{"id":"https://openalex.org/W2013961269","doi":"https://doi.org/10.1080/00218460600646537","title":"Controlling Interfacial Interpenetration and Fracture Properties of Polyimide/Epoxy Interfaces","display_name":"Controlling Interfacial Interpenetration and Fracture Properties of Polyimide/Epoxy Interfaces","publication_year":2006,"publication_date":"2006-04-01","ids":{"openalex":"https://openalex.org/W2013961269","doi":"https://doi.org/10.1080/00218460600646537","mag":"2013961269"},"language":"en","primary_location":{"id":"doi:10.1080/00218460600646537","doi":"https://doi.org/10.1080/00218460600646537","is_oa":false,"landing_page_url":"https://doi.org/10.1080/00218460600646537","pdf_url":null,"source":{"id":"https://openalex.org/S4210168442","display_name":"The Journal of Adhesion","issn_l":"0021-8464","issn":["0021-8464","1026-5414","1545-5823","1563-518X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["dongbi-b","jufo-1","norway-1","poland-100","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320547","host_organization_name":"Taylor & Francis","host_organization_lineage":["https://openalex.org/P4310320547","https://openalex.org/P4310320449"],"host_organization_lineage_names":["Taylor & Francis","Informa"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The Journal of Adhesion","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113571949","display_name":"Charan K. Gurumurthy","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Charan Gurumurthy","raw_affiliation_strings":["Department of Materials, University of California at Santa Barbara, Santa Barbara, California, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials, University of California at Santa Barbara, Santa Barbara, California, USA","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108081503","display_name":"Edward J. Kr\u00e4mer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Edward J. Kramer","raw_affiliation_strings":["Department of Materials, Department of Chemical Engineering, University of California at Santa Barbara, Santa Barbara, California, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials, Department of Chemical Engineering, University of California at Santa Barbara, Santa Barbara, California, USA","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5009476002","display_name":"Chung\u2010Yuen Hui","orcid":"https://orcid.org/0000-0001-7270-6000","observed_orcids":["https://orcid.org/0000-0001-7270-6000"]},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chung-Yuen Hui","raw_affiliation_strings":["Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, New York, USA","Department of Theoretical & Applied Mechanics, Cornell University,Ithaca,New York, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, New York, USA","institution_ids":["https://openalex.org/I205783295"]},{"raw_affiliation_string":"Department of Theoretical & Applied Mechanics, Cornell University,Ithaca,New York, USA","institution_ids":["https://openalex.org/I205783295"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5108081503"],"corresponding_institution_ids":["https://openalex.org/I154570441"],"apc_list":null,"apc_paid":null,"fwci":1.4921,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.78723631,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":95},"biblio":{"volume":"82","issue":"3","first_page":"239","last_page":"266"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12084","display_name":"Synthesis and properties of polymers","score":0.40310001373291016,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12084","display_name":"Synthesis and properties of polymers","score":0.40310001373291016,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.336899995803833,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.08160000294446945,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fracture-energy","display_name":"fracture energy","score":0.7739999890327454},{"id":"https://openalex.org/keywords/surface-modification","display_name":"surface modification","score":0.6029999852180481},{"id":"https://openalex.org/keywords/polyamic-acid","display_name":"polyamic acid","score":0.8140000104904175},{"id":"https://openalex.org/keywords/subcritical-crack-growth","display_name":"subcritical crack growth","score":0.7559999823570251},{"id":"https://openalex.org/keywords/water-transport","display_name":"water transport","score":0.4970000088214874},{"id":"https://openalex.org/keywords/interfacial-toughness","display_name":"interfacial toughness","score":0.6129999756813049},{"id":"https://openalex.org/keywords/microelectronics-packaging","display_name":"microelectronic packaging","score":0.5879999995231628},{"id":"https://openalex.org/keywords/polymer-adhesion","display_name":"polymer adhesion","score":0.4440000057220459}],"concepts":[{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.8973561525344849},{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.8766405582427979},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8165704011917114},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.6230951547622681},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5480268001556396},{"id":"https://openalex.org/C180577832","wikidata":"https://www.wikidata.org/wiki/Q127920","display_name":"Covalent bond","level":2,"score":0.4885459840297699},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.47058239579200745},{"id":"https://openalex.org/C188027245","wikidata":"https://www.wikidata.org/wiki/Q750446","display_name":"Polymer