{"id":"https://openalex.org/W2005373653","doi":"https://doi.org/10.2320/matertrans.46.2737","title":"Reliability of Solder Joint with Sn\u2013Ag\u2013Cu\u2013Ni\u2013Ge Lead-Free Alloy under Heat Exposure Conditions","display_name":"Reliability of Solder Joint with Sn\u2013Ag\u2013Cu\u2013Ni\u2013Ge Lead-Free Alloy under Heat Exposure Conditions","publication_year":2005,"publication_date":"2005-01-01","ids":{"openalex":"https://openalex.org/W2005373653","doi":"https://doi.org/10.2320/matertrans.46.2737","mag":"2005373653"},"language":"en","primary_location":{"id":"doi:10.2320/matertrans.46.2737","doi":"https://doi.org/10.2320/matertrans.46.2737","is_oa":true,"landing_page_url":"https://doi.org/10.2320/matertrans.46.2737","pdf_url":"https://www.jstage.jst.go.jp/article/matertrans/46/12/46_12_2737/_pdf","source":{"id":"https://openalex.org/S4210209311","display_name":"MATERIALS TRANSACTIONS","issn_l":"1345-9678","issn":["1345-9678","1347-5320"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4322765269","host_organization_name":"Japan Institute of Metals","host_organization_lineage":["https://openalex.org/P4322765269"],"host_organization_lineage_names":["Japan Institute of Metals"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MATERIALS TRANSACTIONS","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://www.jstage.jst.go.jp/article/matertrans/46/12/46_12_2737/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112841667","display_name":"Ikuo Shohji","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I165735259","display_name":"Gunma University","ror":"https://ror.org/046fm7598","country_code":"JP","type":"education","lineage":["https://openalex.org/I165735259"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ikuo Shohji","raw_affiliation_strings":["Faculty of Engineering, Gunma University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Gunma University","institution_ids":["https://openalex.org/I165735259"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Satoshi Tsunoda","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I165735259","display_name":"Gunma University","ror":"https://ror.org/046fm7598","country_code":"JP","type":"education","lineage":["https://openalex.org/I165735259"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Satoshi Tsunoda","raw_affiliation_strings":["Faculty of Engineering, Gunma University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Gunma University","institution_ids":["https://openalex.org/I165735259"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085791764","display_name":"Hirohiko Watanabe","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405275337","display_name":"FUJI Electric Advanced Technology Co., Ltd. (Japan)","ror":"https://ror.org/03dvdyv56","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275337"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hirohiko Watanabe","raw_affiliation_strings":["Fuji Electric Advanced Technology Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fuji Electric Advanced Technology Co., Ltd","institution_ids":["https://openalex.org/I4405275337"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035016071","display_name":"Tatsuhiko Asai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405275337","display_name":"FUJI Electric Advanced Technology Co., Ltd. (Japan)","ror":"https://ror.org/03dvdyv56","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275337"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tatsuhiko Asai","raw_affiliation_strings":["Fuji Electric Advanced Technology Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fuji Electric Advanced Technology Co., Ltd","institution_ids":["https://openalex.org/I4405275337"]}]},{"author_position":"last","author":{"id":null,"display_name":"Megumi Nagano","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405275337","display_name":"FUJI Electric Advanced Technology Co., Ltd. (Japan)","ror":"https://ror.org/03dvdyv56","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275337"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Megumi Nagano","raw_affiliation_strings":["Fuji Electric Advanced Technology Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fuji Electric Advanced Technology Co., Ltd","institution_ids":["https://openalex.org/I4405275337"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.2147,"has_fulltext":true,"cited_by_count":29,"citation_normalized_percentile":{"value":0.86773885,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"46","issue":"12","first_page":"2737","last_page":"2744"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.9229999780654907},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.9919999837875366},{"id":"https://openalex.org/keywords/heat-exposure","display_name":"heat