{"id":"https://openalex.org/W2006475959","doi":"https://doi.org/10.1016/s0924-4247(98)00353-7","title":"Micromachining of fine ceramics by photolithography","display_name":"Micromachining of fine ceramics by photolithography","publication_year":1999,"publication_date":"1999-06-01","ids":{"openalex":"https://openalex.org/W2006475959","doi":"https://doi.org/10.1016/s0924-4247(98)00353-7","mag":"2006475959"},"language":"en","primary_location":{"id":"doi:10.1016/s0924-4247(98)00353-7","doi":"https://doi.org/10.1016/s0924-4247(98)00353-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0924-4247(98)00353-7","pdf_url":null,"source":{"id":"https://openalex.org/S16945967","display_name":"Sensors and Actuators A Physical","issn_l":"0924-4247","issn":["0924-4247","1873-3069"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors and Actuators A: Physical","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108558897","display_name":"Eiji Makino","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I205349734","display_name":"Hokkaido University","ror":"https://ror.org/02e16g702","country_code":"JP","type":"education","lineage":["https://openalex.org/I205349734"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Eiji Makino","raw_affiliation_strings":["Electronics and Information Engineering, Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-ku, Sapporo 060-8628, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Information Engineering, Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-ku, Sapporo 060-8628, Japan","institution_ids":["https://openalex.org/I205349734"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001830605","display_name":"Takayuki Shibata","orcid":"https://orcid.org/0000-0003-0972-2950","observed_orcids":["https://orcid.org/0000-0003-0972-2950"]},"institutions":[{"id":"https://openalex.org/I205349734","display_name":"Hokkaido University","ror":"https://ror.org/02e16g702","country_code":"JP","type":"education","lineage":["https://openalex.org/I205349734"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takayuki Shibata","raw_affiliation_strings":["Electronics and Information Engineering, Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-ku, Sapporo 060-8628, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Information Engineering, Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-ku, Sapporo 060-8628, Japan","institution_ids":["https://openalex.org/I205349734"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102398216","display_name":"Yoshihiko Yamada","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I205349734","display_name":"Hokkaido University","ror":"https://ror.org/02e16g702","country_code":"JP","type":"education","lineage":["https://openalex.org/I205349734"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yoshihiko Yamada","raw_affiliation_strings":["Electronics and Information Engineering, Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-ku, Sapporo 060-8628, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Information Engineering, Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-ku, Sapporo 060-8628, Japan","institution_ids":["https://openalex.org/I205349734"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5108558897"],"corresponding_institution_ids":["https://openalex.org/I205349734"],"apc_list":{"value":3750,"currency":"USD","value_usd":3750},"apc_paid":null,"fwci":0.443,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.66241911,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"75","issue":"3","first_page":"278","last_page":"288"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9761000275611877,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9761000275611877,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.009600000455975533,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.007300000172108412,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ceramic-micromachining","display_name":"ceramic micromachining","score":0.9089999794960022},{"id":"https://openalex.org/keywords/photolithography","display_name":"photolithography","score":0.9240000247955322},{"id":"https://openalex.org/keywords/phosphoric-acid-etching","display_name":"phosphoric acid etching","score":0.953000009059906},{"id":"https://openalex.org/keywords/alumina","display_name":"alumina","score":0.9380000233650208},{"id":"https://openalex.org/keywords/silicon-nitride","display_name":"silicon nitride","score":1.0},{"id":"https://openalex.org/keywords/vapor-condensation","display_name":"vapor condensation","score":0.6579999923706055},{"id":"https://openalex.org/keywords/refluxing","display_name":"refluxing","score":0.6610000133514404},{"id":"https://openalex.org/keywords/water-addition","display_name":"water addition","score":0.6880000233650208},{"id":"https://openalex.org/keywords/polyimide-precursors","display_name":"polyimide precursors","score":0.8669999837875366},{"id":"https://openalex.org/keywords/photoresist-adhesion","display_name":"photoresist adhesion","score":0.8180000185966492},{"id":"https://openalex.org/keywords/thermal-stability","display_name":"thermal stability","score":0.6980000138282776}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7460706830024719},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.724007248878479},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.710393488407135},{"id":"https://openalex.org/C176933379","wikidata":"https://www.wikidata.org/wiki/Q131877","display_name":"Natural rubber","level":2,"score":0.5778122544288635},{"id":"https://openalex.org/C157777378","wikidata":"https://www.wikidata.org/wiki/Q41716","display_name":"Boiling","level":2,"score":0.5573663115501404},{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.5499033331871033},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.5447115302085876},{"id":"https://openalex.org/C59061564","wikidata":"https://www.wikidata.org/wiki/Q7783071","display_name":"Thermal stability","level":2,"score":0.5375973582267761},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5113348364830017},{"id":"https://openalex.org/C2776622989","wikidata":"https://www.wikidata.org/wiki/Q184782","display_name":"Phosphoric acid","level":2,"score":0.4661940634250641},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4090096354484558},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.3755720555782318},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2064909040927887},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.14877405762672424},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.14475736021995544},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.11138483881950378},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.08853352069854736},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0924-4247(98)00353-7","doi":"https://doi.org/10.1016/s0924-4247(98)00353-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0924-4247(98)00353-7","pdf_url":null,"source":{"id":"https://openalex.org/S16945967","display_name":"Sensors and Actuators A Physical","issn_l":"0924-4247","issn":["0924-4247","1873-3069"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors and Actuators A: Physical","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1982886377","https://openalex.org/W1983442498","https://openalex.org/W1991112959","https://openalex.org/W2012349559","https://openalex.org/W2012923989","https://openalex.org/W2016398156","https://openalex.org/W2031042301","https://openalex.org/W2064039226","https://openalex.org/W2065446789","https://openalex.org/W2069419930","https://openalex.org/W2078858846","https://openalex.org/W2086043141","https://openalex.org/W2087039945","https://openalex.org/W2093589937","https://openalex.org/W2126878666","https://openalex.org/W2150883274","https://openalex.org/W2324383796","https://openalex.org/W2329370630"],"related_works":["https://openalex.org/W2324383796","https://openalex.org/W2009397473","https://openalex.org/W2326992944","https://openalex.org/W2329370630","https://openalex.org/W2018538521","https://openalex.org/W3141628472","https://openalex.org/W1994266842","https://openalex.org/W2014145252","https://openalex.org/W2317308228","https://openalex.org/W2089357203"],"abstract_inverted_index":null,"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}