{"id":"https://openalex.org/W2002251073","doi":"https://doi.org/10.4028/www.scientific.net/ssp.195.119","title":"Analysis of Oxidized Copper Surface and its Evolution","display_name":"Analysis of Oxidized Copper Surface and its Evolution","publication_year":2012,"publication_date":"2012-12-01","ids":{"openalex":"https://openalex.org/W2002251073","doi":"https://doi.org/10.4028/www.scientific.net/ssp.195.119","mag":"2002251073"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/ssp.195.119","doi":"https://doi.org/10.4028/www.scientific.net/ssp.195.119","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.195.119","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072261145","display_name":"Francesca Milanesi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Francesca Milanesi","raw_affiliation_strings":["STMicroelectronics Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012369778","display_name":"Francesco Pipia","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210130962","display_name":"Micron (Italy)","ror":"https://ror.org/039m3s961","country_code":"IT","type":"company","lineage":["https://openalex.org/I11912373","https://openalex.org/I4210130962"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Francesco Pipia","raw_affiliation_strings":["Micron Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Italy","institution_ids":["https://openalex.org/I4210130962"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058717118","display_name":"Simona Spadoni","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210130962","display_name":"Micron (Italy)","ror":"https://ror.org/039m3s961","country_code":"IT","type":"company","lineage":["https://openalex.org/I11912373","https://openalex.org/I4210130962"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Simona Spadoni","raw_affiliation_strings":["Micron Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Italy","institution_ids":["https://openalex.org/I4210130962"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000052972","display_name":"Salvo Grasso","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210130962","display_name":"Micron (Italy)","ror":"https://ror.org/039m3s961","country_code":"IT","type":"company","lineage":["https://openalex.org/I11912373","https://openalex.org/I4210130962"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Salvo Grasso","raw_affiliation_strings":["Micron Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Italy","institution_ids":["https://openalex.org/I4210130962"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055399676","display_name":"Enrica Ravizza","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210130962","display_name":"Micron (Italy)","ror":"https://ror.org/039m3s961","country_code":"IT","type":"company","lineage":["https://openalex.org/I11912373","https://openalex.org/I4210130962"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Enrica Ravizza","raw_affiliation_strings":["Micron Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Italy","institution_ids":["https://openalex.org/I4210130962"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042522480","display_name":"Mario Pistoni","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Mario Pistoni","raw_affiliation_strings":["STMicroelectronics Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103505227","display_name":"Mauro Alessandri","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Mauro Alessandri","raw_affiliation_strings":["STMicroelectronics Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics Italy","institution_ids":["https://openalex.org/I4210154781"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.09605439,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":95},"biblio":{"volume":"195","issue":null,"first_page":"119","last_page":"123"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9717000126838684,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9717000126838684,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.007300000172108412,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11907","display_name":"Copper-based nanomaterials and applications","score":0.004999999888241291,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-oxidation","display_name":"surface oxidation","score":0.7089999914169312},{"id":"https://openalex.org/keywords/electrodeposition","display_name":"electrodeposition","score":0.7919999957084656},{"id":"https://openalex.org/keywords/photoresist-patterning","display_name":"photoresist patterning","score":0.7900000214576721},{"id":"https://openalex.org/keywords/copper-interconnects","display_name":"copper interconnects","score":0.5540000200271606},{"id":"https://openalex.org/keywords/surface-evolution","display_name":"surface evolution","score":0.5339999794960022}],"concepts":[{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.9611964225769043},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8430094718933105},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7893558144569397},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.7790289521217346},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6133331060409546},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.6010029911994934},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.42411568760871887},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3531455993652344},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3466380834579468},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/ssp.195.119","doi":"https://doi.org/10.4028/www.scientific.net/ssp.195.119","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.195.119","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1980205000","https://openalex.org/W2008638859","https://openalex.org/W2064204195","https://openalex.org/W2074783330","https://openalex.org/W2078694734","https://openalex.org/W2134707622"],"related_works":["https://openalex.org/W4388450839","https://openalex.org/W4252108393","https://openalex.org/W4385525194","https://openalex.org/W4411689044","https://openalex.org/W4404037868","https://openalex.org/W1995365717","https://openalex.org/W4400411786","https://openalex.org/W2918280849","https://openalex.org/W4238251924","https://openalex.org/W2885393833"],"abstract_inverted_index":{"The":[0],"interest":[1],"towards":[2],"Copper":[3],"RDL":[4],"(Re-Distribution":[5],"Layer)":[6],"is":[7,20,42,53],"due":[8],"to":[9,13,44],"some":[10],"advantages":[11],"related":[12],"this":[14],"approach.":[15],"First":[16],"of":[17],"all":[18],"it":[19,27],"cheaper":[21],"than":[22],"conventional":[23],"Damascene":[24,38],"approach;":[25],"moreover":[26],"allows":[28],"thicknesses":[29],"as":[30,32],"high":[31],"10\u00b5m":[33],"or":[34],"more":[35],"whereas":[36],"with":[37,64],"architecture":[39,50],"Cu":[40],"thickness":[41],"limited":[43],"<5\u00b5m.":[45],"Figure":[46],"1":[47],"introduces":[48],"the":[49],"concept,":[51],"which":[52],"based":[54],"on":[55,61],"a":[56,62],"quite":[57],"long":[58],"ECD":[59],"growth":[60],"substrate":[63],"patterned":[65],"PhotoResist.":[66]},"counts_by_year":[{"year":2023,"cited_by_count":2}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}