exposure","score":0.9300000071525574},{"id":"https://openalex.org/keywords/microstructural-evolution","display_name":"microstructure evolution","score":0.7229999899864197},{"id":"https://openalex.org/keywords/joint-interface","display_name":"joint interface","score":0.640999972820282},{"id":"https://openalex.org/keywords/ball-shear-strength","display_name":"ball shear strength","score":0.8569999933242798},{"id":"https://openalex.org/keywords/sn-ag-cu-solder","display_name":"Sn-Ag-Cu solder","score":0.9350000023841858}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8956136703491211},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7958475351333618},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.7830946445465088},{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.7142425775527954},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6705498695373535},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.49650508165359497},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.4224134385585785},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.06413531303405762},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.2320/matertrans.46.2737","doi":"https://doi.org/10.2320/matertrans.46.2737","is_oa":true,"landing_page_url":"https://doi.org/10.2320/matertrans.46.2737","pdf_url":"https://www.jstage.jst.go.jp/article/matertrans/46/12/46_12_2737/_pdf","source":{"id":"https://openalex.org/S4210209311","display_name":"MATERIALS TRANSACTIONS","issn_l":"1345-9678","issn":["1345-9678","1347-5320"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4322765269","host_organization_name":"Japan Institute of Metals","host_organization_lineage":["https://openalex.org/P4322765269"],"host_organization_lineage_names":["Japan Institute of Metals"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MATERIALS TRANSACTIONS","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.2320/matertrans.46.2737","doi":"https://doi.org/10.2320/matertrans.46.2737","is_oa":true,"landing_page_url":"https://doi.org/10.2320/matertrans.46.2737","pdf_url":"https://www.jstage.jst.go.jp/article/matertrans/46/12/46_12_2737/_pdf","source":{"id":"https://openalex.org/S4210209311","display_name":"MATERIALS TRANSACTIONS","issn_l":"1345-9678","issn":["1345-9678","1347-5320"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4322765269","host_organization_name":"Japan Institute of Metals","host_organization_lineage":["https://openalex.org/P4322765269"],"host_organization_lineage_names":["Japan Institute of Metals"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MATERIALS TRANSACTIONS","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2005373653.pdf","grobid_xml":"https://content.openalex.org/works/W2005373653.grobid-xml"},"referenced_works_count":13,"referenced_works":["https://openalex.org/W263752237","https://openalex.org/W1424108784","https://openalex.org/W1972224790","https://openalex.org/W1985892984","https://openalex.org/W1992582738","https://openalex.org/W1999472422","https://openalex.org/W2028600542","https://openalex.org/W2037243623","https://openalex.org/W2051084601","https://openalex.org/W2066089619","https://openalex.org/W2070944201","https://openalex.org/W2335001511","https://openalex.org/W2514528509"],"related_works":["https://openalex.org/W2016370909","https://openalex.org/W2036118705","https://openalex.org/W2003222034","https://openalex.org/W2124944164","https://openalex.org/W1980119958","https://openalex.org/W2002410333","https://openalex.org/W4416878243","https://openalex.org/W2131886431","https://openalex.org/W4416876072","https://openalex.org/W7108217840"],"abstract_inverted_index":{"The":[0,82],"reliability":[1,109],"of":[2,47,53,57,75,84,100,103,110],"a":[3,8,31,36,104],"solder":[4,59,112],"ball":[5,28,60,94],"joint":[6,80,89,113],"with":[7,30,45],"Sn\u2013Ag\u2013Cu\u2013Ni\u2013Ge":[9,49],"lead-free":[10,19],"alloy,":[11],"which":[12],"is":[13],"expected":[14],"to":[15,43,64],"be":[16],"an":[17],"advanced":[18],"solder,":[20],"was":[21,91,114],"investigated":[22,92],"under":[23],"heat":[24,85],"exposure":[25,86],"conditions.":[26],"Solder":[27],"joints":[29,61],"eutectic":[32],"Sn\u2013Ag":[33],"alloy":[34,39],"and":[35,71],"ternary":[37],"Sn\u2013Ag\u2013Cu":[38],"were":[40,62],"also":[41,115],"prepared":[42],"compare":[44],"that":[46],"the":[48,54,58,69,72,98,108,111],"alloy.":[50],"Microstructual":[51],"observations":[52],"cross":[55],"sections":[56],"conducted":[63],"investigate":[65],"microstructural":[66],"evolutions":[67],"in":[68],"solders":[70],"growth":[73],"kinetics":[74],"reaction":[76],"layers":[77],"formed":[78],"at":[79],"interfaces.":[81],"influence":[83,99],"treatment":[87,102],"on":[88,107],"strength":[90],"by":[93],"shear":[95],"test.":[96],"Moreover,":[97],"surface":[101],"Cu":[105],"pad":[106],"investigated.":[116]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}