{"id":"https://openalex.org/W2005016216","doi":"https://doi.org/10.1117/12.880794","title":"Improvements in the EQ-10 electrodeless Z-pinch EUV source for metrology applications","display_name":"Improvements in the EQ-10 electrodeless Z-pinch EUV source for metrology applications","publication_year":2011,"publication_date":"2011-03-17","ids":{"openalex":"https://openalex.org/W2005016216","doi":"https://doi.org/10.1117/12.880794","mag":"2005016216"},"language":"en","primary_location":{"id":"doi:10.1117/12.880794","doi":"https://doi.org/10.1117/12.880794","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.880794","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071562591","display_name":"Stephen F. Horne","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Stephen F. Horne","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111799707","display_name":"Deborah S. Gustafson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Deborah Gustafson","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110352743","display_name":"Matthew J. Partlow","orcid":"https://orcid.org/0000-0002-2635-649X","observed_orcids":["https://orcid.org/0000-0002-2635-649X"]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Matthew J. Partlow","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048986527","display_name":"Matthew M. Besen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Matthew M. Besen","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113654039","display_name":"Donald K. Smith","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Donald K. Smith","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5008272985","display_name":"Paul A. Blackborow","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul A. Blackborow","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210129379"],"apc_list":null,"apc_paid":null,"fwci":0.4244,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.49875091,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"7969","issue":null,"first_page":"79692Z","last_page":"79692Z"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11920","display_name":"Pulsed Power Technology Applications","score":0.001500000013038516,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Low-Pressure Plasma Processing and Diagnostics","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/euv-light-source","display_name":"EUV light source","score":0.7490000128746033},{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.8679999709129333},{"id":"https://openalex.org/keywords/mask-inspection","display_name":"mask inspection","score":0.5370000004768372},{"id":"https://openalex.org/keywords/resist-development","display_name":"resist development","score":0.9739999771118164},{"id":"https://openalex.org/keywords/thermal-management","display_name":"thermal management","score":0.8399999737739563},{"id":"https://openalex.org/keywords/source-size","display_name":"source size","score":0.40799999237060547}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9755717515945435},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.8225337862968445},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5778659582138062},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5288423299789429},{"id":"https://openalex.org/C2982854487","wikidata":"https://www.wikidata.org/wiki/Q9128","display_name":"Light source","level":2,"score":0.5250154137611389},{"id":"https://openalex.org/C2779824264","wikidata":"https://www.wikidata.org/wiki/Q3141097","display_name":"Z-pinch","level":3,"score":0.4957455098628998},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.4723980128765106},{"id":"https://openalex.org/C97039730","wikidata":"https://www.wikidata.org/wiki/Q552565","display_name":"Pulsed power","level":3,"score":0.4555976092815399},{"id":"https://openalex.org/C146024833","wikidata":"https://www.wikidata.org/wiki/Q1385457","display_name":"Extreme ultraviolet","level":3,"score":0.41858482360839844},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3792930841445923},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.37500235438346863},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3130786120891571},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2590864896774292},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.24537593126296997},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.16961422562599182},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153385146","wikidata":"https://www.wikidata.org/wiki/Q18335","display_name":"Radiation","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.880794","doi":"https://doi.org/10.1117/12.880794","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.880794","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W155175439","https://openalex.org/W1978327014","https://openalex.org/W2038733879","https://openalex.org/W2052612210","https://openalex.org/W2063843040","https://openalex.org/W2077866168","https://openalex.org/W2091566144","https://openalex.org/W2093642191","https://openalex.org/W2094249583","https://openalex.org/W2111290388","https://openalex.org/W2139083625"],"related_works":["https://openalex.org/W2067435684","https://openalex.org/W4386863733","https://openalex.org/W1978327014","https://openalex.org/W2016794323","https://openalex.org/W4404741991","https://openalex.org/W2081805156","https://openalex.org/W2094249583","https://openalex.org/W2059480285","https://openalex.org/W2087922105","https://openalex.org/W3092438189"],"abstract_inverted_index":{"Now":[0],"that":[1,20],"EUV":[2,22],"lithography":[3],"systems":[4],"are":[5,25],"beginning":[6],"to":[7],"ship":[8],"into":[9],"the":[10,21,33,67,95],"fabs":[11],"for":[12,47],"next":[13],"generation":[14],"chips":[15],"it":[16],"is":[17,43],"more":[18],"critical":[19],"infrastructure":[23],"developments":[24],"keeping":[26],"pace.":[27],"Energetiq":[28,71],"Technology":[29],"has":[30,72],"been":[31],"shipping":[32],"EQ-10":[34],"Electrodeless":[35],"Z-pinch\u2122":[36],"light":[37],"source":[38,42,64,75,109],"since":[39],"2005.":[40],"The":[41,103],"currently":[44],"being":[45],"used":[46],"metrology,":[48],"mask":[49],"inspection,":[50],"and":[51,63,99],"resist":[52],"development.":[53],"These":[54],"applications":[55],"require":[56],"especially":[57],"stable":[58],"performance":[59,110],"in":[60],"both":[61],"power":[62,97],"size.":[65],"Over":[66],"last":[68],"5":[69],"years":[70],"made":[73],"many":[74],"modifications":[76,107],"which":[77],"have":[78,92],"included":[79],"better":[80],"thermal":[81],"management":[82],"as":[83,85],"well":[84],"high":[86],"pulse":[87,101],"rate":[88],"operation6.":[89],"Recently":[90],"we":[91],"further":[93],"increased":[94],"system":[96],"handling":[98],"electrical":[100],"reproducibility.":[102],"impact":[104],"of":[105],"these":[106],"on":[108],"will":[111],"be":[112],"reported.":[113]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-17T09:40:24.721904","created_date":"2016-06-24T00:00:00"}