{"id":"https://openalex.org/W2000820966","doi":"https://doi.org/10.1109/icept.2010.5582636","title":"Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy","display_name":"Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy","publication_year":2010,"publication_date":"2010-08-01","ids":{"openalex":"https://openalex.org/W2000820966","doi":"https://doi.org/10.1109/icept.2010.5582636","mag":"2000820966"},"language":"en","primary_location":{"id":"doi:10.1109/icept.2010.5582636","doi":"https://doi.org/10.1109/icept.2010.5582636","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept.2010.5582636","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 11th International Conference on Electronic Packaging Technology & High Density Packaging","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Yiqing Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yiqing Wang","raw_affiliation_strings":["Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]},{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087519916","display_name":"Dongyan Ding","orcid":"https://orcid.org/0000-0003-2194-1216","observed_orcids":["https://orcid.org/0000-0003-2194-1216"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongyan Ding","raw_affiliation_strings":["Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]},{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ting Liu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ting Liu","raw_affiliation_strings":["Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]},{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021223062","display_name":"Klaus-Peter Galuschki","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I51629411","display_name":"Siemens (China)","ror":"https://ror.org/00v6g9845","country_code":"CN","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I51629411"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Klaus-Peter Galuschki","raw_affiliation_strings":["SMT Technology & Material, Corporate Technology, Siemens Limited, China","SMT Technology & Material, Corporate Technology, Siemens Ltd., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Limited, China","institution_ids":["https://openalex.org/I51629411"]},{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Ltd., China","institution_ids":["https://openalex.org/I51629411"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111234426","display_name":"Yu Hu","orcid":"https://orcid.org/0009-0008-1197-7913","observed_orcids":["https://orcid.org/0009-0008-1197-7913"]},"institutions":[{"id":"https://openalex.org/I51629411","display_name":"Siemens (China)","ror":"https://ror.org/00v6g9845","country_code":"CN","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I51629411"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yu Hu","raw_affiliation_strings":["SMT Technology & Material, Corporate Technology, Siemens Limited, China","SMT Technology & Material, Corporate Technology, Siemens Ltd., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Limited, China","institution_ids":["https://openalex.org/I51629411"]},{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Ltd., China","institution_ids":["https://openalex.org/I51629411"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079464591","display_name":"Angela Gong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I51629411","display_name":"Siemens (China)","ror":"https://ror.org/00v6g9845","country_code":"CN","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I51629411"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Angela Gong","raw_affiliation_strings":["SMT Technology & Material, Corporate Technology, Siemens Limited, China","SMT Technology & Material, Corporate Technology, Siemens Ltd., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Limited, China","institution_ids":["https://openalex.org/I51629411"]},{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Ltd., China","institution_ids":["https://openalex.org/I51629411"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ming Shen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I51629411","display_name":"Siemens (China)","ror":"https://ror.org/00v6g9845","country_code":"CN","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I51629411"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Shen","raw_affiliation_strings":["SMT Technology & Material, Corporate Technology, Siemens Limited, China","SMT Technology & Material, Corporate Technology, Siemens Ltd., China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Limited, China","institution_ids":["https://openalex.org/I51629411"]},{"raw_affiliation_string":"SMT Technology & Material, Corporate Technology, Siemens Ltd., China","institution_ids":["https://openalex.org/I51629411"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100316780","display_name":"Hongqi Sun","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hongqi Sun","raw_affiliation_strings":["Shanghai Sinyang Semiconductor Materials Company Limited, Shanghai, China","Shanghai Sinyang Semiconductor Materials Co., Ltd., 201616, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Sinyang Semiconductor Materials Company Limited, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Sinyang Semiconductor Materials Co., Ltd., 201616, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100699356","display_name":"Xianfeng Wang","orcid":"https://orcid.org/0000-0001-8798-2948","observed_orcids":["https://orcid.org/0000-0001-8798-2948","https://orcid.org/0000-0002-1888-3601"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xianfeng Wang","raw_affiliation_strings":["Shanghai