{"id":"https://openalex.org/W2013911919","doi":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","title":"Optimization of Laser Transmission Joining Process between Different Thermoplastics using Response Surface Methodology","display_name":"Optimization of Laser Transmission Joining Process between Different Thermoplastics using Response Surface Methodology","publication_year":2011,"publication_date":"2011-07-01","ids":{"openalex":"https://openalex.org/W2013911919","doi":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","mag":"2013911919"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/amr.291-294.1433","doi":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","pdf_url":null,"source":{"id":"https://openalex.org/S67425620","display_name":"Advanced materials research","issn_l":"1022-6680","issn":["1022-6680","1662-8985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Materials Research","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085485183","display_name":"Zhen Kai Xu","orcid":"https://orcid.org/0009-0001-1622-4987","observed_orcids":["https://orcid.org/0009-0001-1622-4987"]},"institutions":[{"id":"https://openalex.org/I115592961","display_name":"Jiangsu University","ror":"https://ror.org/03jc41j30","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhen Kai Xu","raw_affiliation_strings":["Jiangsu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu University","institution_ids":["https://openalex.org/I115592961"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Kai Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I115592961","display_name":"Jiangsu University","ror":"https://ror.org/03jc41j30","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Wang","raw_affiliation_strings":["Jiangsu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu University","institution_ids":["https://openalex.org/I115592961"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004305787","display_name":"Min Feng Jiang","orcid":"https://orcid.org/0000-0003-3667-2119","observed_orcids":["https://orcid.org/0000-0003-3667-2119"]},"institutions":[{"id":"https://openalex.org/I77631543","display_name":"Wuxi Institute of Technology","ror":"https://ror.org/00ab95029","country_code":"CN","type":"education","lineage":["https://openalex.org/I77631543"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Min Feng Jiang","raw_affiliation_strings":["Wuxi Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Wuxi Institute of Technology","institution_ids":["https://openalex.org/I77631543"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101816358","display_name":"Yang Hu","orcid":"https://orcid.org/0000-0001-8644-9615","observed_orcids":["https://orcid.org/0000-0001-8644-9615"]},"institutions":[{"id":"https://openalex.org/I115592961","display_name":"Jiangsu University","ror":"https://ror.org/03jc41j30","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Hu","raw_affiliation_strings":["Jiangsu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu University","institution_ids":["https://openalex.org/I115592961"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100439628","display_name":"Cheng Zhang","orcid":"https://orcid.org/0000-0002-3221-9379","observed_orcids":["https://orcid.org/0000-0002-3221-9379"]},"institutions":[{"id":"https://openalex.org/I115592961","display_name":"Jiangsu University","ror":"https://ror.org/03jc41j30","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cheng Zhang","raw_affiliation_strings":["Jiangsu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu University","institution_ids":["https://openalex.org/I115592961"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100599300","display_name":"Pin Li","orcid":"https://orcid.org/0000-0003-1988-5390","observed_orcids":["https://orcid.org/0000-0003-1988-5390"]},"institutions":[{"id":"https://openalex.org/I115592961","display_name":"Jiangsu University","ror":"https://ror.org/03jc41j30","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Pin Li","raw_affiliation_strings":["Jiangsu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu University","institution_ids":["https://openalex.org/I115592961"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5071804101","display_name":"Hui Xia Liu","orcid":"https://orcid.org/0009-0001-6760-7945","observed_orcids":["https://orcid.org/0009-0001-6760-7945"]},"institutions":[{"id":"https://openalex.org/I115592961","display_name":"Jiangsu University","ror":"https://ror.org/03jc41j30","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hui Xia Liu","raw_affiliation_strings":["Jiangsu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu University","institution_ids":["https://openalex.org/I115592961"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.18834111,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"291-294","issue":null,"first_page":"1433","last_page":"1439"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.8192999958992004,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.8192999958992004,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.04569999873638153,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.03739999979734421,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoplastics","display_name":"thermoplastics","score":0.8220000267028809},{"id":"https://openalex.org/keywords/polyethylene-terephthalate-film","display_name":"PET film","score":0.9629999995231628},{"id":"https://openalex.org/keywords/polycarbonate-films","display_name":"polycarbonate films","score":0.9750000238418579},{"id":"https://openalex.org/keywords/joint-strength","display_name":"joint