{"id":"https://openalex.org/W2002173376","doi":"https://doi.org/10.1016/j.microrel.2011.07.051","title":"Warpage analysis of layered structures connected by direct brazing","display_name":"Warpage analysis of layered structures connected by direct brazing","publication_year":2011,"publication_date":"2011-08-06","ids":{"openalex":"https://openalex.org/W2002173376","doi":"https://doi.org/10.1016/j.microrel.2011.07.051","mag":"2002173376"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2011.07.051","doi":"https://doi.org/10.1016/j.microrel.2011.07.051","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2011.07.051","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"T. Asada","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210165351","display_name":"Toyota Central Research and Development Laboratories (Japan)","ror":"https://ror.org/05mjgqe69","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210165351"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"T. Asada","raw_affiliation_strings":["Toyota Central R&D Laboratories Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toyota Central R&D Laboratories Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]},{"raw_affiliation_string":"Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065730180","display_name":"Yuji Yagi","orcid":"https://orcid.org/0000-0001-5327-9277","observed_orcids":["https://orcid.org/0000-0001-5327-9277"]},"institutions":[{"id":"https://openalex.org/I4210165351","display_name":"Toyota Central Research and Development Laboratories (Japan)","ror":"https://ror.org/05mjgqe69","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210165351"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Y. Yagi","raw_affiliation_strings":["Toyota Central R&D Laboratories Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toyota Central R&D Laboratories Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]},{"raw_affiliation_string":"Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012458529","display_name":"Masanori Usui","orcid":"https://orcid.org/0000-0002-2227-5983","observed_orcids":["https://orcid.org/0000-0002-2227-5983"]},"institutions":[{"id":"https://openalex.org/I4210165351","display_name":"Toyota Central Research and Development Laboratories (Japan)","ror":"https://ror.org/05mjgqe69","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210165351"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Usui","raw_affiliation_strings":["Toyota Central R&D Laboratories Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toyota Central R&D Laboratories Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]},{"raw_affiliation_string":"Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Nagakute-cho, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070205611","display_name":"Taichi Suzuki","orcid":"https://orcid.org/0000-0003-0202-9715","observed_orcids":["https://orcid.org/0000-0003-0202-9715"]},"institutions":[{"id":"https://openalex.org/I4210137853","display_name":"Toyota Motor Corporation (Japan)","ror":"https://ror.org/02zqm6r10","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210137853"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Suzuki","raw_affiliation_strings":["Toyota Motor Corporation, 1, Toyota-cho, Toyota, Aichi 471-8572, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toyota Motor Corporation, 1, Toyota-cho, Toyota, Aichi 471-8572, Japan","institution_ids":["https://openalex.org/I4210137853"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076763517","display_name":"Nobutada OHNO","orcid":"https://orcid.org/0000-0001-7929-140X","observed_orcids":["https://orcid.org/0000-0001-7929-140X"]},"institutions":[{"id":"https://openalex.org/I60134161","display_name":"Nagoya University","ror":"https://ror.org/04chrp450","country_code":"JP","type":"education","lineage":["https://openalex.org/I60134161"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"N. Ohno","raw_affiliation_strings":["Department of Computational Science and Engineering, Nagoya Univ., Chikusa-ku, Nagoya 464-8603, Japan","Department of Computational Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computational Science and Engineering, Nagoya Univ., Chikusa-ku, Nagoya 464-8603, Japan","institution_ids":["https://openalex.org/I60134161"]},{"raw_affiliation_string":"Department of Computational Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan#TAB#","institution_ids":["https://openalex.org/I60134161"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210165351"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"51","issue":"9-11","first_page":"1836","last_page":"1839"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.0019000000320374966,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/warpage","display_name":"warpage","score":0.9639999866485596},{"id":"https://openalex.org/keywords/aluminum","display_name":"aluminum","score":0.5180000066757202},{"id":"https://openalex.org/keywords/aluminum-nitride","display_name":"aluminum nitride","score":0.9020000100135803},{"id":"https://openalex.org/keywords/inelastic-analysis","display_name":"inelastic analysis","score":0.5820000171661377},{"id":"https://openalex.org/keywords/kinematic-hardening","display_name":"kinematic hardening","score":0.8320000171661377},{"id":"https://openalex.org/keywords/cyclic-hardening","display_name":"cyclic hardening","score":0.8870000243186951},{"id":"https://openalex.org/keywords/viscoplasticity","display_name":"viscoplasticity","score":0.9950000047683716},{"id":"https://openalex.org/keywords/creep","display_name":"creep","score":0.996999979019165},{"id":"https://openalex.org/keywords/baking-process","display_name":"baking process","score":0.7250000238418579},{"id":"https://openalex.org/keywords/warpage-simulation","display_name":"warpage simulation","score":0.6060000061988831}],"concepts":[{"id":"https://openalex.org/C86171150","wikidata":"https://www.wikidata.org/wiki/Q13389141","display_name":"Brazing","level":3,"score":0.9432517290115356},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7954347133636475},{"id":"https://openalex.org/C44255700","wikidata":"https://www.wikidata.org/wiki/Q978423","display_name":"Hardening (computing)","level":3,"score":0.7943651676177979},{"id":"https://openalex.org/C55359492","wikidata":"https://www.wikidata.org/wiki/Q7935671","display_name":"Viscoplasticity","level":4,"score":0.7768117785453796},{"id":"https://openalex.org/C184050105","wikidata":"https://www.wikidata.org/wiki/Q273163","display_name":"Isotropy","level":2,"score":0.5998928546905518},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.5694888830184937},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.526068389415741},{"id":"https://openalex.org/C39920418","wikidata":"https://www.wikidata.org/wiki/Q11476","display_name":"Kinematics","level":2,"score":0.49477618932724},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.43020254373550415},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.358964204788208},{"id":"https://openalex.org/C202973686","wikidata":"https://www.wikidata.org/wiki/Q1937401","display_name":"Constitutive equation","level":3,"score":0.34318608045578003},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.19136735796928406},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1097506582736969},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06780457496643066},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.047255098819732666},{"id":"https://openalex.org/C74650414","wikidata":"https://www.wikidata.org/wiki/Q11397","display_name":"Classical mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2011.07.051","doi":"https://doi.org/10.1016/j.microrel.2011.07.051","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2011.07.051","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1966006143","https://openalex.org/W1984454031","https://openalex.org/W2009217288","https://openalex.org/W2013107282","https://openalex.org/W2020149488","https://openalex.org/W2027578367","https://openalex.org/W2048251273","https://openalex.org/W2054495350","https://openalex.org/W2065810112","https://openalex.org/W2087104684","https://openalex.org/W2087262885","https://openalex.org/W2132049211"],"related_works":["https://openalex.org/W2020149488","https://openalex.org/W4392399282","https://openalex.org/W3005757172","https://openalex.org/W2352766769","https://openalex.org/W2744242889","https://openalex.org/W4413788012","https://openalex.org/W7220726059","https://openalex.org/W4410104818","https://openalex.org/W4389625143","https://openalex.org/W4225123796"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}