Sinyang Semiconductor Materials Company Limited, Shanghai, China","Shanghai Sinyang Semiconductor Materials Co., Ltd., 201616, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Sinyang Semiconductor Materials Company Limited, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Sinyang Semiconductor Materials Co., Ltd., 201616, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113542165","display_name":"Jiangyan Sun","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jiangyan Sun","raw_affiliation_strings":["Shanghai Sinyang Semiconductor Materials Company Limited, Shanghai, China","Shanghai Sinyang Semiconductor Materials Co., Ltd., 201616, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Sinyang Semiconductor Materials Company Limited, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Sinyang Semiconductor Materials Co., Ltd., 201616, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100352895","display_name":"Ming Li","orcid":"https://orcid.org/0000-0001-7453-6789","observed_orcids":["https://orcid.org/0000-0001-7453-6789"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Li","raw_affiliation_strings":["Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]},{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110252358","display_name":"Dali Mao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dali Mao","raw_affiliation_strings":["Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]},{"raw_affiliation_string":"Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2808,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.74253092,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"980","last_page":"983"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9648000001907349,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9648000001907349,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.03460000082850456,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tin-whiskers","display_name":"tin whiskers","score":0.9539999961853027},{"id":"https://openalex.org/keywords/nickel-barrier-layer","display_name":"nickel barrier layer","score":0.9020000100135803},{"id":"https://openalex.org/keywords/electroplated-tin","display_name":"electroplated tin","score":0.6930000185966492},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.621999979019165}],"concepts":[{"id":"https://openalex.org/C179111330","wikidata":"https://www.wikidata.org/wiki/Q901525","display_name":"Whisker","level":2,"score":0.9274195432662964},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.901911735534668},{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.8360793590545654},{"id":"https://openalex.org/C121598971","wikidata":"https://www.wikidata.org/wiki/Q16466835","display_name":"Lead frame","level":4,"score":0.8053662776947021},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8022443652153015},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.7313899397850037},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.725594699382782},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.5650233626365662},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.506775438785553},{"id":"https://openalex.org/C116134602","wikidata":"https://www.wikidata.org/wiki/Q913572","display_name":"Whiskers","level":2,"score":0.48231005668640137},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4269367754459381},{"id":"https://openalex.org/C2779833192","wikidata":"https://www.wikidata.org/wiki/Q17015866","display_name":"Barrier layer","level":3,"score":0.41897642612457275},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2766512334346771},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icept.2010.5582636","doi":"https://doi.org/10.1109/icept.2010.5582636","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept.2010.5582636","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 11th International Conference on Electronic Packaging Technology & High Density Packaging","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1975416002","https://openalex.org/W1980989341","https://openalex.org/W2004300657","https://openalex.org/W2088641111"],"related_works":["https://openalex.org/W2540929636","https://openalex.org/W1999105050","https://openalex.org/W1977286487","https://openalex.org/W2038866657","https://openalex.org/W1996787158","https://openalex.org/W2014463757","https://openalex.org/W2007939601","https://openalex.org/W2006150073","https://openalex.org/W2166801980","https://openalex.org/W2069478895"],"abstract_inverted_index":{"Electroplating":[0],"matte":[1,21,34,50],"Sn":[2,35,51],"has":[3],"attracted":[4],"much":[5],"attention":[6],"in":[7,85],"the":[8,58,77,87],"lead-free":[9],"age.":[10],"To":[11],"prevent":[12],"a":[13],"growth":[14,64,88],"of":[15,57,89],"tin":[16,22,62,90],"whiskers":[17],"from":[18],"lead-frame":[19,53],"supported":[20],"films,":[23],"various":[24],"mitigation":[25],"methods":[26],"have":[27],"been":[28],"reported.":[29],"In":[30],"this":[31],"work,":[32],"pure":[33],"was":[36,45,74],"electroplated":[37],"onto":[38],"C194":[39],"alloy,":[40],"and":[41,52,61],"electroplating":[42],"Ni":[43,78],"film":[44],"used":[46],"as":[47],"barrier":[48,79],"between":[49],"alloy.":[54],"The":[55],"microstructures":[56],"Ni/Sn":[59],"depositions":[60],"whisker":[63],"were":[65],"investigated":[66],"through":[67],"using":[68],"scanning":[69],"electron":[70],"microscope":[71],"(SEM).":[72],"It":[73],"found":[75],"that":[76],"layer":[80],"played":[81],"an":[82],"important":[83],"role":[84],"suppressing":[86],"whiskers.":[91]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2016-06-24T00:00:00"}