{"id":"https://openalex.org/W2012096027","doi":"https://doi.org/10.1016/j.cirp.2008.03.127","title":"Optical inspection of complex patterns of microelectronics products","display_name":"Optical inspection of complex patterns of microelectronics products","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W2012096027","doi":"https://doi.org/10.1016/j.cirp.2008.03.127","mag":"2012096027"},"language":"en","primary_location":{"id":"doi:10.1016/j.cirp.2008.03.127","doi":"https://doi.org/10.1016/j.cirp.2008.03.127","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.cirp.2008.03.127","pdf_url":null,"source":{"id":"https://openalex.org/S2898225552","display_name":"CIRP Annals","issn_l":"0007-8506","issn":["0007-8506","1660-2773","1726-0604"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-a","jufo-1","norway-2","poland-200","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"CIRP Annals","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5056209974","display_name":"Jong-Bum You","orcid":"https://orcid.org/0000-0002-3301-8528","observed_orcids":["https://orcid.org/0000-0002-3301-8528"]},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"J. You","raw_affiliation_strings":["Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, Daejeon 305-701, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, Daejeon 305-701, South Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5003891259","display_name":"Seung\u2010Woo Kim","orcid":"https://orcid.org/0000-0003-0235-1739","observed_orcids":["https://orcid.org/0000-0003-0235-1739"]},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"S.-W. Kim","raw_affiliation_strings":["Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, Daejeon 305-701, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, Daejeon 305-701, South Korea","institution_ids":["https://openalex.org/I157485424"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5003891259"],"corresponding_institution_ids":["https://openalex.org/I157485424"],"apc_list":{"value":3190,"currency":"USD","value_usd":3190},"apc_paid":null,"fwci":2.0302,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.88304279,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"57","issue":"1","first_page":"505","last_page":"508"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.9643999934196472,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.9643999934196472,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.01979999989271164,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.006800000090152025,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/low-coherence-interferometry","display_name":"low-coherence interferometry","score":0.9959999918937683},{"id":"https://openalex.org/keywords/microelectronics","display_name":"microelectronics","score":0.6489999890327454},{"id":"https://openalex.org/keywords/surface-roughness-measurement","display_name":"surface roughness measurement","score":0.675000011920929},{"id":"https://openalex.org/keywords/thin-film-thickness-measurement","display_name":"thin film thickness measurement","score":0.7110000252723694}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.7705529928207397},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.5178528428077698},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4768037497997284},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4275458753108978},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.36096563935279846},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.32374411821365356},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11442029476165771}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.cirp.2008.03.127","doi":"https://doi.org/10.1016/j.cirp.2008.03.127","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.cirp.2008.03.127","pdf_url":null,"source":{"id":"https://openalex.org/S2898225552","display_name":"CIRP Annals","issn_l":"0007-8506","issn":["0007-8506","1660-2773","1726-0604"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-a","jufo-1","norway-2","poland-200","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"CIRP Annals","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1853387898","https://openalex.org/W1972425645","https://openalex.org/W2023933338","https://openalex.org/W2034304337","https://openalex.org/W2049141476","https://openalex.org/W2072795708","https://openalex.org/W2074371610","https://openalex.org/W2082645082","https://openalex.org/W2088990551","https://openalex.org/W2092469929","https://openalex.org/W2148388784"],"related_works":["https://openalex.org/W2214748118","https://openalex.org/W2152019251","https://openalex.org/W1982966202","https://openalex.org/W2766317712","https://openalex.org/W2070434707","https://openalex.org/W1973890001","https://openalex.org/W2106646069","https://openalex.org/W1994410667","https://openalex.org/W2027211827","https://openalex.org/W1995934481"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":3},{"year":2012,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}