{"id":"https://openalex.org/W2006050501","doi":"https://doi.org/10.1109/iedm.2006.346980","title":"High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors","display_name":"High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W2006050501","doi":"https://doi.org/10.1109/iedm.2006.346980","mag":"2006050501"},"language":"en","primary_location":{"id":"doi:10.1109/iedm.2006.346980","doi":"https://doi.org/10.1109/iedm.2006.346980","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iedm.2006.346980","pdf_url":null,"source":{"id":"https://openalex.org/S4210168112","display_name":"Technical digest - International Electron Devices Meeting/Technical digest","issn_l":"0163-1918","issn":["0163-1918","2156-017X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 International Electron Devices Meeting","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048998602","display_name":"Dorota S. Temple","orcid":"https://orcid.org/0000-0003-4195-6888","observed_orcids":["https://orcid.org/0000-0003-4195-6888"]},"institutions":[{"id":"https://openalex.org/I180297670","display_name":"RTI International","ror":"https://ror.org/052tfza37","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I137902535","https://openalex.org/I170897317","https://openalex.org/I180297670"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Temple","raw_affiliation_strings":["RTI International, Inc., NC, USA","RTI International, Research Triangle Park, NC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RTI International, Inc., NC, USA","institution_ids":["https://openalex.org/I180297670"]},{"raw_affiliation_string":"RTI International, Research Triangle Park, NC","institution_ids":["https://openalex.org/I180297670"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051607771","display_name":"Christopher A. Bower","orcid":"https://orcid.org/0000-0002-3002-4439","observed_orcids":["https://orcid.org/0000-0002-3002-4439","https://orcid.org/0009-0009-9411-1783"]},"institutions":[{"id":"https://openalex.org/I180297670","display_name":"RTI International","ror":"https://ror.org/052tfza37","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I137902535","https://openalex.org/I170897317","https://openalex.org/I180297670"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. A. Bower","raw_affiliation_strings":["RTI International, Inc., NC, USA","RTI International, Research Triangle Park, NC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RTI International, Inc., NC, USA","institution_ids":["https://openalex.org/I180297670"]},{"raw_affiliation_string":"RTI International, Research Triangle Park, NC","institution_ids":["https://openalex.org/I180297670"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108466696","display_name":"Dean M. Malta","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I180297670","display_name":"RTI International","ror":"https://ror.org/052tfza37","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I137902535","https://openalex.org/I170897317","https://openalex.org/I180297670"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Malta","raw_affiliation_strings":["RTI International, Inc., NC, USA","RTI International, Research Triangle Park, NC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RTI International, Inc., NC, USA","institution_ids":["https://openalex.org/I180297670"]},{"raw_affiliation_string":"RTI International, Research Triangle Park, NC","institution_ids":["https://openalex.org/I180297670"]}]},{"author_position":"middle","author":{"id":null,"display_name":"J. E. Robinson","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. E. Robinson","raw_affiliation_strings":["DRS Infrared Technologies, Dallas, TX","DRS Infrared Technologies, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX","institution_ids":[]},{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000702811","display_name":"Phillip R. Coffman","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"P. R. Coffman","raw_affiliation_strings":["DRS Infrared Technologies, Dallas, TX","DRS Infrared Technologies, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX","institution_ids":[]},{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076433578","display_name":"Mark R. Skokan","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. R. Skokan","raw_affiliation_strings":["DRS Infrared Technologies, Dallas, TX","DRS Infrared Technologies, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX","institution_ids":[]},{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017081594","display_name":"Terry B. Welch","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. B. Welch","raw_affiliation_strings":["DRS Infrared Technologies, Dallas, TX","DRS Infrared Technologies, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX","institution_ids":[]},{"raw_affiliation_string":"DRS Infrared Technologies, Dallas, TX, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.2202,"has_fulltext":false,"cited_by_count":27,"citation_normalized_percentile":{"value":0.94556071,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11637","display_name":"Advanced Semiconductor Detectors and