{"id":"https://openalex.org/W2016603846","doi":"https://doi.org/10.1109/ted.2012.2211878","title":"Proper-Orthogonal-Decomposition Based Thermal Modeling of Semiconductor Structures","display_name":"Proper-Orthogonal-Decomposition Based Thermal Modeling of Semiconductor Structures","publication_year":2012,"publication_date":"2012-09-17","ids":{"openalex":"https://openalex.org/W2016603846","doi":"https://doi.org/10.1109/ted.2012.2211878","mag":"2016603846"},"language":"en","primary_location":{"id":"doi:10.1109/ted.2012.2211878","doi":"https://doi.org/10.1109/ted.2012.2211878","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ted.2012.2211878","pdf_url":null,"source":{"id":"https://openalex.org/S162355128","display_name":"IEEE Transactions on Electron Devices","issn_l":"0018-9383","issn":["0018-9383","1557-9646"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-3","norway-2","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Electron Devices","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081125670","display_name":"Ravon Venters","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I16944753","display_name":"Clarkson University","ror":"https://ror.org/03rwgpn18","country_code":"US","type":"education","lineage":["https://openalex.org/I16944753"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Venters","raw_affiliation_strings":["Department of Mechanical and Aeronautical Engineering, Clarkson University, Potsdam, NY, USA","Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Aeronautical Engineering, Clarkson University, Potsdam, NY, USA","institution_ids":["https://openalex.org/I16944753"]},{"raw_affiliation_string":"Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY, USA","institution_ids":["https://openalex.org/I16944753"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065399285","display_name":"Brian T. Helenbrook","orcid":"https://orcid.org/0000-0002-6369-6805","observed_orcids":["https://orcid.org/0000-0002-6369-6805"]},"institutions":[{"id":"https://openalex.org/I16944753","display_name":"Clarkson University","ror":"https://ror.org/03rwgpn18","country_code":"US","type":"education","lineage":["https://openalex.org/I16944753"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. T. Helenbrook","raw_affiliation_strings":["Department of Mechanical and Aeronautical Engineering, Clarkson University, Potsdam, NY, USA","Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Aeronautical Engineering, Clarkson University, Potsdam, NY, USA","institution_ids":["https://openalex.org/I16944753"]},{"raw_affiliation_string":"Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY, USA","institution_ids":["https://openalex.org/I16944753"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5119011488","display_name":"Kun Zhang","orcid":"https://orcid.org/0000-0003-0054-2099","observed_orcids":["https://orcid.org/0000-0003-0054-2099","https://orcid.org/0000-0001-9173-4904"]},"institutions":[{"id":"https://openalex.org/I16944753","display_name":"Clarkson University","ror":"https://ror.org/03rwgpn18","country_code":"US","type":"education","lineage":["https://openalex.org/I16944753"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kun Zhang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Clarkson University, Potsdam, NY, USA","Dept. of Electr. & Comput. Eng., Clarkson Univ., Potsdam, NY, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Clarkson University, Potsdam, NY, USA","institution_ids":["https://openalex.org/I16944753"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Clarkson Univ., Potsdam, NY, USA#TAB#","institution_ids":["https://openalex.org/I16944753"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039752940","display_name":"Ming\u2010C. Cheng","orcid":"https://orcid.org/0000-0001-8092-5457","observed_orcids":["https://orcid.org/0000-0001-8092-5457"]},"institutions":[{"id":"https://openalex.org/I16944753","display_name":"Clarkson University","ror":"https://ror.org/03rwgpn18","country_code":"US","type":"education","lineage":["https://openalex.org/I16944753"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.-C Cheng","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Clarkson University, Potsdam, NY, USA","Dept. of Electr. & Comput. Eng., Clarkson Univ., Potsdam, NY, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Clarkson University, Potsdam, NY, USA","institution_ids":["https://openalex.org/I16944753"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Clarkson Univ., Potsdam, NY, USA#TAB#","institution_ids":["https://openalex.org/I16944753"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I16944753"],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":0.9695,"has_fulltext":false,"cited_by_count":33,"citation_normalized_percentile":{"value":0.74150552,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"59","issue":"11","first_page":"2924","last_page":"2931"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11206","display_name":"Model Reduction and Neural Networks","score":0.986299991607666,"subfield":{"id":"https://openalex.org/subfields/3109","display_name":"Statistical and Nonlinear Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11206","display_name":"Model Reduction and Neural Networks","score":0.986299991607666,"subfield":{"id":"https://openalex.org/subfields/3109","display_name":"Statistical and Nonlinear Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.003800000064074993,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.0024999999441206455,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/proper-orthogonal-decomposition","display_name":"proper orthogonal decomposition","score":0.9879999756813049},{"id":"https://openalex.org/keywords/thermal-modeling","display_name":"thermal modeling","score":0.8619999885559082},{"id":"https://openalex.org/keywords/semiconductor-devices","display_name":"semiconductor devices","score":0.7450000047683716},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"silicon-on-insulator","score":0.9409999847412109},{"id":"https://openalex.org/keywords/hot-spot-temperature","display_name":"hot spot temperature","score":0.671999990940094},{"id":"https://openalex.org/keywords/temperature-gradient","display_name":"temperature gradient","score":0.6179999709129333},{"id":"https://openalex.org/keywords/lumped-thermal-model","display_name":"lumped