{"id":"https://openalex.org/W2010168046","doi":"https://doi.org/10.1108/eb044334","title":"Eliminating Electronic Component Stresses through Controlled Laser Soldering","display_name":"Eliminating Electronic Component Stresses through Controlled Laser Soldering","publication_year":1988,"publication_date":"1988-03-01","ids":{"openalex":"https://openalex.org/W2010168046","doi":"https://doi.org/10.1108/eb044334","mag":"2010168046"},"language":"en","primary_location":{"id":"doi:10.1108/eb044334","doi":"https://doi.org/10.1108/eb044334","is_oa":false,"landing_page_url":"https://doi.org/10.1108/eb044334","pdf_url":null,"source":{"id":"https://openalex.org/S5407051551","display_name":"Hybrid Circuits","issn_l":"0265-3028","issn":["0265-3028","2977-7062"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Hybrid Circuits","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088024074","display_name":"Riccardo Vanzetti","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R. Vanzetti","raw_affiliation_strings":["Vanzetti Systems. Inc., Stoughton, Massachusetts, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Vanzetti Systems. Inc., Stoughton, Massachusetts, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025029259","display_name":"Alan C. Traub","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A.C. Traub","raw_affiliation_strings":["Vanzetti Systems. Inc., Stoughton, Massachusetts, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Vanzetti Systems. Inc., Stoughton, Massachusetts, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.19067896,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"5","issue":"3","first_page":"12","last_page":"16"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.002099999925121665,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/laser-soldering","display_name":"laser soldering","score":0.9869999885559082},{"id":"https://openalex.org/keywords/solder-joint-quality","display_name":"solder joint quality","score":0.6510000228881836},{"id":"https://openalex.org/keywords/infrared-detection","display_name":"infrared detection","score":0.5960000157356262},{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.9269999861717224},{"id":"https://openalex.org/keywords/thermal-stress","display_name":"thermal stress","score":0.7120000123977661},{"id":"https://openalex.org/keywords/automated-inspection","display_name":"automated inspection","score":0.6499999761581421},{"id":"https://openalex.org/keywords/process-control","display_name":"process control","score":0.7490000128746033}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8943458795547485},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.8429545760154724},{"id":"https://openalex.org/C156893995","wikidata":"https://www.wikidata.org/wiki/Q5279680","display_name":"Dip soldering","level":4,"score":0.7591633200645447},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.7340996265411377},{"id":"https://openalex.org/C97850793","wikidata":"https://www.wikidata.org/wiki/Q1622830","display_name":"Wave soldering","level":3,"score":0.613390326499939},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5734817981719971},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.4820738434791565},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.45696917176246643},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.43502819538116455},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4014865756034851},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.38417860865592957},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.37576931715011597},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.26194220781326294},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.24740064144134521},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.23645168542861938},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.17198136448860168},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1108/eb044334","doi":"https://doi.org/10.1108/eb044334","is_oa":false,"landing_page_url":"https://doi.org/10.1108/eb044334","pdf_url":null,"source":{"id":"https://openalex.org/S5407051551","display_name":"Hybrid Circuits","issn_l":"0265-3028","issn":["0265-3028","2977-7062"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Hybrid Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W565874413","https://openalex.org/W2524782976","https://openalex.org/W4285719527","https://openalex.org/W6991863169"],"related_works":["https://openalex.org/W1970369182","https://openalex.org/W2896856939","https://openalex.org/W1587315059","https://openalex.org/W2112273446","https://openalex.org/W2353191702","https://openalex.org/W2080319916","https://openalex.org/W1987008548","https://openalex.org/W2077511362","https://openalex.org/W6927481809","https://openalex.org/W2153309624"],"abstract_inverted_index":{"A":[0],"procedure":[1],"is":[2,8,62],"discussed":[3],"wherein":[4],"an":[5],"infra-red":[6],"detector":[7],"used":[9],"for":[10,87],"controlling":[11],"the":[12,28,33,43,48,51,59,71,73,80,91],"quality":[13,34],"of":[14,35,90],"solder":[15],"joints":[16],"being":[17],"formed":[18],"by":[19,65],"laser-beam":[20],"heating":[21],"on":[22],"printed":[23,52],"circuit":[24,53],"boards":[25],"while,":[26],"at":[27,79],"same":[29,81],"time,":[30],"automatically":[31],"inspecting":[32],"each":[36],"joint.":[37],"The":[38],"joint-by-joint":[39],"soldering":[40,92],"method":[41],"avoids":[42],"thermally":[44],"induced":[45],"stresses":[46],"between":[47],"components":[49],"and":[50],"board":[54,61],"which":[55],"can":[56],"occur":[57],"when":[58],"entire":[60],"mass":[63],"soldered":[64],"conventional":[66],"means.":[67],"It":[68],"also":[69],"eliminates":[70],"\u2018after":[72],"fact\u2019":[74],"human":[75],"inspection":[76],"process,":[77],"while":[78],"time":[82],"making":[83],"available":[84],"real-time":[85],"data":[86],"process":[88],"control":[89],"operation.":[93]},"counts_by_year":[],"updated_date":"2026-08-13T07:04:57.449891","created_date":"2016-06-24T00:00:00"}