{"id":"https://openalex.org/W2006199255","doi":"https://doi.org/10.1007/s11837-011-0178-z","title":"Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation","display_name":"Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation","publication_year":2011,"publication_date":"2011-10-01","ids":{"openalex":"https://openalex.org/W2006199255","doi":"https://doi.org/10.1007/s11837-011-0178-z","mag":"2006199255"},"language":"en","primary_location":{"id":"doi:10.1007/s11837-011-0178-z","doi":"https://doi.org/10.1007/s11837-011-0178-z","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11837-011-0178-z","pdf_url":null,"source":{"id":"https://openalex.org/S116826539","display_name":"JOM","issn_l":"0148-6608","issn":["0148-6608","1047-4838","1543-1851"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"JOM","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036142920","display_name":"Eric Chason","orcid":"https://orcid.org/0000-0003-3377-2691","observed_orcids":["https://orcid.org/0000-0003-3377-2691"]},"institutions":[{"id":"https://openalex.org/I27804330","display_name":"Brown University","ror":"https://ror.org/05gq02987","country_code":"US","type":"education","lineage":["https://openalex.org/I27804330"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Eric Chason","raw_affiliation_strings":["School of Engineering, Brown University, Providence, RI, 02912, USA","Brown University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Engineering, Brown University, Providence, RI, 02912, USA","institution_ids":["https://openalex.org/I27804330"]},{"raw_affiliation_string":"Brown University","institution_ids":["https://openalex.org/I27804330"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076923392","display_name":"Nitin Jadhav","orcid":"https://orcid.org/0000-0001-6748-0692","observed_orcids":["https://orcid.org/0000-0001-6748-0692"]},"institutions":[{"id":"https://openalex.org/I27804330","display_name":"Brown University","ror":"https://ror.org/05gq02987","country_code":"US","type":"education","lineage":["https://openalex.org/I27804330"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nitin Jadhav","raw_affiliation_strings":["School of Engineering, Brown University, Providence, RI, 02912, USA","Brown University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Engineering, Brown University, Providence, RI, 02912, USA","institution_ids":["https://openalex.org/I27804330"]},{"raw_affiliation_string":"Brown University","institution_ids":["https://openalex.org/I27804330"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5063356121","display_name":"Fei Pei","orcid":"https://orcid.org/0009-0001-1372-3190","observed_orcids":["https://orcid.org/0009-0001-1372-3190"]},"institutions":[{"id":"https://openalex.org/I27804330","display_name":"Brown University","ror":"https://ror.org/05gq02987","country_code":"US","type":"education","lineage":["https://openalex.org/I27804330"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Fei Pei","raw_affiliation_strings":["School of Engineering, Brown University, Providence, RI, 02912, USA","Brown University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Engineering, Brown University, Providence, RI, 02912, USA","institution_ids":["https://openalex.org/I27804330"]},{"raw_affiliation_string":"Brown University","institution_ids":["https://openalex.org/I27804330"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5036142920"],"corresponding_institution_ids":["https://openalex.org/I27804330"],"apc_list":{"value":3790,"currency":"USD","value_usd":3790},"apc_paid":null,"fwci":1.7337,"has_fulltext":false,"cited_by_count":30,"citation_normalized_percentile":{"value":0.84852673,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"63","issue":"10","first_page":"62","last_page":"68"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tin-whiskers","display_name":"tin whiskers","score":0.9649999737739563},{"id":"https://openalex.org/keywords/intermetallic-compound-growth","display_name":"intermetallic compound growth","score":0.9399999976158142},{"id":"https://openalex.org/keywords/compressive-stress","display_name":"compressive stress","score":0.6769999861717224},{"id":"https://openalex.org/keywords/stress-relaxation","display_name":"stress relaxation","score":0.8240000009536743},{"id":"https://openalex.org/keywords/sn-cu-interface","display_name":"Sn/Cu interface","score":0.6169999837875366},{"id":"https://openalex.org/keywords/grain-size","display_name":"grain size","score":0.5709999799728394},{"id":"https://openalex.org/keywords/layer-thickness","display_name":"layer thickness","score":0.6800000071525574},{"id":"https://openalex.org/keywords/lead-concentration","display_name":"lead content","score":0.8799999952316284},{"id":"https://openalex.org/keywords/microstructure","display_name":"microstructure","score":0.7120000123977661}],"concepts":[{"id":"https://openalex.org/C179111330","wikidata":"https://www.wikidata.org/wiki/Q901525","display_name":"Whisker","level":2,"score":0.982056200504303},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.9165421724319458},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8194692134857178},{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.7057859897613525},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.6489169001579285},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.6196407675743103},{"id":"https://openalex.org/C202974441","wikidata":"https://www.wikidata.org/wiki/Q2576844","display_name":"Stress relaxation","level":3,"score":0.5998040437698364},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.48324260115623474},{"id":"https://openalex.org/C192191005","wikidata":"https://www.wikidata.org/wiki/Q466491","display_name":"Grain size","level":2,"score":0.4616590440273285},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4547812044620514},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4404798448085785},{"id":"https://openalex.org/C2776029896","wikidata":"https://www.wikidata.org/wiki/Q3935810","display_name":"Relaxation (psychology)","level":2,"score":0.43361419439315796},{"id":"https://openalex.org/C65590680","wikidata":"https://www.wikidata.org/wiki/Q909482","display_name":"Volume fraction","level":2,"score":0.4299652576446533},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.13426437973976135},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.10532745718955994},{"id":"https://openalex.org/C77805123","wikidata":"https://www.wikidata.org/wiki/Q161272","display_name":"Social psychology","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s11837-011-0178-z","doi":"https://doi.org/10.1007/s11837-011-0178-z","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11837-011-0178-z","pdf_url":null,"source":{"id":"https://openalex.org/S116826539","display_name":"JOM","issn_l":"0148-6608","issn":["0148-6608","1047-4838","1543-1851"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"JOM","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1439379214","https://openalex.org/W1967402453","https://openalex.org/W1971164665","https://openalex.org/W1978936318","https://openalex.org/W2013441091","https://openalex.org/W2038950124","https://openalex.org/W2044194473","https://openalex.org/W2081308975","https://openalex.org/W2087039613","https://openalex.org/W2103688833","https://openalex.org/W2105339927","https://openalex.org/W2141660633","https://openalex.org/W2143429719","https://openalex.org/W2144532279","https://openalex.org/W2149189709","https://openalex.org/W2149989052","https://openalex.org/W4245769860","https://openalex.org/W6613006068","https://openalex.org/W6742891394"],"related_works":["https://openalex.org/W2103688833","https://openalex.org/W2083891719","https://openalex.org/W2050403520","https://openalex.org/W2149189709","https://openalex.org/W2913214313","https://openalex.org/W2111342377","https://openalex.org/W2148494929","https://openalex.org/W3049649411","https://openalex.org/W2199848508","https://openalex.org/W2300116651"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}