thermal model","score":0.6980000138282776},{"id":"https://openalex.org/keywords/power-dissipation","display_name":"power dissipation","score":0.5479999780654907}],"concepts":[{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.633863627910614},{"id":"https://openalex.org/C137776501","wikidata":"https://www.wikidata.org/wiki/Q7208270","display_name":"Point of delivery","level":2,"score":0.5936893224716187},{"id":"https://openalex.org/C68028875","wikidata":"https://www.wikidata.org/wiki/Q7572595","display_name":"Space mapping","level":2,"score":0.5235264301300049},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.5168150663375854},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4596535563468933},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.4255882203578949},{"id":"https://openalex.org/C160434732","wikidata":"https://www.wikidata.org/wiki/Q2611095","display_name":"Thermal decomposition","level":2,"score":0.4194898009300232},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.4146694540977478},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34836041927337646},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.3376227021217346},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3298167586326599},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2748264670372009},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2529242932796478},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1741735339164734},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.16352498531341553},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15163248777389526},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.14852562546730042},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C6557445","wikidata":"https://www.wikidata.org/wiki/Q173113","display_name":"Agronomy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ted.2012.2211878","doi":"https://doi.org/10.1109/ted.2012.2211878","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ted.2012.2211878","pdf_url":null,"source":{"id":"https://openalex.org/S162355128","display_name":"IEEE Transactions on Electron Devices","issn_l":"0018-9383","issn":["0018-9383","1557-9646"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-3","norway-2","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Electron Devices","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":46,"referenced_works":["https://openalex.org/W1505358753","https://openalex.org/W1579236455","https://openalex.org/W1964594009","https://openalex.org/W1967352511","https://openalex.org/W1969922173","https://openalex.org/W1981831296","https://openalex.org/W1989662144","https://openalex.org/W1994089881","https://openalex.org/W1994850555","https://openalex.org/W2017503182","https://openalex.org/W2026193452","https://openalex.org/W2027042255","https://openalex.org/W2031005460","https://openalex.org/W2032768921","https://openalex.org/W2046574526","https://openalex.org/W2047463089","https://openalex.org/W2049884414","https://openalex.org/W2051431054","https://openalex.org/W2078202449","https://openalex.org/W2092508481","https://openalex.org/W2098706809","https://openalex.org/W2100895126","https://openalex.org/W2108938452","https://openalex.org/W2114224585","https://openalex.org/W2115753159","https://openalex.org/W2116752984","https://openalex.org/W2117499272","https://openalex.org/W2118977679","https://openalex.org/W2123861683","https://openalex.org/W2126506946","https://openalex.org/W2128282513","https://openalex.org/W2129960401","https://openalex.org/W2130517400","https://openalex.org/W2130611960","https://openalex.org/W2131714439","https://openalex.org/W2133868749","https://openalex.org/W2135818056","https://openalex.org/W2139168617","https://openalex.org/W2145652919","https://openalex.org/W2147955607","https://openalex.org/W2148749654","https://openalex.org/W2153328462","https://openalex.org/W2157578122","https://openalex.org/W2160147441","https://openalex.org/W3107714133","https://openalex.org/W4321855414"],"related_works":["https://openalex.org/W2320712003","https://openalex.org/W2024291276","https://openalex.org/W2045640552","https://openalex.org/W2067847186","https://openalex.org/W7084093582","https://openalex.org/W2009606090","https://openalex.org/W3189836452","https://openalex.org/W2314874276","https://openalex.org/W2061526584","https://openalex.org/W2735533598"],"abstract_inverted_index":{"A":[0,150],"thermal":[1,19,50,63,74,78,84,111],"model":[2,20,79,112,142,152],"of":[3,72,86,143],"a":[4,10,66,87,109,157],"semiconductor":[5],"structure":[6,92,147],"is":[7,21,45,80,106,148],"developed":[8],"using":[9,23,113],"hierarchical":[11],"function":[12],"space,":[13],"rather":[14],"than":[15],"physical":[16,37],"space.":[17],"The":[18,52,76],"derived":[22,123],"the":[24,36,120,127,134,144],"proper":[25],"orthogonal":[26],"decomposition":[27],"(POD)":[28],"and":[29,60,93,130],"does":[30],"not":[31],"require":[32],"any":[33],"assumptions":[34],"about":[35],"geometry,":[38],"dimensions,":[39],"or":[40],"heat":[41],"flow":[42],"paths,":[43],"as":[44],"usually":[46],"necessary":[47],"for":[48],"compact/lumped":[49],"models.":[51,75],"approach":[53],"can":[54,118],"be":[55],"applied":[56,81],"to":[57,70,82,163],"complex":[58],"geometries":[59],"provides":[61],"detailed":[62,100],"information":[64],"at":[65,95],"computational":[67],"cost":[68],"comparable":[69],"that":[71,108],"lumped":[73],"POD":[77,110,116,141,151],"steady":[83],"simulations":[85],"2-D":[88],"silicon-on-insulator":[89],"(SOI)":[90],"device":[91,135,146],"validated":[94],"various":[96],"power":[97],"levels":[98],"against":[99],"numerical":[101],"simulation":[102],"(DNS)":[103],"data.":[104],"It":[105],"shown":[107],"only":[114],"four":[115],"modes":[117,155],"duplicate":[119],"temperature":[121,131],"solution":[122,160],"from":[124],"DNS,":[125],"including":[126],"hot":[128],"spot":[129],"gradients":[132],"along":[133],"island.":[136],"In":[137],"addition,":[138],"an":[139],"unsteady":[140,165],"SOI":[145],"constructed.":[149],"incorporating":[153],"ten":[154],"yielded":[156],"virtually":[158],"identical":[159],"when":[161],"compared":[162],"corresponding":[164],"DNS":[166],"results.":[167]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":4},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":3}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}