{"id":"https://openalex.org/W2010554185","doi":"https://doi.org/10.1016/j.mseb.2009.06.013","title":"Nanoindentation characterization of intermetallic compounds formed between Sn\u2013Cu (\u2013Ni) ball grid arrays and Cu substrates","display_name":"Nanoindentation characterization of intermetallic compounds formed between Sn\u2013Cu (\u2013Ni) ball grid arrays and Cu substrates","publication_year":2009,"publication_date":"2009-07-04","ids":{"openalex":"https://openalex.org/W2010554185","doi":"https://doi.org/10.1016/j.mseb.2009.06.013","mag":"2010554185"},"language":"en","primary_location":{"id":"doi:10.1016/j.mseb.2009.06.013","doi":"https://doi.org/10.1016/j.mseb.2009.06.013","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mseb.2009.06.013","pdf_url":null,"source":{"id":"https://openalex.org/S4210190818","display_name":"Materials Science and Engineering B","issn_l":"0921-5107","issn":["0921-5107","1873-4944"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-100","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science and Engineering: B","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5021220784","display_name":"Hideaki Tsukamoto","orcid":"https://orcid.org/0000-0002-1251-2260","observed_orcids":["https://orcid.org/0000-0002-1251-2260"]},"institutions":[{"id":"https://openalex.org/I165143802","display_name":"The University of Queensland","ror":"https://ror.org/00rqy9422","country_code":"AU","type":"education","lineage":["https://openalex.org/I165143802"]}],"countries":["AU"],"is_corresponding":true,"raw_author_name":"Hideaki Tsukamoto","raw_affiliation_strings":["The University of Queensland, School of Engineering/Materials, Brisbane, QLD 4072, Australia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The University of Queensland, School of Engineering/Materials, Brisbane, QLD 4072, Australia","institution_ids":["https://openalex.org/I165143802"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046058647","display_name":"Zhigang Dong","orcid":"https://orcid.org/0000-0002-3053-7381","observed_orcids":["https://orcid.org/0000-0002-3053-7381"]},"institutions":[{"id":"https://openalex.org/I165143802","display_name":"The University of Queensland","ror":"https://ror.org/00rqy9422","country_code":"AU","type":"education","lineage":["https://openalex.org/I165143802"]}],"countries":["AU"],"is_corresponding":false,"raw_author_name":"Zhigang Dong","raw_affiliation_strings":["The University of Queensland, School of Engineering/Mechanical, Brisbane, QLD 4072, Australia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The University of Queensland, School of Engineering/Mechanical, Brisbane, QLD 4072, Australia","institution_ids":["https://openalex.org/I165143802"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100709581","display_name":"Han Huang","orcid":"https://orcid.org/0000-0003-3353-2970","observed_orcids":["https://orcid.org/0000-0003-3353-2970"]},"institutions":[{"id":"https://openalex.org/I165143802","display_name":"The University of Queensland","ror":"https://ror.org/00rqy9422","country_code":"AU","type":"education","lineage":["https://openalex.org/I165143802"]}],"countries":["AU"],"is_corresponding":false,"raw_author_name":"Han Huang","raw_affiliation_strings":["The University of Queensland, School of Engineering/Mechanical, Brisbane, QLD 4072, Australia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The University of Queensland, School of Engineering/Mechanical, Brisbane, QLD 4072, Australia","institution_ids":["https://openalex.org/I165143802"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104309276","display_name":"Tetsuro Nishimura","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405269390","display_name":"NIHON SUPERIOR CO., LTD. (Japan)","ror":"https://ror.org/04148t214","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405269390"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsuro Nishimura","raw_affiliation_strings":["Nihon Superior Co. Ltd., Osaka, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nihon Superior Co. Ltd., Osaka, Japan","institution_ids":["https://openalex.org/I4405269390"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5034916578","display_name":"Kazuhiro Nogita","orcid":"https://orcid.org/0000-0002-0721-6600","observed_orcids":["https://orcid.org/0000-0002-0721-6600"]},"institutions":[{"id":"https://openalex.org/I165143802","display_name":"The University of Queensland","ror":"https://ror.org/00rqy9422","country_code":"AU","type":"education","lineage":["https://openalex.org/I165143802"]}],"countries":["AU"],"is_corresponding":false,"raw_author_name":"Kazuhiro Nogita","raw_affiliation_strings":["The University of Queensland, School of Engineering/Materials, Brisbane, QLD 4072, Australia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The University of Queensland, School of Engineering/Materials, Brisbane, QLD 