{"id":"https://openalex.org/W2005454143","doi":"https://doi.org/10.1117/12.2011434","title":"Capability study and challenges to sub-2x nm node contact hole patterning","display_name":"Capability study and challenges to sub-2x nm node contact hole patterning","publication_year":2013,"publication_date":"2013-03-29","ids":{"openalex":"https://openalex.org/W2005454143","doi":"https://doi.org/10.1117/12.2011434","mag":"2005454143"},"language":"en","primary_location":{"id":"doi:10.1117/12.2011434","doi":"https://doi.org/10.1117/12.2011434","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2011434","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103480593","display_name":"Wan-Lin Kuo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wan-Lin Kuo","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ya-Ting Chan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ya-Ting Chan","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Meng-Feng Tsai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Meng-Feng Tsai","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102260921","display_name":"Yi-Shiang Chang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi-Shiang Chang","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113610074","display_name":"Chia\u2010Chi Lin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Chi Lin","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087125602","display_name":"Ming-Chien Chiu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ming-Chien Chiu","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015770421","display_name":"Chun-Hsun Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Hsun Chen","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Hung-Ming Wu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hung-Ming Wu","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045024022","display_name":"Mao-Hsing Chiu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210148926","display_name":"Powerchip (Taiwan)","ror":"https://ror.org/04e2r7y81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148926"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Mao-Hsing Chiu","raw_affiliation_strings":["Powerchip Semiconductor Corp. (Taiwan)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Powerchip Semiconductor Corp. (Taiwan)","institution_ids":["https://openalex.org/I4210148926"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210148926"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"8682","issue":null,"first_page":"86821G","last_page":"86821G"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.00039999998989515007,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/contact-hole-patterning","display_name":"contact hole patterning","score":0.9919999837875366},{"id":"https://openalex.org/keywords/self-aligned-double-patterning","display_name":"self-aligned double patterning","score":0.8830000162124634},{"id":"https://openalex.org/keywords/critical-dimension-uniformity","display_name":"critical dimension uniformity","score":0.5920000076293945},{"id":"https://openalex.org/keywords/high-density-memory-devices","display_name":"high-density memory devices","score":0.7770000100135803},{"id":"https://openalex.org/keywords/chip-size-reduction","display_name":"chip size reduction","score":0.6370000243186951}],"concepts":[{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.8588732481002808},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6825119256973267},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6304307579994202},{"id":"https://openalex.org/C180145272","wikidata":"https://www.wikidata.org/wiki/Q7504144","display_name":"Shrinkage","level":2,"score":0.5842472910881042},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.5792500376701355},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5738906264305115},{"id":"https://openalex.org/C134247516","wikidata":"https://www.wikidata.org/wiki/Q5164846","display_name":"Contact process (mathematics)","level":2,"score":0.5418693423271179},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.5285524129867554},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5235782861709595},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.49458929896354675},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4647449851036072},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.44971996545791626},{"id":"https://openalex.org/C33373654","wikidata":"https://www.wikidata.org/wiki/Q5164821","display_name":"Contact area","level":2,"score":0.4160170257091522},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.4155738651752472},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.34955334663391113},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.30040937662124634},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.14733722805976868},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12096482515335083},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.07942765951156616},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121864883","wikidata":"https://www.wikidata.org/wiki/Q677916","display_name":"Statistical physics","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.2011434","doi":"https://doi.org/10.1117/12.2011434","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2011434","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1989308261","https://openalex.org/W1990005187","https://openalex.org/W2032218050","https://openalex.org/W2037583224","https://openalex.org/W2038178364","https://openalex.org/W2090109439"],"related_works":["https://openalex.org/W2073521128","https://openalex.org/W2025649885","https://openalex.org/W2138558692","https://openalex.org/W2058790668","https://openalex.org/W2044613710","https://openalex.org/W1989308261","https://openalex.org/W2006894793","https://openalex.org/W1989233449","https://openalex.org/W2308580079","https://openalex.org/W2093730182"],"abstract_inverted_index":{"As":[0],"the":[1,13,21,62,135,152,160],"scaling":[2],"down":[3],"of":[4,20,65],"design":[5],"rule":[6],"for":[7,48],"high":[8],"density":[9],"memory":[10],"device":[11],"continues,":[12],"contact":[14,94,120,153],"hole":[15,121,154],"size":[16,57,107],"shrinkage":[17,27],"becomes":[18],"one":[19],"major":[22],"challenges":[23],"to":[24,84],"patterning.":[25],"Many":[26],"approaches":[28],"have":[29,149],"been":[30],"introduced":[31],"after":[32],"litho.":[33],"process,":[34,104,132,147],"such":[35],"as":[36],"chemical":[37,130],"shrink,":[38,42],"PR":[39],"reflow,":[40],"RIE":[41],"etc.":[43],"However,":[44],"CD":[45,97,136],"uniformity":[46,98,137],"control":[47],"these":[49],"shrink":[50,131],"processes":[51],"is":[52,58,99,109,169],"critical,":[53],"and":[54,92,105,133,138],"minimum":[55],"pitch":[56],"still":[59],"dominated":[60],"by":[61,102,111],"resolution":[63,139],"limitation":[64],"lithography":[66],"tools.":[67],"In":[68],"this":[69,112,126,167],"paper,":[70],"we":[71,148],"adopt":[72],"SADP":[73,103,174],"(self-aligned":[74],"double":[75],"patterning)":[76],"process":[77],"combined":[78],"with":[79,118,129,172],"additional":[80],"non-critical":[81],"mask":[82],"step":[83],"form":[85],"32nm":[86],"hp":[87],"elliptical":[88],"single":[89,114],"row":[90,115],"dense":[91],"isolated":[93],"holes.":[95],"The":[96],"well":[100],"controlled":[101],"chip":[106],"reduction":[108],"achievable":[110],"high-density":[113],"layout":[116],"compared":[117,125],"interlace":[119],"design.":[122],"We":[123],"also":[124,170],"new":[127],"approach":[128,168],"both":[134],"limit":[140],"are":[141],"improved.":[142],"With":[143],"optimized":[144],"step-by-step":[145],"etch":[146],"successfully":[150],"demonstrated":[151],"patterns":[155],"on":[156],"full-structure":[157],"substrate.":[158],"For":[159],"future":[161],"application":[162],"toward":[163],"sub-2x":[164],"nm":[165],"node,":[166],"expectable":[171],"mature":[173],"process.":[175]},"counts_by_year":[],"updated_date":"2026-10-14T16:39:01.820549","created_date":"2016-06-24T00:00:00"}