{"id":"https://openalex.org/W2002208658","doi":"https://doi.org/10.1109/tcpmt.2011.2166395","title":"Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking","display_name":"Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking","publication_year":2011,"publication_date":"2011-09-23","ids":{"openalex":"https://openalex.org/W2002208658","doi":"https://doi.org/10.1109/tcpmt.2011.2166395","mag":"2002208658","pmid":"https://pubmed.ncbi.nlm.nih.gov/22400126","pmcid":"https://www.ncbi.nlm.nih.gov/pmc/articles/3293476"},"language":"en","primary_location":{"id":"doi:10.1109/tcpmt.2011.2166395","doi":"https://doi.org/10.1109/tcpmt.2011.2166395","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcpmt.2011.2166395","pdf_url":null,"source":{"id":"https://openalex.org/S50222406","display_name":"IEEE Transactions on Components Packaging and Manufacturing Technology","issn_l":"2156-3950","issn":["2156-3950","2156-3985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref","pubmed"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3293476","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111447088","display_name":"Ashfaque Uddin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ashfaque Uddin","raw_affiliation_strings":["A. Uddin, K. Milaninia, C. -H. Chen, and L. Theogarajan are with the Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, 93106-9560 USA","Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"A. Uddin, K. Milaninia, C. -H. Chen, and L. Theogarajan are with the Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, 93106-9560 USA","institution_ids":["https://openalex.org/I154570441"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071173970","display_name":"Kaveh M. Milaninia","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kaveh Milaninia","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA","Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064021370","display_name":"Chin-Hsuan Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chin-Hsuan Chen","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA","Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038645932","display_name":"Luke S. Theogarajan","orcid":"https://orcid.org/0000-0002-0320-5023","observed_orcids":["https://orcid.org/0000-0002-0320-5023"]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Luke Theogarajan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA","Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, CA, USA","institution_ids":["https://openalex.org/I154570441"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I154570441"],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":3.3542,"has_fulltext":false,"cited_by_count":38,"citation_normalized_percentile":{"value":0.92059866,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":"1","issue":"12","first_page":"1996","last_page":"2004"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.003000000026077032,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.0024999999441206455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"wafer-scale integration","score":0.765999972820282},{"id":"https://openalex.org/keywords/chip-to-wafer-bonding","display_name":"chip-to-wafer bonding","score":0.6240000128746033},{"id":"https://openalex.org/keywords/large-area-substrates","display_name":"large-area substrates","score":0.5590000152587891},{"id":"https://openalex.org/keywords/mems-micromachining","display_name":"MEMS micromachining","score":0.8740000128746033},{"id":"https://openalex.org/keywords/biosensing","display_name":"biosensing","score":0.9259999990463257},{"id":"https://openalex.org/keywords/microfluidics","display_name":"microfluidics","score":0.7699999809265137},{"id":"https://openalex.org/keywords/low-power-integrated-circuits","display_name":"low-power integrated circuits","score":0.5740000009536743}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7890802621841431},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6434351801872253},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6161421537399292},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6137874126434326},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5281120538711548},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.49286627769470215},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.467567503452301},{"id":"https://openalex.org/C2777402240","wikidata":"https://www.wikidata.org/wiki/Q6783436","display_name":"Masking (illustration)","level":2,"score":0.4665137529373169},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.4248836040496826},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.41212621331214905},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3850381374359131},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3661848306655884},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.3434359133243561},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28567564487457275},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21351629495620728},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/tcpmt.2011.2166395","doi":"https://doi.org/10.1109/tcpmt.2011.2166395","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcpmt.2011.2166395","pdf_url":null,"source":{"id":"https://openalex.org/S50222406","display_name":"IEEE Transactions on Components Packaging and Manufacturing