strength","score":0.8240000009536743},{"id":"https://openalex.org/keywords/process-parameter-optimization","display_name":"process parameter optimization","score":0.8550000190734863},{"id":"https://openalex.org/keywords/laser-power","display_name":"laser power","score":0.9810000061988831},{"id":"https://openalex.org/keywords/scanning-speed","display_name":"scanning speed","score":1.0},{"id":"https://openalex.org/keywords/clamping-pressure","display_name":"clamping pressure","score":1.0},{"id":"https://openalex.org/keywords/response-surface-methodology","display_name":"response surface methodology","score":0.6880000233650208}],"concepts":[{"id":"https://openalex.org/C84111939","wikidata":"https://www.wikidata.org/wiki/Q5125465","display_name":"Clamping","level":2,"score":0.848656415939331},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.7648435831069946},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6775650978088379},{"id":"https://openalex.org/C141349535","wikidata":"https://www.wikidata.org/wiki/Q1361664","display_name":"Laser scanning","level":3,"score":0.6578525304794312},{"id":"https://openalex.org/C200649887","wikidata":"https://www.wikidata.org/wiki/Q17154544","display_name":"Laser power scaling","level":3,"score":0.624482274055481},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.5949898362159729},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5726063251495361},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5159997940063477},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.48426005244255066},{"id":"https://openalex.org/C150077022","wikidata":"https://www.wikidata.org/wiki/Q3136137","display_name":"Response surface methodology","level":2,"score":0.47019609808921814},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.4623848497867584},{"id":"https://openalex.org/C3019493240","wikidata":"https://www.wikidata.org/wiki/Q94701573","display_name":"3d scanning","level":2,"score":0.43494290113449097},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.41193723678588867},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3262483775615692},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3069213032722473},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2949680685997009},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.281828910112381},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.257362425327301},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24155175685882568},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.1084534227848053},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08260124921798706},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/amr.291-294.1433","doi":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","pdf_url":null,"source":{"id":"https://openalex.org/S67425620","display_name":"Advanced materials research","issn_l":"1022-6680","issn":["1022-6680","1662-8985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Materials Research","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4028/www.scientific.net/amr.291-294.1433","doi":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/amr.291-294.1433","pdf_url":null,"source":{"id":"https://openalex.org/S67425620","display_name":"Advanced materials research","issn_l":"1022-6680","issn":["1022-6680","1662-8985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Materials Research","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1971687059","https://openalex.org/W1983657850","https://openalex.org/W2005010764","https://openalex.org/W2005319412","https://openalex.org/W2012821723","https://openalex.org/W2042629287","https://openalex.org/W2054696009","https://openalex.org/W2083617171","https://openalex.org/W2507343482","https://openalex.org/W6604268844"],"related_works":["https://openalex.org/W1984926932","https://openalex.org/W2012320334","https://openalex.org/W2370338322","https://openalex.org/W2044174849","https://openalex.org/W2049981694","https://openalex.org/W2007284479","https://openalex.org/W2320516177","https://openalex.org/W2068482857","https://openalex.org/W2073171981","https://openalex.org/W2248654949"],"abstract_inverted_index":{"In":[0],"order":[1,66],"to":[2,67],"determine":[3,68],"the":[4,13,74,88,109,115,120,126],"optimum":[5],"joint":[6,14,19,53,69,100],"conditions,":[7],"four":[8],"key":[9],"process":[10,50],"parameters":[11,51],"affecting":[12],"quality":[15,54,101],"of":[16,20,48,73],"laser":[17,90],"transmission":[18],"1mm":[21],"thick":[22],"PET":[23],"film":[24],"and":[25,33,96],"PC":[26],"film\uff0cnamely\uff0claser":[27],"power,":[28,91],"scanning":[29,34,92,97],"speed,":[30,93],"clamping":[31,94],"pressure":[32,95],"number":[35,98],"are":[36,59,112],"optimized":[37],"by":[38],"response":[39],"surface":[40],"methodology":[41],"in":[42,65],"this":[43],"paper.":[44],"The":[45,57,71],"interaction":[46],"effect":[47],"main":[49],"on":[52,99],"is":[55,77],"researched.":[56],"samples":[58],"tested":[60],"using":[61],"a":[62],"multi-axis":[63],"microtester":[64],"strength.":[70],"morphology":[72],"joining":[75],"area":[76],"observed":[78],"with":[79,114],"an":[80],"optical":[81],"microscope.":[82],"Design":[83],"Expert":[84],"analysis":[85],"indicates":[86],"that":[87,119],"best":[89],"were":[102],"35.7W,":[103],"5.0mm/s,":[104],"0.75MPa,":[105],"3,":[106],"respectively.":[107],"Finally,":[108],"experimental":[110],"results":[111],"consistent":[113],"predicted,":[116],"which":[117],"illustrates":[118],"developed":[121],"mathematical":[122],"models":[123],"can":[124],"predict":[125],"responses":[127],"adequately.":[128]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}