{"id":"https://openalex.org/W2007143281","doi":"https://doi.org/10.1109/nems.2006.334631","title":"Deposition of conductive layer silver and insulating layer A12O3 for TFT","display_name":"Deposition of conductive layer silver and insulating layer A12O3 for TFT","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W2007143281","doi":"https://doi.org/10.1109/nems.2006.334631","mag":"2007143281"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2006.334631","doi":"https://doi.org/10.1109/nems.2006.334631","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2006.334631","pdf_url":null,"source":{"id":"https://openalex.org/S4393918698","display_name":"IEEE International Conference on Nano/Micro Engineered and Molecular Systems","issn_l":"2474-3747","issn":["2474-3747"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076620228","display_name":"Cheng Pan","orcid":"https://orcid.org/0000-0002-3948-9558","observed_orcids":["https://orcid.org/0000-0002-3948-9558"]},"institutions":[{"id":"https://openalex.org/I142974352","display_name":"National Sun Yat-sen University","ror":"https://ror.org/00mjawt10","country_code":"TW","type":"education","lineage":["https://openalex.org/I142974352"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. T. Pan","raw_affiliation_strings":["Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience & Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan","Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience and Nanotechnology, \u00a0National Sun Yat-Sen University, Kaoshiung 804, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience & Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I142974352"]},{"raw_affiliation_string":"Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience and Nanotechnology, \u00a0National Sun Yat-Sen University, Kaoshiung 804, Taiwan","institution_ids":["https://openalex.org/I142974352"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018105169","display_name":"Cheng-Yang Hsieh","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"C. C. Hsieh","raw_affiliation_strings":["Department of Mechanical Engineering, Yung Ta College of Technology and Commerce, Ping Tung, Taiwan","Department of Mechanical Engineering, Yung-Ta Institute of Technology & Commerce, Ping-Tung, 909, Taiwan. E-mail: hsiehcc@mail.ytit.edu.tw"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Yung Ta College of Technology and Commerce, Ping Tung, Taiwan","institution_ids":[]},{"raw_affiliation_string":"Department of Mechanical Engineering, Yung-Ta Institute of Technology & Commerce, Ping-Tung, 909, Taiwan. E-mail: hsiehcc@mail.ytit.edu.tw","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111769439","display_name":"S. C. Lin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I142974352","display_name":"National Sun Yat-sen University","ror":"https://ror.org/00mjawt10","country_code":"TW","type":"education","lineage":["https://openalex.org/I142974352"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"S.C. Lin","raw_affiliation_strings":["Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience & Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan","Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience and Nanotechnology, \u00a0National Sun Yat-Sen University, Kaoshiung 804, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience & Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I142974352"]},{"raw_affiliation_string":"Department of Mechanical and Electro-Mechanical Engineering, Center for Nanoscience and Nanotechnology, \u00a0National Sun Yat-Sen University, Kaoshiung 804, Taiwan","institution_ids":["https://openalex.org/I142974352"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1064","last_page":"1067"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.37059998512268066,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.37059998512268066,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.3075999915599823,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14382","display_name":"Electrophoretic Deposition in Materials Science","score":0.21359999477863312,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thin-film-transistors","display_name":"thin-film transistors","score":0.953000009059906},{"id":"https://openalex.org/keywords/electroless-plating","display_name":"electroless plating","score":0.7239999771118164},{"id":"https://openalex.org/keywords/electrophoretic-deposition","display_name":"electrophoretic deposition","score":0.9810000061988831},{"id":"https://openalex.org/keywords/alumina","display_name":"alumina","score":0.5400000214576721},{"id":"https://openalex.org/keywords/glass-substrates","display_name":"glass substrates","score":0.6079999804496765},{"id":"https://openalex.org/keywords/seed-layer","display_name":"seed layer","score":0.6710000038146973},{"id":"https://openalex.org/keywords/positive-photoresist","display_name":"positive