{"id":"https://openalex.org/W2007020005","doi":"https://doi.org/10.1116/1.590892","title":"Erratum: \u201cLow temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization\u201d [J. Vac. Sci. Technol. B 17, 1101 (1999)]","display_name":"Erratum: \u201cLow temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization\u201d [J. Vac. Sci. Technol. B 17, 1101 (1999)]","publication_year":1999,"publication_date":"1999-09-01","ids":{"openalex":"https://openalex.org/W2007020005","doi":"https://doi.org/10.1116/1.590892","mag":"2007020005"},"language":"en","primary_location":{"id":"doi:10.1116/1.590892","doi":"https://doi.org/10.1116/1.590892","is_oa":false,"landing_page_url":"https://doi.org/10.1116/1.590892","pdf_url":null,"source":{"id":"https://openalex.org/S4210169477","display_name":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","issn_l":"1071-1023","issn":["1071-1023","1520-8567"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","poland-70"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena","raw_type":"journal-article"},"volume":null,"type":"erratum","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111662421","display_name":"Jean E. Kelsey","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jean E. Kelsey","raw_affiliation_strings":["Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109333625","display_name":"Cindy Goldberg","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cindy Goldberg","raw_affiliation_strings":["Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066228722","display_name":"Guilleromo Nuesca","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Guilleromo Nuesca","raw_affiliation_strings":["Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Gregory Peterson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gregory Peterson","raw_affiliation_strings":["Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023624056","display_name":"Alain E. Kaloyeros","orcid":"https://orcid.org/0000-0002-6872-1707","observed_orcids":["https://orcid.org/0000-0002-6872-1707"]},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alain E. Kaloyeros","raw_affiliation_strings":["Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology and Department of Physics, The University of Albany\u2014SUNY, Albany, New York 12222","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5050498301","display_name":"Barry Arkles","orcid":"https://orcid.org/0000-0003-4580-2579","observed_orcids":["https://orcid.org/0000-0003-4580-2579"]},"institutions":[{"id":"https://openalex.org/I4210152463","display_name":"TE Laboratories (Ireland)","ror":"https://ror.org/05th81a29","country_code":"IE","type":"company","lineage":["https://openalex.org/I4210152463"]},{"id":"https://openalex.org/I4405262222","display_name":"Pennsylvania Geological Survey","ror":"https://ror.org/023z0r493","country_code":"US","type":"government","lineage":["https://openalex.org/I2801205178","https://openalex.org/I4405262222"]}],"countries":["IE","US"],"is_corresponding":false,"raw_author_name":"Barry Arkles","raw_affiliation_strings":["Gelest, Inc., Tullytown, Pennsylvania 19007"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Gelest, Inc., Tullytown, Pennsylvania 19007","institution_ids":["https://openalex.org/I4210152463","https://openalex.org/I4405262222"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"17","issue":"5","first_page":"2193","last_page":"2193"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tungsten-nitride","display_name":"tungsten nitride","score":0.9990000128746033},{"id":"https://openalex.org/keywords/diffusion-barrier","display_name":"diffusion barrier","score":0.777999997138977},{"id":"https://openalex.org/keywords/copper-metallization","display_name":"copper metallization","score":1.0},{"id":"https://openalex.org/keywords/metal-organic-chemical-vapor-deposition","display_name":"metalorganic chemical vapor deposition","score":0.9610000252723694},{"id":"https://openalex.org/keywords/low-temperature-deposition","display_name":"low-temperature deposition","score":0.9800000190734863}],"concepts":[{"id":"https://openalex.org/C2778836790","wikidata":"https://www.wikidata.org/wiki/Q5275435","display_name":"Diffusion barrier","level":3,"score":0.8227807879447937},{"id":"https://openalex.org/C542268612","wikidata":"https://www.wikidata.org/wiki/Q743","display_name":"Tungsten","level":2,"score":0.7444497346878052},{"id":"https://openalex.org/C57410435","wikidata":"https://www.wikidata.org/wiki/Q505668","display_name":"Chemical vapor deposition","level":2,"score":0.7352977991104126},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.6004155874252319},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5547927021980286},{"id":"https://openalex.org/C194760766","wikidata":"https://www.wikidata.org/wiki/Q410851","display_name":"Nitride","level":3,"score":0.5195639133453369},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.48656049370765686},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.43175172805786133},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.3564770817756653},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3417474925518036},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.32385605573654175},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2661612927913666},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06907561421394348},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.06286033987998962},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.059425413608551025},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.03852316737174988},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1116/1.590892","doi":"https://doi.org/10.1116/1.590892","is_oa":false,"landing_page_url":"https://doi.org/10.1116/1.590892","pdf_url":null,"source":{"id":"https://openalex.org/S4210169477","display_name":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","issn_l":"1071-1023","issn":["1071-1023","1520-8567"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","poland-70"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3029371262","https://openalex.org/W2022180449","https://openalex.org/W7025184118","https://openalex.org/W2145534974","https://openalex.org/W2520262805","https://openalex.org/W7112203579","https://openalex.org/W2523340802","https://openalex.org/W2557079810","https://openalex.org/W3032066449","https://openalex.org/W2054295299"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2016-06-24T00:00:00"}