{"id":"https://openalex.org/W2000717391","doi":"https://doi.org/10.1615/intjmultcompeng.v2.i2.90","title":"Coarse-Grained Kinetic Monte Carlo Simulation of Copper Electrodeposition with Additives","display_name":"Coarse-Grained Kinetic Monte Carlo Simulation of Copper Electrodeposition with Additives","publication_year":2004,"publication_date":"2004-01-01","ids":{"openalex":"https://openalex.org/W2000717391","doi":"https://doi.org/10.1615/intjmultcompeng.v2.i2.90","mag":"2000717391"},"language":"en","primary_location":{"id":"doi:10.1615/intjmultcompeng.v2.i2.90","doi":"https://doi.org/10.1615/intjmultcompeng.v2.i2.90","is_oa":false,"landing_page_url":"https://doi.org/10.1615/intjmultcompeng.v2.i2.90","pdf_url":null,"source":{"id":"https://openalex.org/S63368048","display_name":"International Journal for Multiscale Computational Engineering","issn_l":"1543-1649","issn":["1543-1649","1940-4352"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","poland-40","russia-white-list-2"],"host_organization":"https://openalex.org/P4310315730","host_organization_name":"Begell House","host_organization_lineage":["https://openalex.org/P4310315730"],"host_organization_lineage_names":["Begell House"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal for Multiscale Computational Engineering","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073354440","display_name":"Timothy O. Drews","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Timothy O. Drews","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign, Urbana, IL 61801","Dept. of Chemical and Biomolecular Engineering, University of Illinois at Urbana\u2010Champaign, Urbana, IL 61801"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign, Urbana, IL 61801","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"Dept. of Chemical and Biomolecular Engineering, University of Illinois at Urbana\u2010Champaign, Urbana, IL 61801","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083684552","display_name":"Richard D. Braatz","orcid":"https://orcid.org/0000-0003-4304-3484","observed_orcids":["https://orcid.org/0000-0003-4304-3484"]},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard D. Braatz","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign, Urbana, IL 61801","Dept. of Chemical and Biomolecular Engineering, University of Illinois at Urbana\u2010Champaign, Urbana, IL 61801"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign, Urbana, IL 61801","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"Dept. of Chemical and Biomolecular Engineering, University of Illinois at Urbana\u2010Champaign, Urbana, IL 61801","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058773781","display_name":"Richard C. Alkire","orcid":"https://orcid.org/0000-0002-8875-7408","observed_orcids":["https://orcid.org/0000-0002-8875-7408"]},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard C. Alkire","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign, Urbana, IL 61801","Dept. of Chemical and Biomolecular Engineering, University of Illinois at Urbana\u2010Champaign, Urbana, IL 61801"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign, Urbana, IL 61801","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"Dept. of Chemical and Biomolecular Engineering, University of Illinois at Urbana\u2010Champaign, Urbana, IL 61801","institution_ids":["https://openalex.org/I157725225"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I157725225"],"apc_list":null,"apc_paid":null,"fwci":3.9068,"has_fulltext":false,"cited_by_count":43,"citation_normalized_percentile":{"value":0.92747366,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"2","issue":"2","first_page":"313","last_page":"327"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.6991999745368958,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.6991999745368958,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.2678000032901764,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11087","display_name":"Solidification and crystal growth phenomena","score":0.0031999999191612005,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper-electrodeposition","display_name":"copper electrodeposition","score":0.9819999933242798},{"id":"https://openalex.org/keywords/kinetic-monte-carlo","display_name":"kinetic Monte Carlo","score":0.777999997138977},{"id":"https://openalex.org/keywords/coarse-grained-simulation","display_name":"coarse-grained simulation","score":0.8679999709129333},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"surface roughness","score":0.9020000100135803},{"id":"https://openalex.org/keywords/surface-coverage","display_name":"surface coverage","score":0.734000027179718},{"id":"https://openalex.org/keywords/surface-diffusion","display_name":"surface diffusion","score":0.8199999928474426},{"id":"https://openalex.org/keywords/surface-mixing","display_name":"surface mixing","score":0.8759999871253967},{"id":"https://openalex.org/keywords/on-chip-interconnects","display_name":"on-chip interconnects","score":0.8149999976158142},{"id":"https://openalex.org/keywords/shape-evolution","display_name":"shape evolution","score":0.5910000205039978},{"id":"https://openalex.org/keywords/surface-reaction-mechanism","display_name":"surface reaction mechanism","score":0.5789999961853027},{"id":"https://openalex.org/keywords/multiscale-modeling","display_name":"multiscale modeling","score":0.49399998784065247}],"concepts":[{"id":"https://openalex.org/C45786274","wikidata":"https://www.wikidata.org/wiki/Q3333611","display_name":"Kinetic Monte Carlo","level":3,"score":0.8895812034606934},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.643101692199707},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6093500256538391},{"id":"https://openalex.org/C19499675","wikidata":"https://www.wikidata.org/wiki/Q232207","display_name":"Monte Carlo