{"id":"https://openalex.org/W2014523899","doi":"https://doi.org/10.1117/12.970395","title":"Mask characterization for CDU budget breakdown in advanced EUV lithography","display_name":"Mask characterization for CDU budget breakdown in advanced EUV lithography","publication_year":2012,"publication_date":"2012-11-08","ids":{"openalex":"https://openalex.org/W2014523899","doi":"https://doi.org/10.1117/12.970395","mag":"2014523899"},"language":"en","primary_location":{"id":"doi:10.1117/12.970395","doi":"https://doi.org/10.1117/12.970395","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.970395","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5012519581","display_name":"Peter Nikolsky","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Peter Nikolsky","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081577334","display_name":"Chris Strolenberg","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Chris Strolenberg","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Rasmus Nielsen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Rasmus Nielsen","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018197357","display_name":"Tjitte Nooitgedacht","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Tjitte Nooitgedacht","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063113611","display_name":"Natalia V. Davydova","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Natalia Davydova","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061115157","display_name":"Greg Yang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Greg Yang","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Shawn Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Shawn Lee","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078550943","display_name":"Chang-Min Park","orcid":"https://orcid.org/0009-0000-0554-7740","observed_orcids":["https://orcid.org/0009-0000-0554-7740"]},"institutions":[{"id":"https://openalex.org/I4405259277","display_name":"Samsung Electronics (South Korea)","ror":"https://ror.org/020m7t761","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chang-Min Park","raw_affiliation_strings":["SAMSUNG Electronics Co., Ltd., (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SAMSUNG Electronics Co., Ltd., (Korea, Republic of)","institution_ids":["https://openalex.org/I4405259277"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101590941","display_name":"Insung Kim","orcid":"https://orcid.org/0000-0003-4927-9746","observed_orcids":["https://orcid.org/0000-0003-4927-9746"]},"institutions":[{"id":"https://openalex.org/I4405259277","display_name":"Samsung Electronics (South Korea)","ror":"https://ror.org/020m7t761","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Insung Kim","raw_affiliation_strings":["SAMSUNG Electronics Co., Ltd., (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SAMSUNG Electronics Co., Ltd., (Korea, Republic of)","institution_ids":["https://openalex.org/I4405259277"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110971019","display_name":"Jeongho Yeo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405259277","display_name":"Samsung Electronics (South Korea)","ror":"https://ror.org/020m7t761","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jeong-Ho Yeo","raw_affiliation_strings":["SAMSUNG Electronics Co., Ltd., (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SAMSUNG Electronics Co., Ltd., (Korea, Republic of)","institution_ids":["https://openalex.org/I4405259277"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.12011745,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"8522","issue":null,"first_page":"85220P","last_page":"85220P"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/critical-dimension-uniformity","display_name":"critical dimension uniformity","score":0.9660000205039978},{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.9399999976158142},{"id":"https://openalex.org/keywords/reticle","display_name":"reticle","score":0.5989999771118164},{"id":"https://openalex.org/keywords/arf-excimer-laser-lithography","display_name":"ArF excimer laser lithography","score":0.6259999871253967},{"id":"https://openalex.org/keywords/lithography-process-control","display_name":"lithography process control","score":0.5659999847412109}],"concepts":[{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.991736650466919},{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9460606575012207},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.6890220642089844},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.622492253780365},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6002950072288513},{"id":"https://openalex.org/C2779751349","wikidata":"https://www.wikidata.org/wiki/Q1474480","display_name":"Scanner","level":2,"score":0.5814353823661804},{"id":"https://openalex.org/C146024833","wikidata":"https://www.wikidata.org/wiki/Q1385457","display_name":"Extreme ultraviolet","level":3,"score":0.5568439364433289},{"id":"https://openalex.org/C207789793","wikidata":"https://www.wikidata.org/wiki/Q3028070","display_name":"Critical