{"id":"https://openalex.org/W2005171484","doi":"https://doi.org/10.4313/jkem.2010.23.1.034","title":"Super Thin 0.25 mm Thickness White LED Lamp with PCB Type Lead Frame","display_name":"Super Thin 0.25 mm Thickness White LED Lamp with PCB Type Lead Frame","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2005171484","doi":"https://doi.org/10.4313/jkem.2010.23.1.034","mag":"2005171484"},"language":"en","primary_location":{"id":"doi:10.4313/jkem.2010.23.1.034","doi":"https://doi.org/10.4313/jkem.2010.23.1.034","is_oa":true,"landing_page_url":"https://doi.org/10.4313/jkem.2010.23.1.034","pdf_url":"http://koreascience.or.kr:80/article/JAKO201013343114311.pdf","source":{"id":"https://openalex.org/S2764904510","display_name":"Journal of the Korean Institute of Electrical and Electronic Material Engineers","issn_l":"1226-7945","issn":["1226-7945","2288-3258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["kci-registered"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Korean Institute of Electrical and Electronic Materials Engineers","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"http://koreascience.or.kr:80/article/JAKO201013343114311.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113768605","display_name":"Soon Jae Yu","orcid":"https://orcid.org/0009-0004-4663-6087","observed_orcids":["https://orcid.org/0009-0004-4663-6087"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Soon Jae Yu","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5100392568","display_name":"Do\u2010Hyung Kim","orcid":"https://orcid.org/0000-0003-2536-0101","observed_orcids":["https://orcid.org/0000-0003-2536-0101"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Do Hyung Kim","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4767,"has_fulltext":true,"cited_by_count":5,"citation_normalized_percentile":{"value":0.67480783,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"23","issue":"1","first_page":"34","last_page":"37"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5371000170707703,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5371000170707703,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.37299999594688416,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.033399999141693115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/laser-drilling","display_name":"laser drilling","score":0.546999990940094},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"thermal resistance","score":0.8450000286102295},{"id":"https://openalex.org/keywords/silicone-encapsulation","display_name":"silicone encapsulation","score":0.7490000128746033},{"id":"https://openalex.org/keywords/transfer-molding","display_name":"transfer molding","score":0.8899999856948853},{"id":"https://openalex.org/keywords/surface-mount-devices","display_name":"surface mount devices","score":0.7179999947547913},{"id":"https://openalex.org/keywords/luminance","display_name":"luminance","score":0.8999999761581421}],"concepts":[{"id":"https://openalex.org/C121598971","wikidata":"https://www.wikidata.org/wiki/Q16466835","display_name":"Lead frame","level":4,"score":0.8238978385925293},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8105014562606812},{"id":"https://openalex.org/C37696544","wikidata":"https://www.wikidata.org/wiki/Q382824","display_name":"Transfer molding","level":3,"score":0.6677871346473694},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5942822694778442},{"id":"https://openalex.org/C2779769944","wikidata":"https://www.wikidata.org/wiki/Q146439","display_name":"Silicone","level":2,"score":0.528285562992096},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.5252301692962646},{"id":"https://openalex.org/C101271287","wikidata":"https://www.wikidata.org/wiki/Q1553201","display_name":"LED lamp","level":2,"score":0.4731864929199219},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.42804333567619324},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37799304723739624},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.22049909830093384},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4313/jkem.2010.23.1.034","doi":"https://doi.org/10.4313/jkem.2010.23.1.034","is_oa":true,"landing_page_url":"https://doi.org/10.4313/jkem.2010.23.1.034","pdf_url":"http://koreascience.or.kr:80/article/JAKO201013343114311.pdf","source":{"id":"https://openalex.org/S2764904510","display_name":"Journal of the Korean Institute of Electrical and Electronic Material Engineers","issn_l":"1226-7945","issn":["1226-7945","2288-3258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["kci-registered"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Korean Institute of Electrical and Electronic Materials Engineers","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4313/jkem.2010.23.1.034","doi":"https://doi.org/10.4313/jkem.2010.23.1.034","is_oa":true,"landing_page_url":"https://doi.org/10.4313/jkem.2010.23.1.034","pdf_url":"http://koreascience.or.kr:80/article/JAKO201013343114311.pdf","source":{"id":"https://openalex.org/S2764904510","display_name":"Journal of the Korean Institute of Electrical and Electronic Material Engineers","issn_l":"1226-7945","issn":["1226-7945","2288-3258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["kci-registered"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Korean Institute of Electrical and Electronic Materials Engineers","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2005171484.pdf","grobid_xml":"https://content.openalex.org/works/W2005171484.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2058358085","https://openalex.org/W2072708504","https://openalex.org/W2068993903","https://openalex.org/W2098705813","https://openalex.org/W2057134490","https://openalex.org/W1584113062","https://openalex.org/W2056286598","https://openalex.org/W2005469154","https://openalex.org/W1979147575","https://openalex.org/W3017604517"],"abstract_inverted_index":{"0.25":[0],"mm":[1,53],"thickness":[2,54],"super":[3],"thin":[4],"surface":[5],"mounted":[6],"device":[7],"LED":[8,55,59,72],"Lamp":[9],"is":[10,23,27,45,74],"developed":[11,58],"with":[12,47],"PCB":[13],"type":[14],"lead":[15],"frame":[16],"in":[17,33,64],"which":[18],"BT":[19,25],"(Bismaleimide":[20],"Triazine)":[21],"resin":[22,26],"used.":[24],"removed":[28],"by":[29],"a":[30],"laser":[31],"beam":[32],"order":[34],"to":[35,50,77],"reduce":[36],"the":[37,57,68,71],"thermal":[38],"resistance":[39],"below":[40],"$1\\;^{\\circ}C/W$":[41],"and":[42,67],"transfer":[43],"molding":[44],"used":[46],"silicone.":[48],"Compared":[49],"conventional":[51],"0.4":[52],"lamp,":[56],"lamp":[60,73],"can":[61],"be":[62],"derived":[63],"high":[65],"current":[66],"luminance":[69],"of":[70],"increased":[75],"up":[76],"240":[78],"mA.":[79]},"counts_by_year":[{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-09-25T08:18:29.962427","created_date":"2016-06-24T00:00:00"}