality","display_name":"Multi-layer plastic/glass microfluidic systems containing electrical and mechanical functionality","publication_year":2003,"publication_date":"2003-01-01","ids":{"openalex":"https://openalex.org/W2017397987","doi":"https://doi.org/10.1039/b302118a","mag":"2017397987","pmid":"https://pubmed.ncbi.nlm.nih.gov/15100766"},"language":"en","primary_location":{"id":"doi:10.1039/b302118a","doi":"https://doi.org/10.1039/b302118a","is_oa":false,"landing_page_url":"https://doi.org/10.1039/b302118a","pdf_url":null,"source":{"id":"https://openalex.org/S116836101","display_name":"Lab on a Chip","issn_l":"1473-0189","issn":["1473-0189","1473-0197"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-a","doyens","jufo-2","ki-jl-1","medline","norway-1","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320556","host_organization_name":"Royal Society of Chemistry","host_organization_lineage":["https://openalex.org/P4310320556"],"host_organization_lineage_names":["Royal Society of Chemistry"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lab on a Chip","raw_type":"journal-article"},"parent_works":[],"lineage":["https://openalex.org/W2017397987"],"child_works_count":0,"type":"article","is_traditional":true,"indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084191089","display_name":"Arum Han","orcid":"https://orcid.org/0000-0002-9223-8301","observed_orcids":["https://orcid.org/0000-0002-9223-8301"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Arum Han","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA. gt0478a@prism.gatech.edu","School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA 30332-0250 USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA. gt0478a@prism.gatech.edu","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA 30332-0250 USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005228731","display_name":"Olivia Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Olivia Wang","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035719109","display_name":"Mason Graff","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mason Graff","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033545451","display_name":"Swomitra K. Mohanty","orcid":"https://orcid.org/0000-0003-3496-1718","observed_orcids":["https://orcid.org/0000-0003-3496-1718"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Swomitra K. Mohanty","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080457574","display_name":"Thayne L. Edwards","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Thayne L. Edwards","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026673993","display_name":"Ki-Ho Han","orcid":"https://orcid.org/0000-0002-9102-1581","observed_orcids":["https://orcid.org/0000-0002-9102-1581"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ki-Ho Han","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045200705","display_name":"A. Bruno Frazier","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Bruno Frazier","raw_affiliation_strings":["School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical, and Computer Engineering, Georgia Institute of Technology, Atlanta, USA]","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5084191089"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":2.9834,"has_fulltext":false,"cited_by_count":55,"citation_normalized_percentile":{"value":0.89412919,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":97},"biblio":{"volume":"3","issue":"3","first_page":"150","last_page":"150"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.002099999925121665,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11407","display_name":"Innovative Microfluidic and Catalytic Techniques Innovation","score":0.0005000000237487257,"subfield":{"id":"https://openalex.org/subfields/1507","display_name":"Fluid Flow and Transfer Processes"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/hot-embossing","display_name":"hot embossing","score":0.7870000004768372},{"id":"https://openalex.org/keywords/injection-molding","display_name":"injection molding","score":0.9279999732971191},{"id":"https://openalex.org/keywords/stereolithography","display_name":"stereolithography","score":0.9620000123977661},{"id":"https://openalex.org/keywords/mems-fabrication","display_name":"MEMS fabrication","score":0.8809999823570251},{"id":"https://openalex.org/keywords/microactuators","display_name":"microactuators","score":0.8140000104904175},{"id":"https://openalex.org/keywords/micropumps","display_name":"micropumps","score":0.8619999885559082},{"id":"https://openalex.org/keywords/microvalves","display_name":"microvalves","score":0.796999990940094},{"id":"https://openalex.org/keywords/electrical-interconnects","display_name":"electrical interconnects","score":0.7680000066757202}],"concepts":[{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.7910124063491821},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7029669284820557},{"id":"https://openalex.org/C527607","wikidata":"https://www.wikidata.org/wiki/Q175538","display_name":"Microfabrication","level":4,"score":0.6654073596000671},{"id":"https://openalex.org/C2776303644","wikidata":"https://www.wikidata.org/wiki/Q1020499","display_name":"Interfacing","level":2,"score":0.6441203951835632},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6098722815513611},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5509169101715088},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.5446774363517761},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5426291823387146},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.43859028816223145},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.42408424615859985},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.35392895340919495},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1917334496974945},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.17088651657104492},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16170352697372437},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.07871231436729431},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[{"descriptor_ui":"D001672","descriptor_name":"Biocompatible