Technology","issn_l":"2156-3950","issn":["2156-3950","2156-3985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","raw_type":"journal-article"},{"id":"pmid:22400126","doi":null,"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/22400126","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE transactions on components, packaging, and manufacturing technology","raw_type":"Journal Article"},{"id":"pmh:oai:europepmc.org:2303761","doi":null,"is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3293476","pdf_url":null,"source":{"id":"https://openalex.org/S4306400806","display_name":"Europe PMC (PubMed Central)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1303153112","host_organization_name":"European Bioinformatics Institute","host_organization_lineage":["https://openalex.org/I1303153112"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":null,"raw_type":"Text"},{"id":"pmh:oai:pubmedcentral.nih.gov:3293476","doi":null,"is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3293476","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"IEEE Trans Compon Packaging Manuf Technol","raw_type":"Text"}],"best_oa_location":{"id":"pmh:oai:europepmc.org:2303761","doi":null,"is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3293476","pdf_url":null,"source":{"id":"https://openalex.org/S4306400806","display_name":"Europe PMC (PubMed Central)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1303153112","host_organization_name":"European Bioinformatics Institute","host_organization_lineage":["https://openalex.org/I1303153112"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":null,"raw_type":"Text"},"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G2237001804","display_name":"Bio-ionic Neural Interfaces","funder_award_id":"1dp2od007472-01","funder_id":"https://openalex.org/F4320332161","funder_display_name":"National Institutes of Health"}],"funders":[{"id":"https://openalex.org/F4320332161","display_name":"National Institutes of Health","ror":"https://ror.org/01cwqze88"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W219958277","https://openalex.org/W1485237858","https://openalex.org/W1486523087","https://openalex.org/W1566252116","https://openalex.org/W1874572479","https://openalex.org/W1890355017","https://openalex.org/W1965749645","https://openalex.org/W1983282195","https://openalex.org/W2017334866","https://openalex.org/W2022120785","https://openalex.org/W2027785931","https://openalex.org/W2030509793","https://openalex.org/W2055460019","https://openalex.org/W2067692467","https://openalex.org/W2071003187","https://openalex.org/W2102381552","https://openalex.org/W2102451925","https://openalex.org/W2105686107","https://openalex.org/W2118257779","https://openalex.org/W2121681307","https://openalex.org/W2130867196","https://openalex.org/W2131896487","https://openalex.org/W2133531054","https://openalex.org/W2145103798","https://openalex.org/W2171746974","https://openalex.org/W2257548099","https://openalex.org/W3135711715","https://openalex.org/W3213228977","https://openalex.org/W6791158146"],"related_works":["https://openalex.org/W2044429428","https://openalex.org/W2743776561","https://openalex.org/W2131580280","https://openalex.org/W3165079815","https://openalex.org/W2546189131","https://openalex.org/W1998160365","https://openalex.org/W2112422470","https://openalex.org/W1929195177","https://openalex.org/W2314904317","https://openalex.org/W2023548159"],"abstract_inverted_index":{"This":[0,31],"paper":[1],"presents":[2],"a":[3,14,63,113,131],"novel":[4],"technique":[5,23,81],"for":[6,33,98,118],"the":[7,22,25,34,48,56,67,71,83,94,107,110,122,138,142,145,151,175,178,184],"integration":[8,84,95,152,185],"of":[9,21,36,70,79,85,109,162,177],"small":[10],"CMOS":[11,26,102,126],"chips":[12],"into":[13],"large":[15,57,146],"area":[16,58,147],"substrate.":[17,133],"A":[18,160],"key":[19],"component":[20],"is":[24,128,180],"chip":[27,49,54,117,143,179],"based":[28],"self-aligned":[29],"masking.":[30],"allows":[32,97],"fabrication":[35],"sockets":[37],"in":[38,121,130],"wafers":[39],"that":[40,66,174],"are":[41,60,74,165],"at":[42],"most":[43],"5":[44],"\u00b5m":[45,125,155],"larger":[46],"than":[47],"on":[50],"each":[51],"side.":[52],"The":[53,76,134],"and":[55,91,137,144,156],"substrate":[59,148],"bonded":[61],"onto":[62],"carrier":[64],"such":[65,88],"top":[68],"surfaces":[69],"two":[72],"components":[73],"flush.":[75],"unique":[77],"features":[78],"this":[80],"enable":[82],"macroscale":[86],"components,":[87],"as":[89],"leads":[90],"microfluidics.":[92],"Furthermore,":[93],"process":[96],"MEMS":[99],"micromachining":[100],"after":[101,150],"die-wafer":[103],"integration.":[104],"To":[105],"demonstrate":[106],"capabilities":[108],"proposed":[111],"technology,":[112],"low-power":[114],"integrated":[115,129],"potentiostat":[116],"biosensing":[119],"implemented":[120],"AMI":[123],"0.5":[124,157],"technology":[127],"silicon":[132],"horizontal":[135],"gap":[136],"vertical":[139],"displacement":[140],"between":[141],"measured":[149],"were":[153],"4":[154],"\u00b5m,":[158],"respectively.":[159],"number":[161],"104":[163],"interconnects":[164],"patterned":[166],"with":[167],"high-precision":[168],"alignment.":[169],"Electrical":[170],"measurements":[171],"have":[172],"shown":[173],"functionality":[176],"not":[181],"affected":[182],"by":[183],"process.":[186]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":6},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":5},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":3}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}