{"id":"https://openalex.org/W2003222034","doi":"https://doi.org/10.2320/matertrans.mf200808","title":"Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode","display_name":"Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W2003222034","doi":"https://doi.org/10.2320/matertrans.mf200808","mag":"2003222034"},"language":"en","primary_location":{"id":"doi:10.2320/matertrans.mf200808","doi":"https://doi.org/10.2320/matertrans.mf200808","is_oa":true,"landing_page_url":"https://doi.org/10.2320/matertrans.mf200808","pdf_url":"https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200808/_pdf","source":{"id":"https://openalex.org/S4210209311","display_name":"MATERIALS TRANSACTIONS","issn_l":"1345-9678","issn":["1345-9678","1347-5320"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4322765269","host_organization_name":"Japan Institute of Metals","host_organization_lineage":["https://openalex.org/P4322765269"],"host_organization_lineage_names":["Japan Institute of Metals"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MATERIALS TRANSACTIONS","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200808/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112841667","display_name":"Ikuo Shohji","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I165735259","display_name":"Gunma University","ror":"https://ror.org/046fm7598","country_code":"JP","type":"education","lineage":["https://openalex.org/I165735259"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ikuo Shohji","raw_affiliation_strings":["Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University","institution_ids":["https://openalex.org/I165735259"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085791764","display_name":"Hirohiko Watanabe","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405275337","display_name":"FUJI Electric Advanced Technology Co., Ltd. (Japan)","ror":"https://ror.org/03dvdyv56","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275337"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hirohiko Watanabe","raw_affiliation_strings":["Fuji Electric Advanced Technology Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fuji Electric Advanced Technology Co., Ltd","institution_ids":["https://openalex.org/I4405275337"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050545726","display_name":"Takeshi Okashita","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I165735259","display_name":"Gunma University","ror":"https://ror.org/046fm7598","country_code":"JP","type":"education","lineage":["https://openalex.org/I165735259"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takeshi Okashita","raw_affiliation_strings":["Department of Mechanical System Engineering, Faculty of Engineering, Gunma University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical System Engineering, Faculty of Engineering, Gunma University","institution_ids":["https://openalex.org/I165735259"]}]},{"author_position":"last","author":{"id":null,"display_name":"Tsutomu Osawa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I165735259","display_name":"Gunma University","ror":"https://ror.org/046fm7598","country_code":"JP","type":"education","lineage":["https://openalex.org/I165735259"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tsutomu Osawa","raw_affiliation_strings":["Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University","institution_ids":["https://openalex.org/I165735259"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.0954,"has_fulltext":true,"cited_by_count":21,"citation_normalized_percentile":{"value":0.86221869,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"49","issue":"7","first_page":"1513","last_page":"1517"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.9449999928474426},{"id":"https://openalex.org/keywords/copper-electrode","display_name":"copper electrode","score":0.7950000166893005},{"id":"https://openalex.org/keywords/intermetallic-layer","display_name":"intermetallic compound layer","score":0.6909999847412109},{"id":"https://openalex.org/keywords/fracture-mode","display_name":"fracture mode","score":0.6430000066757202},{"id":"https://openalex.org/keywords/high-temperature-aging","display_name":"high-temperature aging","score":0.7910000085830688},{"id":"https://openalex.org/keywords/sn-ag-solder","display_name":"Sn-Ag solder","score":0.9300000071525574},{"id":"https://openalex.org/keywords/sn-ag-cu-solder","display_name":"Sn-Ag-Cu solder","score":1.0}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8914904594421387},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8894473910331726},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.8579171895980835},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6030715107917786},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.6016477346420288},{"id":"https://openalex.org/C43369102","wikidata":"https://www.wikidata.org/wiki/Q2307625","display_name":"Fracture (geology)","level":2,"score":0.5496861934661865},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4031863212585449},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.29013851284980774},{"id":"https://openalex.org/C170154142","wikidata":"https://www.wikidata.org/wiki/Q150737","display_name":"Architectural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.2320/matertrans.mf200808","doi":"https://doi.org/10.2320/matertrans.mf200808","is_oa":true,"landing_page_url":"https://doi.org/10.2320/matertrans.mf200808","pdf_url":"https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200808/_pdf","source":{"id":"https://openalex.org/S4210209311","display_name":"MATERIALS TRANSACTIONS","issn_l":"1345-9678","issn":["1345-9678","1347-5320"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4322765269","host_organization_name":"Japan Institute of Metals","host_organization_lineage":["https://openalex.org/P4322765269"],"host_organization_lineage_names":["Japan Institute of Metals"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MATERIALS TRANSACTIONS","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.2320/matertrans.mf200808","doi":"https://doi.org/10.2320/matertrans.mf200808","is_oa":true,"landing_page_url":"https://doi.org/10.2320/matertrans.mf200808","pdf_url":"https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200808/_pdf","source":{"id":"https://openalex.org/S4210209311","display_name":"MATERIALS TRANSACTIONS","issn_l":"1345-9678","issn":["1345-9678","1347-5320"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4322765269","host_organization_name":"Japan Institute of Metals","host_organization_lineage":["https://openalex.org/P4322765269"],"host_organization_lineage_names":["Japan Institute of Metals"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MATERIALS TRANSACTIONS","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2003222034.pdf","grobid_xml":"https://content.openalex.org/works/W2003222034.grobid-xml"},"referenced_works_count":6,"referenced_works":["https://openalex.org/W2005373653","https://openalex.org/W2016370909","https://openalex.org/W2083907906","https://openalex.org/W2111629497","https://openalex.org/W2166328682","https://openalex.org/W2335001511"],"related_works":["https://openalex.org/W1973063421","https://openalex.org/W2051767988","https://openalex.org/W2133134588","https://openalex.org/W2132894173","https://openalex.org/W254771019","https://openalex.org/W2193611227","https://openalex.org/W418387021","https://openalex.org/W2096488912","https://openalex.org/W2038747177","https://openalex.org/W2539502744"],"abstract_inverted_index":{"The":[0,23,35],"impact":[1,24,36,108],"properties":[2,25,37],"of":[3,38,45,53,73],"solder":[4,33,83,97],"ball":[5],"joints":[6,40,105,115],"with":[7,29,111],"Sn-Ag-Cu-Ni-Ge":[8,39,87,104],"lead-free":[9],"solders":[10],"and":[11,31,47,55,113],"Cu":[12],"electrodes":[13],"were":[14,41],"investigated":[15],"in":[16,61,68,85],"the":[17,51,62,69,77,90],"aged":[18],"conditions":[19],"at":[20,119],"393":[21,120],"K.":[22],"evaluated":[26],"was":[27,82],"compared":[28,110],"Sn-Ag":[30,46,54,112],"Sn-Ag-Cu":[32,48,56,114],"joints.":[34,49,88],"superior":[42],"to":[43,99],"those":[44],"In":[50],"cases":[52],"joints,":[57],"fracture":[58,80,84,92,98,101],"mainly":[59],"occurred":[60],"intermetallic":[63],"compounds":[64],"(IMC)":[65],"layer":[66],"formed":[67],"joint":[70],"interface":[71],"regardless":[72],"aging":[74,118],"treatment.":[75],"On":[76],"contrary,":[78],"main":[79,91],"mode":[81,93],"as-reflow":[86],"Although":[89],"gradually":[94],"changed":[95],"from":[96],"IMC":[100],"upon":[102],"aging,":[103],"had":[106],"excellent":[107],"reliability":[109],"even":[116],"after":[117],"K":[121],"for":[122],"1000":[123],"h.":[124]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":6}],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}