{"id":"https://openalex.org/W2007676484","doi":"https://doi.org/10.1108/13565369610800386","title":"Packaging Reliability for High Temperature Electronics: A Materials Focus","display_name":"Packaging Reliability for High Temperature Electronics: A Materials Focus","publication_year":1996,"publication_date":"1996-12-01","ids":{"openalex":"https://openalex.org/W2007676484","doi":"https://doi.org/10.1108/13565369610800386","mag":"2007676484"},"language":"en","primary_location":{"id":"doi:10.1108/13565369610800386","doi":"https://doi.org/10.1108/13565369610800386","is_oa":false,"landing_page_url":"https://doi.org/10.1108/13565369610800386","pdf_url":null,"source":{"id":"https://openalex.org/S159533830","display_name":"Microelectronics International","issn_l":"1356-5362","issn":["1356-5362","1758-812X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics International","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082683806","display_name":"F. Patrick McCluskey","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F.P. McCluskey","raw_affiliation_strings":["CALCE\u2010EPRC, University of Maryland, College Park, Maryland, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CALCE\u2010EPRC, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024034978","display_name":"Lloyd W. Condra","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1295339012","display_name":"Boeing (United States)","ror":"https://ror.org/04sm5zn07","country_code":"US","type":"company","lineage":["https://openalex.org/I1295339012"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"L. Condra","raw_affiliation_strings":["Boeing BCAG, Seattle, Washington, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Boeing BCAG, Seattle, Washington, USA","institution_ids":["https://openalex.org/I1295339012"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012023338","display_name":"T. Torri","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. Torri","raw_affiliation_strings":["Delco Electronics, Inc., Indiana, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Delco Electronics, Inc., Indiana, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052808169","display_name":"Johannes Karl Fink","orcid":"https://orcid.org/0000-0001-7473-569X","observed_orcids":["https://orcid.org/0000-0001-7473-569X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. Fink","raw_affiliation_strings":["Honeywell, Inc.,Minneapolis, Minnesota, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Honeywell, Inc.,Minneapolis, Minnesota, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"13","issue":"3","first_page":"23","last_page":"26"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/high-temperature-electronics","display_name":"high-temperature electronics","score":0.8500000238418579},{"id":"https://openalex.org/keywords/electronic-packaging-reliability","display_name":"electronic packaging reliability","score":0.8560000061988831},{"id":"https://openalex.org/keywords/material-selection","display_name":"material selection","score":0.8920000195503235},{"id":"https://openalex.org/keywords/packaging-design","display_name":"packaging design","score":0.8970000147819519},{"id":"https://openalex.org/keywords/die-attach","display_name":"die attach","score":0.871999979019165},{"id":"https://openalex.org/keywords/high-power-dissipation","display_name":"high power dissipation","score":0.8550000190734863},{"id":"https://openalex.org/keywords/high-operating-temperature","display_name":"high-temperature operation","score":0.5619999766349792}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6688035726547241},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6278950572013855},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.613685667514801},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.6074205636978149},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5659400224685669},{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.48401376605033875},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.47431278228759766},{"id":"https://openalex.org/C178911571","wikidata":"https://www.wikidata.org/wiki/Q593143","display_name":"Power electronics","level":3,"score":0.46247541904449463},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.45035040378570557},{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.43254178762435913},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.4235043525695801},{"id":"https://openalex.org/C2780443751","wikidata":"https://www.wikidata.org/wiki/Q6786565","display_name":"Material selection","level":2,"score":0.42076045274734497},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4199202060699463},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4177480936050415},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3953443765640259},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3425178527832031},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.33865657448768616},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.30408570170402527},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29670560359954834},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.26245564222335815},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.18092647194862366},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1700403392314911},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.13325926661491394},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.11532926559448242},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1108/13565369610800386","doi":"https://doi.org/10.1108/13565369610800386","is_oa":false,"landing_page_url":"https://doi.org/10.1108/13565369610800386","pdf_url":null,"source":{"id":"https://openalex.org/S159533830","display_name":"Microelectronics International","issn_l":"1356-5362","issn":["1356-5362","1758-812X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics International","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1644668759","https://openalex.org/W1978277536","https://openalex.org/W1987308840","https://openalex.org/W2024229232","https://openalex.org/W2080280387","https://openalex.org/W2092824600","https://openalex.org/W2095658652","https://openalex.org/W2157958105","https://openalex.org/W2162121739","https://openalex.org/W2167044511","https://openalex.org/W2167387590","https://openalex.org/W2213063383","https://openalex.org/W2623705143","https://openalex.org/W3216333011","https://openalex.org/W4251148578"],"related_works":["https://openalex.org/W4236703391","https://openalex.org/W2144574454","https://openalex.org/W2586576499","https://openalex.org/W2919638791","https://openalex.org/W2254670229","https://openalex.org/W1918397903","https://openalex.org/W3135891321","https://openalex.org/W4405183770","https://openalex.org/W2075066821","https://openalex.org/W2786403205"],"abstract_inverted_index":{"An":[0],"overview":[1],"of":[2,9,29,45,84],"the":[3,7,33,37],"concerns":[4],"involved":[5],"in":[6],"operation":[8],"electronic":[10],"hardware":[11],"at":[12,75],"elevated":[13],"temperatures":[14,76],"is":[15,40],"presented.":[16],"Materials":[17],"selection":[18],"and":[19,50,66,69,98],"package":[20,92],"design":[21,93],"issues":[22],"are":[23,86,89],"addressed":[24],"for":[25,94,100],"a":[26],"wide":[27],"range":[28],"packaging":[30,51],"elements":[31,44],"from":[32],"semiconductor":[34],"chip":[35],"to":[36,57],"box.":[38],"It":[39],"found":[41],"that":[42,99],"most":[43],"common":[46],"high":[47,95,101],"density":[48],"device":[49],"architecture":[52],"can":[53],"be":[54],"used":[55],"up":[56],"200\u00b0C.":[58,78],"However,":[59],"gold\u2010aluminium":[60],"wirebonds,":[61],"eutectic":[62],"tin\u2010lead":[63],"solder":[64],"joints":[65],"die":[67],"attaches,":[68],"FR\u20104":[70],"boards":[71],"will":[72],"seriously":[73],"degrade":[74],"below":[77],"For":[79],"these":[80],"elements,":[81],"alternative":[82],"materials":[83],"construction":[85],"recommended.":[87],"Comparisons":[88],"made":[90],"between":[91],"power":[96],"dissipation":[97],"temperature":[102],"operation.":[103]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}