dimension","level":2,"score":0.5440894365310669},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5249728560447693},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.49267131090164185},{"id":"https://openalex.org/C14737013","wikidata":"https://www.wikidata.org/wiki/Q1319657","display_name":"Photomask","level":4,"score":0.45382511615753174},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41161173582077026},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.36561793088912964},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2771534323692322},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.17192554473876953},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16853851079940796},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.12008383870124817},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.970395","doi":"https://doi.org/10.1117/12.970395","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.970395","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2066871332","https://openalex.org/W2094793671","https://openalex.org/W2165851749"],"related_works":["https://openalex.org/W2090018840","https://openalex.org/W7104272122","https://openalex.org/W2601525746","https://openalex.org/W2301305428","https://openalex.org/W2056026186","https://openalex.org/W2016696605","https://openalex.org/W2897032074","https://openalex.org/W2954337729","https://openalex.org/W1999855891","https://openalex.org/W2121865050"],"abstract_inverted_index":{"As":[0],"the":[1,48,63,114,153,158,188,223,234,247,260,277,280,302,326,342],"ITRS":[2],"Critical":[3],"Dimension":[4],"Uniformity":[5],"(CDU)":[6],"specification":[7],"shrinks,":[8],"semiconductor":[9,359],"companies":[10],"need":[11],"to":[12,131,233,282,299,340,348],"maintain":[13],"a":[14,23,77,138,146,257],"high":[15,24],"yield":[16],"of":[17,30,42,47,59,79,113,157,174,237,252,291,301,305,325,344,352],"good":[18],"wafers":[19],"per":[20,317],"day":[21],"and":[22,40,54,69,83,100,120,177,197,226,264,312,319,337,347,355],"performance":[25],"(and":[26],"hence":[27,178],"market":[28],"value)":[29],"finished":[31],"products.":[32],"This":[33,191,296],"cannot":[34],"be":[35,135,193,210,228,266,283],"achieved":[36,334],"without":[37],"continuous":[38],"analysis":[39,290],"improvement":[41],"on-product":[43],"CDU":[44,81,87,109,123,133,151,159,186,239,263,307,314,328],"as":[45,230],"one":[46,112],"main":[49,60,115],"drivers":[50],"for":[51,93,259,270,276,330],"process":[52],"control":[53],"optimization":[55],"with":[56,98,149],"better":[57,323],"understanding":[58,324],"contributors":[61],"from":[62],"litho":[64],"cluster:":[65],"mask,":[66],"process,":[67],"metrology":[68],"scanner.":[70],"In":[71],"this":[72,108,166,202,292],"paper":[73],"we":[74],"will":[75,105,192],"demonstrate":[76],"study":[78],"mask":[80,141,175,182,205,303],"characterization":[82,300,308],"its":[84],"impact":[85,183,218],"on":[86,180,184,195,219],"Budget":[88,315],"Breakdown":[89,316],"(CDU":[90],"BB)":[91],"performed":[92],"an":[94,310],"advanced":[95,331],"EUV":[96,122,238,249,271,306],"lithography":[97],"1D":[99,196],"2D":[101,198],"feature":[102,199],"cases.":[103,250],"We":[104,126,241,273],"show":[106],"that":[107,128],"contributor":[110,232],"is":[111,294],"differentiators":[116],"between":[117],"well-known":[118],"ArFi":[119],"new":[121],"budgeting":[124],"principles.":[125],"found":[127],"reticle":[129,150,155,235],"contribution":[130],"intrafield":[132,185,220,262],"should":[134,209,227],"characterized":[136,274],"in":[137,152,201,246,285,358],"specific":[139],"way:":[140],"absorber":[142],"thickness":[143],"fingerprints":[144,215,245],"play":[145,256],"role":[147,258],"comparable":[148],"total":[154,181,261],"part":[156,236,304],"budget.":[160,240],"Wafer":[161],"CD":[162],"fingerprints,":[163],"introduced":[164],"by":[165,335],"contributor,":[167],"may":[168,170,254,265],"or":[169],"not":[171],"compensate":[172],"variations":[173,208],"CD\u2019s":[176],"influence":[179],"at":[187,222],"wafer":[189,224],"level.":[190],"shown":[194],"examples":[200],"paper.":[203],"Also":[204],"stack":[206],"reflectivity":[207],"taken":[211,267],"into":[212,268],"account:":[213],"these":[214],"have":[216],"visible":[217],"CDs":[221],"level":[225],"considered":[229],"another":[231],"observed":[242],"also":[243,255],"MEEF-through-field":[244,275],"studied":[248],"Variations":[251],"MEEF":[253],"account":[269],"Lithography.":[272],"reviewed":[278],"features,":[279],"results":[281],"discussed":[284],"our":[286],"paper,":[287],"but":[288],"further":[289],"phenomenon":[293],"required.":[295],"comprehensive":[297],"approach":[298],"delivers":[309],"accurate":[311],"integral":[313],"product/process":[318],"Litho":[320],"tool.":[321],"The":[322],"entire":[327],"budget":[329],"EUVL":[332],"nodes":[333],"Samsung":[336],"ASML":[338],"helps":[339],"extend":[341],"limits":[343],"Moore's":[345],"Law":[346],"deliver":[349],"successful":[350],"implementation":[351],"smaller,":[353],"faster":[354],"smarter":[356],"chips":[357],"industry.":[360]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}