{"id":"https://openalex.org/W2005457249","doi":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","title":"Porous Nitride Ceramic Composites with Low-Dielectric Properties","display_name":"Porous Nitride Ceramic Composites with Low-Dielectric Properties","publication_year":2012,"publication_date":"2012-06-01","ids":{"openalex":"https://openalex.org/W2005457249","doi":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","mag":"2005457249"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/kem.512-515.849","doi":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041359594","display_name":"Rong Liao","orcid":"https://orcid.org/0009-0005-1274-5071","observed_orcids":["https://orcid.org/0009-0005-1274-5071"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rong Liao","raw_affiliation_strings":["Industrial Ceramics Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Ceramics Co. Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003272042","display_name":"Chong Hai Wang","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chong Hai Wang","raw_affiliation_strings":["Industrial Ceramics Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Ceramics Co. Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5107388117","display_name":"Jian Liu","orcid":"https://orcid.org/0000-0002-4560-3177","observed_orcids":["https://orcid.org/0000-0002-4560-3177"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jian Liu","raw_affiliation_strings":["Industrial Ceramics Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Ceramics Co. Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103444499","display_name":"Hong Sheng Wang","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hong Sheng Wang","raw_affiliation_strings":["Industrial Ceramics Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Ceramics Co. Ltd","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103817768","display_name":"Qi Hong Wei","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Qi Hong Wei","raw_affiliation_strings":["Industrial Ceramics Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Ceramics Co. Ltd","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13820138,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"512-515","issue":null,"first_page":"849","last_page":"853"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9750999808311462,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9750999808311462,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12155","display_name":"Microwave Dielectric Ceramics Synthesis","score":0.019999999552965164,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13249","display_name":"Dielectric properties of ceramics","score":0.003800000064074993,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dielectric-constant","display_name":"dielectric constant","score":0.8050000071525574},{"id":"https://openalex.org/keywords/porosity","display_name":"porosity","score":0.8100000023841858},{"id":"https://openalex.org/keywords/apparent-density","display_name":"apparent density","score":0.8920000195503235},{"id":"https://openalex.org/keywords/mechanical-strength","display_name":"mechanical strength","score":0.8759999871253967},{"id":"https://openalex.org/keywords/ceramic-microstructure","display_name":"ceramic microstructure","score":0.4259999990463257}],"concepts":[{"id":"https://openalex.org/C2781436864","wikidata":"https://www.wikidata.org/wiki/Q418875","display_name":"Mullite","level":3,"score":0.9552712440490723},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9191491603851318},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.8345985412597656},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.8263981342315674},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.7022961974143982},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.646239161491394},{"id":"https://openalex.org/C194760766","wikidata":"https://www.wikidata.org/wiki/Q410851","display_name":"Nitride","level":3,"score":0.6017277240753174},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.5945367813110352},{"id":"https://openalex.org/C2780243435","wikidata":"https://www.wikidata.org/wiki/Q410193","display_name":"Boron nitride","level":2,"score":0.45992311835289},{"id":"https://openalex.org/C47566043","wikidata":"https://www.wikidata.org/wiki/Q477605","display_name":"Ceramic matrix composite","level":3,"score":0.4472898244857788},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.14727240800857544},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/kem.512-515.849","doi":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4028/www.scientific.net/kem.512-515.849","doi":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.512-515.849","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W6600009415","https://openalex.org/W6600234944","https://openalex.org/W6600493712","https://openalex.org/W6602625421"],"related_works":["https://openalex.org/W2244202051","https://openalex.org/W2360159079","https://openalex.org/W2035261599","https://openalex.org/W3035222915","https://openalex.org/W2084306492","https://openalex.org/W2978361386","https://openalex.org/W2247604446","https://openalex.org/W2789331767","https://openalex.org/W1141794173","https://openalex.org/W1978817822"],"abstract_inverted_index":{"The":[0,86],"influences":[1],"of":[2,11,26,40,58,88],"the":[3,20,24,27,33,41,50,59,67,75,83,89],"mullite":[4,34,60,68],"hollow":[5,35,61,69],"balls":[6,36,70],"content":[7],"on":[8],"selected":[9],"properties":[10,87],"Si3N4-BN":[12],"matrix":[13],"ceramics":[14],"were":[15,93],"investigated.The":[16],"experiment":[17],"showed":[18,65],"that":[19,66],"apparent":[21],"densities":[22],"and":[23,49],"porosity":[25],"nitride":[28,43,76,90],"ceramic":[29,44,77,91],"composites":[30,92],"decreased":[31,53],"as":[32],"contents":[37],"increased.The":[38],"strength":[39],"porous":[42],"composite":[45],"was":[46],"greatly":[47],"improved,":[48],"dielectric":[51],"constant":[52],"with":[54,74],"a":[55],"small":[56],"addition":[57],"balls.":[62],"SEM":[63],"micrographs":[64],"became":[71],"one":[72],"flesh":[73],"composites.Many":[78],"large":[79],"pores":[80],"appeared":[81],"in":[82],"whole":[84],"materials.":[85],"effectively":[94],"improved.":[95]},"counts_by_year":[],"updated_date":"2026-08-21T09:56:20.448147","created_date":"2016-06-24T00:00:00"}