4072, Australia","institution_ids":["https://openalex.org/I165143802"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5021220784"],"corresponding_institution_ids":["https://openalex.org/I165143802"],"apc_list":{"value":3140,"currency":"USD","value_usd":3140},"apc_paid":null,"fwci":3.286,"has_fulltext":false,"cited_by_count":43,"citation_normalized_percentile":{"value":0.9126949,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":87,"max":98},"biblio":{"volume":"164","issue":"1","first_page":"44","last_page":"50"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.9850000143051147},{"id":"https://openalex.org/keywords/sn-cu-ni-solder","display_name":"Sn-Cu-Ni solder","score":0.7870000004768372},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"ball grid array","score":0.7310000061988831},{"id":"https://openalex.org/keywords/copper-substrate","display_name":"copper substrate","score":0.8009999990463257},{"id":"https://openalex.org/keywords/solder-substrate-interface","display_name":"solder-substrate interface","score":0.8370000123977661},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.6499999761581421},{"id":"https://openalex.org/keywords/multiple-reflow","display_name":"multiple reflow","score":0.6570000052452087},{"id":"https://openalex.org/keywords/cu-ni-6sn5","display_name":"(Cu,Ni)6Sn5","score":0.890999972820282},{"id":"https://openalex.org/keywords/cu6sn5","display_name":"Cu6Sn5","score":0.9980000257492065},{"id":"https://openalex.org/keywords/elastic-modulus","display_name":"elastic modulus","score":0.7129999995231628},{"id":"https://openalex.org/keywords/hardness","display_name":"hardness","score":0.9980000257492065},{"id":"https://openalex.org/keywords/crystallographic-texture","display_name":"crystallographic texture","score":0.843999981880188},{"id":"https://openalex.org/keywords/growth-texture","display_name":"growth texture","score":0.515999972820282}],"concepts":[{"id":"https://openalex.org/C49326732","wikidata":"https://www.wikidata.org/wiki/Q1549892","display_name":"Nanoindentation","level":2,"score":0.9268741011619568},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.9143766164779663},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8549922704696655},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7883400917053223},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7731884121894836},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5698708891868591},{"id":"https://openalex.org/C43486711","wikidata":"https://www.wikidata.org/wiki/Q192005","display_name":"Elastic modulus","level":2,"score":0.4978816509246826},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.430759459733963},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.4171949625015259},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.41224223375320435},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3906020522117615},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1372450292110443},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.06413674354553223},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mseb.2009.06.013","doi":"https://doi.org/10.1016/j.mseb.2009.06.013","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mseb.2009.06.013","pdf_url":null,"source":{"id":"https://openalex.org/S4210190818","display_name":"Materials Science and Engineering B","issn_l":"0921-5107","issn":["0921-5107","1873-4944"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-100","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science and Engineering: B","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1513348524","https://openalex.org/W1966759890","https://openalex.org/W1977859531","https://openalex.org/W1987519701","https://openalex.org/W1988272560","https://openalex.org/W2002923627","https://openalex.org/W2004827096","https://openalex.org/W2010883406","https://openalex.org/W2028189787","https://openalex.org/W2042875002","https://openalex.org/W2045830580","https://openalex.org/W2056443818","https://openalex.org/W2059523013","https://openalex.org/W2061687441","https://openalex.org/W2066122817","https://openalex.org/W2074973327","https://openalex.org/W2083937419","https://openalex.org/W2085109755","https://openalex.org/W2086170550","https://openalex.org/W2086933933","https://openalex.org/W2087085099","https://openalex.org/W2091065246","https://openalex.org/W2112817167","https://openalex.org/W2120728887","https://openalex.org/W2135756674","https://openalex.org/W2157972301","https://openalex.org/W2168561157","https://openalex.org/W2312918740"],"related_works":["https://openalex.org/W2014753016","https://openalex.org/W2065662618","https://openalex.org/W2025123129","https://openalex.org/W2040992508","https://openalex.org/W2540963779","https://openalex.org/W2367698043","https://openalex.org/W2384407273","https://openalex.org/W2044088104","https://openalex.org/W2540505838","https://openalex.org/W1967887665"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":6},{"year":2017,"cited_by_count":4},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":6}],"updated_date":"2026-11-06T12:05:46.655746","created_date":"2016-06-24T00:00:00"}