photoresist","score":0.7139999866485596},{"id":"https://openalex.org/keywords/deposition-kinetics","display_name":"deposition kinetics","score":0.6840000152587891},{"id":"https://openalex.org/keywords/deposition-yield","display_name":"deposition yield","score":0.5979999899864197}],"concepts":[{"id":"https://openalex.org/C2775891822","wikidata":"https://www.wikidata.org/wiki/Q925358","display_name":"Electrophoretic deposition","level":3,"score":0.7874435186386108},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6694557666778564},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.6246439814567566},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.623184323310852},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.5777620077133179},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5527891516685486},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5239484310150146},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.4419265389442444},{"id":"https://openalex.org/C87359718","wikidata":"https://www.wikidata.org/wiki/Q1271916","display_name":"Thin-film transistor","level":3,"score":0.4368460774421692},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.43009406328201294},{"id":"https://openalex.org/C86181022","wikidata":"https://www.wikidata.org/wiki/Q196823","display_name":"Zeta potential","level":3,"score":0.41387733817100525},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.40332815051078796},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.3207944929599762},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.24952098727226257},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.2153899073600769},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20662736892700195},{"id":"https://openalex.org/C155672457","wikidata":"https://www.wikidata.org/wiki/Q61231","display_name":"Nanoparticle","level":2,"score":0.12871912121772766},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11981484293937683},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.0756978690624237},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2006.334631","doi":"https://doi.org/10.1109/nems.2006.334631","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2006.334631","pdf_url":null,"source":{"id":"https://openalex.org/S4393918698","display_name":"IEEE International Conference on Nano/Micro Engineered and Molecular Systems","issn_l":"2474-3747","issn":["2474-3747"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1967245465","https://openalex.org/W1998243456","https://openalex.org/W2012099921","https://openalex.org/W2024552347","https://openalex.org/W2068231189","https://openalex.org/W2126664164","https://openalex.org/W2322809198"],"related_works":["https://openalex.org/W2134981297","https://openalex.org/W2056154212","https://openalex.org/W2184409339","https://openalex.org/W2047437674","https://openalex.org/W2085631311","https://openalex.org/W2084814220","https://openalex.org/W2606376084","https://openalex.org/W1967245465","https://openalex.org/W2213510853","https://openalex.org/W2560277965"],"abstract_inverted_index":{"In":[0],"this":[1],"study,":[2],"we":[3],"present":[4,43],"the":[5,37,55,81,94,99,106,115,140],"results":[6],"of":[7,10,17,39,52,129,139],"electroless":[8,40,107],"deposition":[9,15,131,141,160],"silver":[11,29,49,87,116],"(Ag)":[12],"and":[13,127,147,158],"electrophoretic":[14,124,130],"(EPD)":[16],"Al2O3layers":[18],"on":[19,117],"glass":[20],"for":[21,84],"application":[22],"in":[23,90,98,132],"thin":[24,88],"film":[25,89],"transistor":[26],"(TFT).":[27],"Since":[28],"with":[30,86,143],"excellent":[31],"resistivity":[32],"is":[33,58,67,77,96,110,121],"selected":[34],"to":[35,47,72,79,102],"be":[36],"material":[38,120],"plating.":[41],"We":[42],"a":[44],"new":[45],"method":[46],"deposit":[48,80],"conductivity":[50],"layer":[51,71,83],"TFT.":[53],"Firstly,":[54],"desired":[56],"pattern":[57],"defined":[59],"by":[60,123],"lithography":[61],"process.":[62],"The":[63],"positive":[64],"photoresist":[65],"(AZ-650)":[66],"prepared":[68,122],"as":[69],"protective":[70],"avoid":[73],"deposition.":[74,125],"Then,":[75],"it":[76],"introduced":[78],"seeding":[82],"adhesion":[85],"200":[91],"nanometers.":[92],"Secondly,":[93],"wafer":[95],"immersed":[97],"stripping":[100],"solution":[101],"remove":[103],"resist.":[104],"Finally,":[105],"plating":[108],"process":[109],"carried":[111],"out.":[112],"After":[113],"depositing":[114],"glass,":[118],"microlaminated":[119],"Mechanism":[126],"kinetics":[128],"an":[133],"Al2O3cell":[134],"are":[135,150],"studied.":[136],"Linear":[137],"relations":[138],"yield":[142],"voltage":[144],"applied,":[145],"time":[146,161],"particle":[148],"concentration":[149,155],"experimentally":[151],"verified":[152],"at":[153],"both":[154],"levels":[156],"(~2.5%)":[157],"short":[159],"(~40":[162],"s)":[163]},"counts_by_year":[],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2016-06-24T00:00:00"}