{"id":"https://openalex.org/W2015449058","doi":"https://doi.org/10.1016/s0041-624x(99)00173-0","title":"High-frequency ultrasonic wire bonding systems","display_name":"High-frequency ultrasonic wire bonding systems","publication_year":2000,"publication_date":"2000-03-01","ids":{"openalex":"https://openalex.org/W2015449058","doi":"https://doi.org/10.1016/s0041-624x(99)00173-0","mag":"2015449058","pmid":"https://pubmed.ncbi.nlm.nih.gov/10829633"},"language":"en","primary_location":{"id":"doi:10.1016/s0041-624x(99)00173-0","doi":"https://doi.org/10.1016/s0041-624x(99)00173-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0041-624x(99)00173-0","pdf_url":null,"source":{"id":"https://openalex.org/S168745376","display_name":"Ultrasonics","issn_l":"0041-624X","issn":["0041-624X","1874-9968"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","doyens","jufo-1","medline","norway-1","poland-140","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Ultrasonics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113688368","display_name":"Jiromaru Tsujino","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I41802502","display_name":"Kanagawa University","ror":"https://ror.org/02j6c0d67","country_code":"JP","type":"education","lineage":["https://openalex.org/I41802502"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Jiromaru Tsujino","raw_affiliation_strings":["Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan","Faculty of Engineering, Kanagawa University, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan","institution_ids":["https://openalex.org/I41802502"]},{"raw_affiliation_string":"Faculty of Engineering, Kanagawa University, Yokohama, Japan","institution_ids":["https://openalex.org/I41802502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087255862","display_name":"Hiroyuki Yoshihara","orcid":"https://orcid.org/0000-0001-9306-2849","observed_orcids":["https://orcid.org/0000-0001-9306-2849"]},"institutions":[{"id":"https://openalex.org/I41802502","display_name":"Kanagawa University","ror":"https://ror.org/02j6c0d67","country_code":"JP","type":"education","lineage":["https://openalex.org/I41802502"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroyuki Yoshihara","raw_affiliation_strings":["Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan","institution_ids":["https://openalex.org/I41802502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108391144","display_name":"Tsutomu Sano","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I41802502","display_name":"Kanagawa University","ror":"https://ror.org/02j6c0d67","country_code":"JP","type":"education","lineage":["https://openalex.org/I41802502"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tsutomu Sano","raw_affiliation_strings":["Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan","institution_ids":["https://openalex.org/I41802502"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5046470280","display_name":"Shigeru Ihara","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I41802502","display_name":"Kanagawa University","ror":"https://ror.org/02j6c0d67","country_code":"JP","type":"education","lineage":["https://openalex.org/I41802502"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shigeru Ihara","raw_affiliation_strings":["Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Kanagawa University, Yokohama 221-8686, Japan","institution_ids":["https://openalex.org/I41802502"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5113688368"],"corresponding_institution_ids":["https://openalex.org/I41802502"],"apc_list":{"value":3680,"currency":"USD","value_usd":3680},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":32,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"38","issue":"1-8","first_page":"77","last_page":"80"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9185000061988831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9185000061988831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11525","display_name":"Piezoelectric Actuators and Control","score":0.021400000900030136,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.019700000062584877,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ultrasonic-wire-bonding","display_name":"ultrasonic wire bonding","score":0.9980000257492065},{"id":"https://openalex.org/keywords/high-frequency-vibration","display_name":"high-frequency vibration","score":0.7799999713897705},{"id":"https://openalex.org/keywords/flip-chip-bonding","display_name":"flip-chip bonding","score":0.8059999942779541},{"id":"https://openalex.org/keywords/semiconductor-packaging","display_name":"semiconductor packaging","score":0.48899999260902405},{"id":"https://openalex.org/keywords/vibration-distribution","display_name":"vibration distribution","score":0.7429999709129333},{"id":"https://openalex.org/keywords/transducers","display_name":"transducers","score":0.38999998569488525}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7915022373199463},{"id":"https://openalex.org/C198394728","wikidata":"https://www.wikidata.org/wiki/Q3695508","display_name":"Vibration","level":2,"score":0.7532141208648682},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.7376296520233154},{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.6768650412559509},{"id":"https://openalex.org/C154954056","wikidata":"https://www.wikidata.org/wiki/Q1604164","display_name":"Transverse plane","level":2,"score":0.6146879196166992},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.5821247696876526},{"id":"https://openalex.org/C2778922904","wikidata":"https://www.wikidata.org/wiki/Q580160","display_name":"Ultrasonic welding","level":3,"score":0.5497182607650757},{"id":"https://openalex.org/C56318395","wikidata":"https://www.wikidata.org/wiki/Q215928","display_name":"Transducer","level":2,"score":0.5336889028549194},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.47034862637519836},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4412563145160675},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3535461127758026},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.25663256645202637},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.16416782140731812},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14446941018104553},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08270591497421265},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1016/s0041-624x(99)00173-0","doi":"https://doi.org/10.1016/s0041-624x(99)00173-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0041-624x(99)00173-0","pdf_url":null,"source":{"id":"https://openalex.org/S168745376","display_name":"Ultrasonics","issn_l":"0041-624X","issn":["0041-624X","1874-9968"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","doyens","jufo-1","medline","norway-1","poland-140","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Ultrasonics","raw_type":"journal-article"},{"id":"pmid:10829633","doi":null,"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/10829633","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Ultrasonics","raw_type":"Journal Article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320320912","display_name":"Ministry of Education, Culture, Sports, Science and Technology","ror":"https://ror.org/048rj2z13"},{"id":"https://openalex.org/F4320322855","display_name":"Mashhad University of Medical Sciences","ror":"https://ror.org/04sfka033"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2105538980","https://openalex.org/W4240860146"],"related_works":["https://openalex.org/W2131273131","https://openalex.org/W2123531393","https://openalex.org/W324986911","https://openalex.org/W2030077004","https://openalex.org/W2105538980","https://openalex.org/W2045305335","https://openalex.org/W2037641995","https://openalex.org/W2171449057","https://openalex.org/W2345452441","https://openalex.org/W2105065059"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2026-08-21T09:56:20.448147","created_date":"2016-06-24T00:00:00"}