Materials","qualifier_ui":"Q000737","qualifier_name":"chemistry","is_major_topic":false},{"descriptor_ui":"D004553","descriptor_name":"Electric Conductivity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D005898","descriptor_name":"Glass","qualifier_ui":"Q000737","qualifier_name":"chemistry","is_major_topic":true},{"descriptor_ui":"D008567","descriptor_name":"Membranes, Artificial","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008839","descriptor_name":"Microelectrodes","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D008855","descriptor_name":"Microscopy, Electron, Scanning","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D010781","descriptor_name":"Photography","qualifier_ui":"Q000379","qualifier_name":"methods","is_major_topic":false},{"descriptor_ui":"D010969","descriptor_name":"Plastics","qualifier_ui":"Q000737","qualifier_name":"chemistry","is_major_topic":true},{"descriptor_ui":"D011312","descriptor_name":"Pressure","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D044085","descriptor_name":"Microfluidics","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":true}],"locations_count":2,"locations":[{"id":"doi:10.1039/b302118a","doi":"https://doi.org/10.1039/b302118a","is_oa":false,"landing_page_url":"https://doi.org/10.1039/b302118a","pdf_url":null,"source":{"id":"https://openalex.org/S116836101","display_name":"Lab on a Chip","issn_l":"1473-0189","issn":["1473-0189","1473-0197"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-a","doyens","jufo-2","ki-jl-1","medline","norway-1","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320556","host_organization_name":"Royal Society of Chemistry","host_organization_lineage":["https://openalex.org/P4310320556"],"host_organization_lineage_names":["Royal Society of Chemistry"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lab on a Chip","raw_type":"journal-article"},{"id":"pmid:15100766","doi":null,"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/15100766","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lab on a chip","raw_type":"Journal Article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G7441113116","display_name":"INTEGRATED SAMPLE PREPARATION FOR GENOMIC ANALYSIS","funder_award_id":"R01ES010846","funder_id":"https://openalex.org/F4320337361","funder_display_name":"National Institute of Environmental Health Sciences"}],"funders":[{"id":"https://openalex.org/F4320337361","display_name":"National Institute of Environmental Health Sciences","ror":"https://ror.org/00j4k1h63"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W198547859","https://openalex.org/W2026908430","https://openalex.org/W2054116853","https://openalex.org/W2056645539","https://openalex.org/W2071311642","https://openalex.org/W2124645809","https://openalex.org/W2164464516","https://openalex.org/W2398343580","https://openalex.org/W2503697900"],"related_works":["https://openalex.org/W1627751690","https://openalex.org/W2135414630","https://openalex.org/W1563764510","https://openalex.org/W2164825097","https://openalex.org/W2314073410","https://openalex.org/W2034964231","https://openalex.org/W2006902409","https://openalex.org/W2496472754","https://openalex.org/W4214930763","https://openalex.org/W2028613715"],"abstract_inverted_index":{"This":[0],"paper":[1],"describes":[2],"an":[3,113],"approach":[4,33,75],"for":[5,22,91,103,116],"fabricating":[6],"multi-layer":[7,40,72],"microfluidic":[8,42],"systems":[9,43],"from":[10],"a":[11,84,89,101],"combination":[12],"of":[13,53,58,79,94,106],"glass":[14],"and":[15,19,38,46,60,111,119,126],"plastic":[16],"materials.":[17],"Methods":[18],"characterization":[20],"results":[21],"the":[23,27,71,77,92,98,104,123,127],"microfabrication":[24],"technologies":[25],"underlying":[26],"process":[28],"flow":[29],"are":[30],"presented.":[31],"The":[32,74],"is":[34],"used":[35],"to":[36,69],"fabricate":[37],"characterize":[39],"plastic/glass":[41,81],"containing":[44],"electrical":[45,95,120],"mechanical":[47],"functionality.":[48],"Hot":[49],"embossing,":[50],"heat":[51],"staking":[52],"plastics,":[54],"injection":[55],"molding,":[56],"microstenciling":[57],"electrodes,":[59],"stereolithography":[61],"were":[62],"combined":[63],"with":[64],"conventional":[65],"MEMS":[66],"fabrication":[67],"techniques":[68],"realize":[70],"systems.":[73],"enabled":[76],"integration":[78,93],"multiple":[80],"materials":[82],"into":[83],"single":[85],"monolithic":[86],"system,":[87,99],"provided":[88,100,112],"solution":[90],"functionality":[96],"throughout":[97],"mechanism":[102],"inclusion":[105],"microactuators":[107],"such":[108],"as":[109],"micropumps/valves,":[110],"interconnect":[114],"technology":[115],"interfacing":[117],"fluids":[118],"components":[121],"between":[122],"micro":[124],"system":[125],"macro":[128],"world.":[129]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":3}],"updated_date":"2026-11-06T12:05:46.655746","created_date":"2016-06-24T00:00:00"}