{"id":"https://openalex.org/W2005373647","doi":"https://doi.org/10.1016/j.microrel.2009.03.006","title":"Experimental investigations and model study of moisture behaviors in polymeric materials","display_name":"Experimental investigations and model study of moisture behaviors in polymeric materials","publication_year":2009,"publication_date":"2009-04-24","ids":{"openalex":"https://openalex.org/W2005373647","doi":"https://doi.org/10.1016/j.microrel.2009.03.006","mag":"2005373647"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2009.03.006","doi":"https://doi.org/10.1016/j.microrel.2009.03.006","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2009.03.006","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090264841","display_name":"Xuejun Fan","orcid":"https://orcid.org/0000-0003-0525-4424","observed_orcids":["https://orcid.org/0000-0003-0525-4424"]},"institutions":[{"id":"https://openalex.org/I177898655","display_name":"Lamar University","ror":"https://ror.org/008ms5s18","country_code":"US","type":"education","lineage":["https://openalex.org/I177898655"]},{"id":"https://openalex.org/I90610280","display_name":"South China University of Technology","ror":"https://ror.org/0530pts50","country_code":"CN","type":"education","lineage":["https://openalex.org/I90610280"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"X.J. Fan","raw_affiliation_strings":["Department of Engineering Mechanics, South China University of Technology, Guangzhou 510640, China","Department of Mechanical Engineering, P.O. Box 10028, Lamar University, Beaumont, TX 77710, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Engineering Mechanics, South China University of Technology, Guangzhou 510640, China","institution_ids":["https://openalex.org/I90610280"]},{"raw_affiliation_string":"Department of Mechanical Engineering, P.O. Box 10028, Lamar University, Beaumont, TX 77710, USA","institution_ids":["https://openalex.org/I177898655"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061913080","display_name":"S. W. Ricky Lee","orcid":"https://orcid.org/0000-0002-7706-522X","observed_orcids":["https://orcid.org/0000-0002-7706-522X"]},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"S.W.R. Lee","raw_affiliation_strings":["Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong","Department of Mechanical Engineering, Hong Kong University of#N# Science and Technology, Clear Water Bay, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I200769079"]},{"raw_affiliation_string":"Department of Mechanical Engineering, Hong Kong University of#N# Science and Technology, Clear Water Bay, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100415670","display_name":"Qiang Han","orcid":"https://orcid.org/0000-0002-9972-461X","observed_orcids":["https://orcid.org/0000-0002-9972-461X"]},"institutions":[{"id":"https://openalex.org/I90610280","display_name":"South China University of Technology","ror":"https://ror.org/0530pts50","country_code":"CN","type":"education","lineage":["https://openalex.org/I90610280"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Q. Han","raw_affiliation_strings":["Department of Engineering Mechanics, South China University of Technology, Guangzhou 510640, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Engineering Mechanics, South China University of Technology, Guangzhou 510640, China","institution_ids":["https://openalex.org/I90610280"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5090264841"],"corresponding_institution_ids":["https://openalex.org/I177898655","https://openalex.org/I90610280"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":10.0314,"has_fulltext":false,"cited_by_count":179,"citation_normalized_percentile":{"value":0.98474089,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":100},"biblio":{"volume":"49","issue":"8","first_page":"861","last_page":"871"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9839000105857849,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9839000105857849,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12105","display_name":"Hygrothermal properties of building materials","score":0.0019000000320374966,"subfield":{"id":"https://openalex.org/subfields/2215","display_name":"Building and Construction"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10310","display_name":"Corrosion Behavior and Inhibition","score":0.0007999999797903001,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/water-sorption","display_name":"water sorption","score":0.8690000176429749},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.6050000190734863},{"id":"https://openalex.org/keywords/underfill","display_name":"underfill","score":0.6759999990463257},{"id":"https://openalex.org/keywords/molding-compound","display_name":"molding compound","score":0.9229999780654907},{"id":"https://openalex.org/keywords/non-fickian-diffusion","display_name":"non-Fickian diffusion","score":0.8989999890327454},{"id":"https://openalex.org/keywords/glass-transition-temperature","display_name":"glass transition temperature","score":0.8460000157356262},{"id":"https://openalex.org/keywords/water-vapor-transmission","display_name":"water vapor transmission","score":0.6299999952316284},{"id":"https://openalex.org/keywords/hydrophobic-films","display_name":"hydrophobic films","score":0.8809999823570251},{"id":"https://openalex.org/keywords/pore-size-and-porosity","display_name":"pore size and porosity","score":0.8100000023841858},{"id":"https://openalex.org/keywords/fractional-free-volume","display_name":"fractional free volume","score":0.800000011920929},{"id":"https://openalex.org/keywords/hygroscopic-swelling","display_name":"hygroscopic