{"id":"https://openalex.org/W2014479332","doi":"https://doi.org/10.1117/12.637280","title":"ALTA 4700 system mask patterning performance improvements for X-architecture and wafer electrical performance interchangeability with 50kV E-beam","display_name":"ALTA 4700 system mask patterning performance improvements for X-architecture and wafer electrical performance interchangeability with 50kV E-beam","publication_year":2005,"publication_date":"2005-06-16","ids":{"openalex":"https://openalex.org/W2014479332","doi":"https://doi.org/10.1117/12.637280","mag":"2014479332"},"language":"en","primary_location":{"id":"doi:10.1117/12.637280","doi":"https://doi.org/10.1117/12.637280","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.637280","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110681053","display_name":"Paul C. Allen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul C. Allen","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011983912","display_name":"Mike Bohan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mike Bohan","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067538919","display_name":"Eric R. Christenson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric R. Christenson","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063465367","display_name":"Huixiong Dai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. Dai","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111613469","display_name":"Michael P. Duane","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Duane","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086275445","display_name":"H. Christopher Hamaker","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. C. Hamaker","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019202301","display_name":"Sam C. Howells","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sam C. Howells","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051390017","display_name":"Boaz Kenan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Boaz Kenan","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011015419","display_name":"Peter Y. Pirogovsky","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Peter Pirogovsky","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082051841","display_name":"Malik K. Sadiq","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Malik K. Sadiq","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031766820","display_name":"Robin L. Teitzel","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robin Teitzel","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]},{"author_position":"last","author":{"id":null,"display_name":"Michael White","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I193427800","display_name":"Applied Materials (United States)","ror":"https://ror.org/04h1q4c89","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael White","raw_affiliation_strings":["Etec Systems, Inc., Applied Materials, Inc. (United States)","Etec Systems Inc./Applied Materials, Inc. (USA)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etec Systems, Inc., Applied Materials, Inc. (United States)","institution_ids":["https://openalex.org/I193427800"]},{"raw_affiliation_string":"Etec Systems Inc./Applied Materials, Inc. (USA)","institution_ids":["https://openalex.org/I193427800"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I193427800"],"apc_list":null,"apc_paid":null,"fwci":0.5628,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.62314457,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"5835","issue":null,"first_page":"37","last_page":"37"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/acousto-optic-deflector","display_name":"acousto-optic deflector","score":0.9580000042915344},{"id":"https://openalex.org/keywords/overlay-performance","display_name":"overlay performance","score":0.5070000290870667},{"id":"https://openalex.org/keywords/critical-dimension-uniformity","display_name":"critical dimension uniformity","score":0.9179999828338623},{"id":"https://openalex.org/keywords/optical-proximity-correction","display_name":"optical proximity correction","score":0.8240000009536743}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6785603761672974},{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.6466896533966064},{"id":"https://openalex.org/C2779606619","wikidata":"https://www.wikidata.org/wiki/Q17092524","display_name":"Interchangeability","level":2,"score":0.5390732884407043},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.5353842973709106},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5267797708511353},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.5170255899429321},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.512309193611145},{"id":"https://openalex.org/C2778925768","wikidata":"https://www.wikidata.org/wiki/Q3454718","display_name":"Reflectometry","level":3,"score":0.4366081953048706},{"id":"https://openalex.org/C207789793","wikidata":"https://www.wikidata.org/wiki/Q3028070","display_name":"Critical dimension","level":2,"score":0.43502187728881836},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.38992738723754883},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.20958107709884644},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C103824480","wikidata":"https://www.wikidata.org/wiki/Q185889","display_name":"Time domain","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.637280","doi":"https://doi.org/10.1117/12.637280","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.637280","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2052807431","https://openalex.org/W1993963300","https://openalex.org/W2078187185","https://openalex.org/W1983824443","https://openalex.org/W2017052621","https://openalex.org/W2006215641","https://openalex.org/W4297824423","https://openalex.org/W2040357607","https://openalex.org/W1998006415","https://openalex.org/W2035027670"],"abstract_inverted_index":{"The":[0,40,53,88,212],"capability":[1],"and":[2,28,36,84,96,98,116,159,176],"performance":[3,43,75,130,143,246],"of":[4,17,184,194,217],"the":[5,15,50,146,192,215,229,235],"production-proven":[6],"DUV":[7,197],"ALTA":[8,68,147,198],"4300":[9],"system":[10,199],"has":[11,44,61,104],"been":[12,45,62],"extended":[13],"by":[14,47,57,145],"development":[16],"two":[18,219],"new":[19,66],"optical":[20],"subsystems:":[21],"a":[22,29,65,181,207],"0.9":[23],"NA,":[24],"42X":[25],"reduction":[26],"lens":[27],"high-bandwidth":[30],"acousto-optic":[31],"deflector":[32],"based":[33],"beam":[34,93,100,210],"position":[35],"intensity":[37,101],"correction":[38],"servo.":[39],"PSM":[41],"overlay":[42,129],"improved":[46,73],"modifications":[48],"to":[49,109,112,120,123,228],"software":[51],"algorithms.":[52],"enhanced":[54],"performance,":[55],"delivered":[56,144],"these":[58,218],"subsystem":[59,90],"improvements,":[60],"introduced":[63],"as":[64],"product-the":[67],"4700.":[69,148],"Characterization":[70,149,238],"data":[71,150,239],"show":[72,151],"resolution":[74],"in":[76,155,169],"line":[77],"end":[78],"shortening,":[79],"through":[80,180],"pitch":[81],"CD":[82,107,118,153,167],"bias":[83],"feature":[85],"corner":[86],"acuity.":[87],"AOD":[89],"reduces":[91],"stripe":[92],"placement":[94],"errors":[95],"random":[97],"systematic":[99],"errors.":[102],"This":[103,137],"enabled":[105],"local":[106],"uniformity":[108,119,154],"be":[110,121],"reduced":[111,122],"4.3":[113],"nm":[114,125,134],"(3\u03c3)":[115],"global":[117,152],"6":[124],"(3\u03c3).":[126],"Second":[127],"layer":[128],"is":[131],"now":[132],"20":[133],"(max":[135],"error).":[136],"paper":[138],"also":[139],"demonstrates":[140,191],"superior":[141],"X-Architecture":[142],"0\u00b0,":[156],"45\u00b0,":[157],"90\u00b0,":[158],"135\u00b0":[160],"orientations":[161,172],"better":[162],"than":[163,174],"6.5nm":[164],"(3\u03c3);":[165],"mean":[166],"control":[168],"all":[170],"4":[171],"less":[173],"3.6nm;":[175],"smooth":[177],"angled":[178],"lines":[179],"wide":[182],"range":[183],"angles.":[185],"A":[186],"split":[187],"lot":[188],"wafer":[189,230,243],"evaluation":[190,213],"equivalence":[193],"wafers":[195],"produced":[196,203],"reticles":[200,205],"vs.":[201],"those":[202],"with":[204],"from":[206],"50kV":[208,236],"electron":[209],"system.":[211],"shows":[214],"interchangeability":[216],"systems":[220],"for":[221,234],"90nm":[222],"Metal":[223],"1":[224],"applications-with":[225],"no":[226],"changes":[227],"OPC":[231],"(originally":[232],"optimized":[233],"system).":[237],"focus":[240],"on":[241],"final":[242],"electrical":[244],"performance-the":[245],"characteristic":[247],"that":[248],"determines":[249],"ultimate":[250],"integrated":[251],"circuit":[252],"device":[253],"yield.":[254]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2016-06-24T00:00:00"}