chemistry","level":1,"score":0.36215680837631226},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12713220715522766},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.1264277994632721},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.10566163063049316}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1080/00218460600646537","doi":"https://doi.org/10.1080/00218460600646537","is_oa":false,"landing_page_url":"https://doi.org/10.1080/00218460600646537","pdf_url":null,"source":{"id":"https://openalex.org/S4210168442","display_name":"The Journal of Adhesion","issn_l":"0021-8464","issn":["0021-8464","1026-5414","1545-5823","1563-518X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["dongbi-b","jufo-1","norway-1","poland-100","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320547","host_organization_name":"Taylor & Francis","host_organization_lineage":["https://openalex.org/P4310320547","https://openalex.org/P4310320449"],"host_organization_lineage_names":["Taylor & Francis","Informa"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The Journal of Adhesion","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W36426920","https://openalex.org/W55743848","https://openalex.org/W585897249","https://openalex.org/W625165786","https://openalex.org/W1552193818","https://openalex.org/W1572531098","https://openalex.org/W1976922403","https://openalex.org/W1978858357","https://openalex.org/W1980210048","https://openalex.org/W1987755432","https://openalex.org/W1991084009","https://openalex.org/W2012073902","https://openalex.org/W2015166835","https://openalex.org/W2016886289","https://openalex.org/W2020032651","https://openalex.org/W2026001633","https://openalex.org/W2051570820","https://openalex.org/W2062223878","https://openalex.org/W2068630300","https://openalex.org/W2082398369","https://openalex.org/W2087291539","https://openalex.org/W2092201519","https://openalex.org/W2107052957","https://openalex.org/W2133652536","https://openalex.org/W2140267997","https://openalex.org/W2155452595","https://openalex.org/W2158044699","https://openalex.org/W2171949338","https://openalex.org/W2593166163","https://openalex.org/W3158761656","https://openalex.org/W4251793026"],"related_works":["https://openalex.org/W2171949338","https://openalex.org/W2083302857","https://openalex.org/W2988130839","https://openalex.org/W2010590849","https://openalex.org/W2889884297","https://openalex.org/W2080294090","https://openalex.org/W1999555871","https://openalex.org/W3007604916","https://openalex.org/W2045747598","https://openalex.org/W4399261464"],"abstract_inverted_index":{"The":[0,37,57,130,176],"integrity":[1],"of":[2,16,66,76,95,106,134,183,186,214,252,266],"an":[3,9,119,168,288],"interface":[4,32,139,169,177,216,286],"between":[5,87],"a":[6,14,22,34,44,64],"polyimide":[7,27,38,59,290],"and":[8,233,276,296],"epoxy":[10,68,78,138],"is":[11,39,48,60,144,171,255],"important":[12],"for":[13,25,226],"number":[15,94],"microelectronic":[17],"applications.":[18],"Here":[19],"we":[20],"investigate":[21],"surface-modification":[23],"procedure":[24],"the":[26,67,71,77,80,85,88,93,100,104,107,135,174,189,193,198,212,215,220,234,259,264,267,285,294,297,310],"designed":[28],"to":[29,51,118,167,208,217,257,262],"strengthen":[30],"its":[31,52],"with":[33,63,152,219,287],"silica-filled":[35,73],"epoxy.":[36,74,175],"chemically":[40],"modified":[41,58,298],"so":[42],"that":[43,170,202],"thin":[45],"surface":[46,291],"layer":[47,83,109],"converted":[49],"back":[50,113],"polyamic":[53],"acid":[54],"(PAA)":[55],"precursor.":[56],"then":[61],"coated":[62],"solution":[65],"before":[69],"dispensing":[70],"normal":[72],"Interpenetration":[75],"into":[79],"solvent-swollen":[81],"PAA":[82,108],"enhances":[84],"entanglements":[86],"polymer":[89],"chains":[90],"and/or":[91],"increases":[92,151],"primary":[96,194],"covalent":[97,195],"bonds":[98,196],"across":[99,197],"final":[101],"interface.":[102,199],"Increasing":[103,163],"thickness":[105],"[measured":[110,123],"by":[111,124,229,248],"Rutherford":[112],"scattering":[114],"spectrometry":[115,128],"(RBS)]":[116],"leads":[117,166],"increased":[120],"interpenetration":[121],"w":[122,153,155,164,204,303],"secondary":[125],"ion":[126],"mass":[127],"(SIMS)].":[129],"fracture":[131,260,273],"energy":[132,222,274],"(G*c)":[133],"unmodified":[136,289],"polyimide/silica-filled":[137],"(w":[140],"=":[141,156],"12":[142,206],"nm)":[143,306],"very":[145],"low":[146],"(\u223c25":[147],"J/m2),":[148],"but":[149],"G*c":[150],"until":[154],"44":[157,305],"nm":[158,207,210,301],"(G*c":[159],"\u2248":[160],"100":[161],"J/m2).":[162],"further":[165],"tougher":[172],"than":[173,231],"can":[178],"also":[179],"fail":[180,308],"subcritically":[181],"because":[182],"stress-assisted":[184],"attack":[185],"water":[187,236],"in":[188,270],"environment":[190],"(SAWA)":[191],"on":[192],"We":[200],"find":[201],"increasing":[203,228],"from":[205],"38":[209],"improves":[211],"resistance":[213],"SAWA,":[218],"threshold":[221],"release":[223],"rate":[224],"(G*th)":[225],"SAWA":[227],"more":[230],"sixfold":[232],"steady-state":[235],"transport":[237],"controlled":[238],"subcritical":[239,278],"crack":[240,268,279],"growth":[241,269,280],"velocity":[242],"(v*)":[243],"well":[244],"above":[245],"G*th,":[246],"decreasing":[247],"nearly":[249],"two":[250],"orders":[251],"magnitude.":[253],"SIMS":[254],"used":[256],"probe":[258],"surfaces":[261],"determine":[263],"locus":[265],"both":[271,283],"our":[272,277],"samples":[275],"samples.":[281],"In":[282],"cases,":[284],"fails":[292],"along":[293],"interface,":[295],"interfaces":[299],"(12":[300],"<":[302,304],"typically":[307],"within":[309],"newly":[311],"created":[312],"interpenetrating":[313],"epoxy/polyimide":[314],"interphase.":[315]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}