swelling","score":0.9520000219345093},{"id":"https://openalex.org/keywords/viscoelastic-deformation","display_name":"viscoelastic deformation","score":0.9440000057220459},{"id":"https://openalex.org/keywords/moisture-transport-modeling","display_name":"moisture transport modeling","score":0.32100000977516174}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7417914867401123},{"id":"https://openalex.org/C53403541","wikidata":"https://www.wikidata.org/wiki/Q856634","display_name":"Fick's laws of diffusion","level":3,"score":0.6449906229972839},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6227441430091858},{"id":"https://openalex.org/C176864760","wikidata":"https://www.wikidata.org/wiki/Q217651","display_name":"Moisture","level":2,"score":0.6057043075561523},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.5949898362159729},{"id":"https://openalex.org/C122865956","wikidata":"https://www.wikidata.org/wiki/Q825643","display_name":"Glass transition","level":3,"score":0.5918697714805603},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.477060467004776},{"id":"https://openalex.org/C147534773","wikidata":"https://www.wikidata.org/wiki/Q190120","display_name":"Water vapor","level":2,"score":0.4765216112136841},{"id":"https://openalex.org/C58445606","wikidata":"https://www.wikidata.org/wiki/Q898533","display_name":"Sorption","level":3,"score":0.46027064323425293},{"id":"https://openalex.org/C3017894415","wikidata":"https://www.wikidata.org/wiki/Q7979883","display_name":"Weight change","level":4,"score":0.43785589933395386},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.43623408675193787},{"id":"https://openalex.org/C24939127","wikidata":"https://www.wikidata.org/wiki/Q373499","display_name":"Water content","level":2,"score":0.4241058826446533},{"id":"https://openalex.org/C65590680","wikidata":"https://www.wikidata.org/wiki/Q909482","display_name":"Volume fraction","level":2,"score":0.41450995206832886},{"id":"https://openalex.org/C150394285","wikidata":"https://www.wikidata.org/wiki/Q180254","display_name":"Adsorption","level":2,"score":0.29199618101119995},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.20639890432357788},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.1716170310974121},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.10067647695541382},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C187320778","wikidata":"https://www.wikidata.org/wiki/Q1349130","display_name":"Geotechnical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C511355011","wikidata":"https://www.wikidata.org/wiki/Q12174","display_name":"Obesity","level":2,"score":0.0},{"id":"https://openalex.org/C544821477","wikidata":"https://www.wikidata.org/wiki/Q718113","display_name":"Weight loss","level":3,"score":0.0},{"id":"https://openalex.org/C126322002","wikidata":"https://www.wikidata.org/wiki/Q11180","display_name":"Internal medicine","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1016/j.microrel.2009.03.006","doi":"https://doi.org/10.1016/j.microrel.2009.03.006","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2009.03.006","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-18026","doi":null,"is_oa":false,"landing_page_url":"https://repository.hkust.edu.hk/ir/Record/1783.1-18026","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":37,"referenced_works":["https://openalex.org/W140725881","https://openalex.org/W141735924","https://openalex.org/W1740601578","https://openalex.org/W1964263117","https://openalex.org/W1977326801","https://openalex.org/W1981891486","https://openalex.org/W1992347159","https://openalex.org/W2007253222","https://openalex.org/W2009523909","https://openalex.org/W2013437174","https://openalex.org/W2016628154","https://openalex.org/W2022327429","https://openalex.org/W2023099683","https://openalex.org/W2031530571","https://openalex.org/W2039593481","https://openalex.org/W2041092868","https://openalex.org/W2058472032","https://openalex.org/W2068886799","https://openalex.org/W2088870465","https://openalex.org/W2098365012","https://openalex.org/W2108845460","https://openalex.org/W2109509379","https://openalex.org/W2118010697","https://openalex.org/W2119028350","https://openalex.org/W2128159368","https://openalex.org/W2129080909","https://openalex.org/W2130527813","https://openalex.org/W2138747571","https://openalex.org/W2140684390","https://openalex.org/W2143793988","https://openalex.org/W2147494072","https://openalex.org/W2148590194","https://openalex.org/W2152962070","https://openalex.org/W2165586447","https://openalex.org/W2170061667","https://openalex.org/W2275980776","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W152604983","https://openalex.org/W2128159368","https://openalex.org/W3177275545","https://openalex.org/W6982439450","https://openalex.org/W2068324579","https://openalex.org/W2041128708","https://openalex.org/W1996178362","https://openalex.org/W1481025193","https://openalex.org/W2152677754","https://openalex.org/W2903058599"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":13},{"year":2025,"cited_by_count":9},{"year":2024,"cited_by_count":9},{"year":2023,"cited_by_count":11},{"year":2022,"cited_by_count":14},{"year":2021,"cited_by_count":10},{"year":2020,"cited_by_count":11},{"year":2019,"cited_by_count":9},{"year":2018,"cited_by_count":11},{"year":2017,"cited_by_count":13},{"year":2016,"cited_by_count":4},{"year":2015,"cited_by_count":9},{"year":2014,"cited_by_count":9},{"year":2013,"cited_by_count":9},{"year":2012,"cited_by_count":7}],"updated_date":"2026-11-03T10:50:19.383937","created_date":"2016-06-24T00:00:00"}