Materials","score":0.0013000000035390258,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-integration","display_name":"3D integration","score":0.9610000252723694},{"id":"https://openalex.org/keywords/silicon-integrated-circuits","display_name":"silicon integrated circuits","score":0.8199999928474426},{"id":"https://openalex.org/keywords/infrared-focal-plane-arrays","display_name":"infrared focal plane arrays","score":0.7670000195503235},{"id":"https://openalex.org/keywords/on-chip-signal-processing","display_name":"on-chip signal processing","score":0.972000002861023},{"id":"https://openalex.org/keywords/massively-parallel-processing","display_name":"massively parallel computing","score":0.6690000295639038},{"id":"https://openalex.org/keywords/hybrid-sensors","display_name":"hybrid sensors","score":0.37700000405311584},{"id":"https://openalex.org/keywords/silicon-electronics","display_name":"silicon electronics","score":0.49799999594688416},{"id":"https://openalex.org/keywords/multilayer-integration","display_name":"multilayer integration","score":0.5920000076293945}],"concepts":[{"id":"https://openalex.org/C190475519","wikidata":"https://www.wikidata.org/wiki/Q544384","display_name":"Massively parallel","level":2,"score":0.761100709438324},{"id":"https://openalex.org/C94915269","wikidata":"https://www.wikidata.org/wiki/Q1834857","display_name":"Detector","level":2,"score":0.5422715544700623},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.5203525424003601},{"id":"https://openalex.org/C138395690","wikidata":"https://www.wikidata.org/wiki/Q376733","display_name":"Cardinal point","level":2,"score":0.5172979831695557},{"id":"https://openalex.org/C158355884","wikidata":"https://www.wikidata.org/wiki/Q11388","display_name":"Infrared","level":2,"score":0.5039891600608826},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5019552707672119},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5017528533935547},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4761279225349426},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4719219207763672},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.4562391936779022},{"id":"https://openalex.org/C2781299968","wikidata":"https://www.wikidata.org/wiki/Q7601922","display_name":"Focal Plane Arrays","level":3,"score":0.4331275522708893},{"id":"https://openalex.org/C66251956","wikidata":"https://www.wikidata.org/wiki/Q7451086","display_name":"Sensor array","level":2,"score":0.42073649168014526},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4187816381454468},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.328022837638855},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.30668094754219055},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2633891701698303},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2560386061668396},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22530975937843323},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.199838787317276},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.16174465417861938},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15833035111427307},{"id":"https://openalex.org/C84462506","wikidata":"https://www.wikidata.org/wiki/Q173142","display_name":"Digital signal processing","level":2,"score":0.1492684781551361},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.06733223795890808},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iedm.2006.346980","doi":"https://doi.org/10.1109/iedm.2006.346980","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iedm.2006.346980","pdf_url":null,"source":{"id":"https://openalex.org/S4210168112","display_name":"Technical digest - International Electron Devices Meeting/Technical digest","issn_l":"0163-1918","issn":["0163-1918","2156-017X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 International Electron Devices Meeting","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1996383552","https://openalex.org/W2013938035","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2092157171","https://openalex.org/W2170501415","https://openalex.org/W1536951698","https://openalex.org/W1967286648","https://openalex.org/W6958892209","https://openalex.org/W2033300905","https://openalex.org/W2287433860","https://openalex.org/W2083601610","https://openalex.org/W1978714556","https://openalex.org/W2172628169"],"abstract_inverted_index":{"The":[0,17],"paper":[1],"describes":[2],"a":[3,28],"platform":[4],"technology":[5,18],"for":[6],"three-dimensional":[7],"(3-D)":[8],"integration":[9],"of":[10,13,27,30],"multiple":[11],"layers":[12],"silicon":[14],"integrated":[15],"circuits.":[16],"promises":[19],"to":[20],"dramatically":[21],"enhance":[22],"on-chip":[23],"signal":[24],"processing":[25],"capabilities":[26],"variety":[29],"sensor":[31],"and":[32],"actuator":[33],"devices":[34],"hybridized":[35],"with":[36],"Si":[37],"electronics.":[38],"Among":[39],"these":[40],"applications":[41],"are":[42],"high":[43],"performance":[44],"infrared":[45],"focal":[46],"plane":[47],"array":[48],"detectors":[49]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":6},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":3}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}