method","level":2,"score":0.573552668094635},{"id":"https://openalex.org/C121864883","wikidata":"https://www.wikidata.org/wiki/Q677916","display_name":"Statistical physics","level":1,"score":0.555919349193573},{"id":"https://openalex.org/C15696416","wikidata":"https://www.wikidata.org/wiki/Q3027666","display_name":"Surface diffusion","level":3,"score":0.4961410462856293},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.47545382380485535},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.4630020260810852},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.41211211681365967},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3200581669807434},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.2882000207901001},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.18804219365119934},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.17747622728347778},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.1531936228275299},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1499675214290619},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.14548274874687195},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.13938987255096436},{"id":"https://openalex.org/C150394285","wikidata":"https://www.wikidata.org/wiki/Q180254","display_name":"Adsorption","level":2,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1615/intjmultcompeng.v2.i2.90","doi":"https://doi.org/10.1615/intjmultcompeng.v2.i2.90","is_oa":false,"landing_page_url":"https://doi.org/10.1615/intjmultcompeng.v2.i2.90","pdf_url":null,"source":{"id":"https://openalex.org/S63368048","display_name":"International Journal for Multiscale Computational Engineering","issn_l":"1543-1649","issn":["1543-1649","1940-4352"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","poland-40","russia-white-list-2"],"host_organization":"https://openalex.org/P4310315730","host_organization_name":"Begell House","host_organization_lineage":["https://openalex.org/P4310315730"],"host_organization_lineage_names":["Begell House"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal for Multiscale Computational Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[{"score":0.5,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W70668290","https://openalex.org/W1559947614","https://openalex.org/W1639468768","https://openalex.org/W1861829594","https://openalex.org/W1970964256","https://openalex.org/W1978658686","https://openalex.org/W1987841618","https://openalex.org/W1992985677","https://openalex.org/W1997050930","https://openalex.org/W1999052075","https://openalex.org/W1999279146","https://openalex.org/W2008713730","https://openalex.org/W2012632078","https://openalex.org/W2021773834","https://openalex.org/W2047093015","https://openalex.org/W2055883458","https://openalex.org/W2056197311","https://openalex.org/W2065623958","https://openalex.org/W2070566012","https://openalex.org/W2072931187","https://openalex.org/W2075409911","https://openalex.org/W2084999168","https://openalex.org/W2085282183","https://openalex.org/W2101880715","https://openalex.org/W2137971290","https://openalex.org/W2138788686","https://openalex.org/W2169068974","https://openalex.org/W3098913376"],"related_works":["https://openalex.org/W1695615354","https://openalex.org/W2023538552","https://openalex.org/W2138788686","https://openalex.org/W1639468768","https://openalex.org/W4214577017","https://openalex.org/W2088033617","https://openalex.org/W2122235806","https://openalex.org/W2141173673","https://openalex.org/W2758472763","https://openalex.org/W2213851199"],"abstract_inverted_index":{"A":[0],"(2+1)D":[1],"kinetic":[2],"Monte":[3],"Carlo":[4],"(KMC)":[5],"code":[6,115,139],"was":[7,116,119],"developed":[8],"for":[9,38,104,159,214],"coarse-grained":[10,97,137,211],"as":[11,13,94,96,187],"well":[12,95],"atomic-scale":[14],"simulations":[15],"that":[16,43,73,121,148,155,177],"require":[17],"detailed":[18],"consideration":[19],"of":[20,27,32,81,108,112,143,149,209],"complex":[21,216],"surface-reaction":[22],"mechanisms":[23],"associated":[24],"with":[25,99,140,166],"electrodeposition":[26],"copper":[28],"in":[29,69],"the":[30,46,82,110,113,122,150,178,183,194,201,205,210],"presence":[31],"additives.":[33],"The":[34,198],"physical":[35],"system":[36],"chosen":[37],"simulation":[39],"is":[40,156,175,190],"similar":[41],"to":[42,49,57],"used":[44,56],"by":[45,78,134,192],"microelectronics":[47],"industry":[48],"fabricate":[50],"on-chip":[51],"interconnects,":[52],"where":[53],"additives":[54],"are":[55,66],"tailor":[58],"shape":[59],"evolution.":[60],"Although":[61],"economically":[62],"significant,":[63],"such":[64],"systems":[65],"often":[67],"designed":[68],"an":[70],"empirical":[71],"manner":[72],"would":[74],"be":[75,131],"greatly":[76],"enhanced":[77],"improved":[79],"understanding":[80],"additive":[83],"mechanism":[84],"gained":[85],"through":[86],"simulations.":[87,168],"By":[88],"comparing":[89,160],"simulated":[90,133],"results":[91,101,199],"at":[92,125],"atomic":[93],"scales":[98],"theoretical":[100],"obtained":[102],"analytically":[103],"various":[105],"limiting":[106],"cases":[107],"behavior,":[109],"validity":[111],"KMC":[114,138,212],"tested.":[117],"It":[118],"found":[120],"surface":[123,164,172,180,185,188,195],"roughness":[124,165],"a":[126,136],"specified":[127,151],"length":[128,152],"scale":[129],"can":[130],"accurately":[132],"using":[135],"lattice":[141],"spacing":[142],"1/10":[144],"or":[145],"smaller":[146],"than":[147],"scale\u0097a":[153],"result":[154],"particularly":[157],"useful":[158],"experimental":[161],"data":[162],"on":[163],"numerical":[167,202],"For":[169],"second-order":[170],"homogeneous":[171],"reactions,":[173],"it":[174],"shown":[176],"KMC-simulated":[179],"coverage":[181,186],"approaches":[182],"analytical":[184],"mixing":[189],"increased":[191],"increasing":[193],"diffusion":[196],"rate.":[197],"verified":[200],"accuracy":[203],"and":[204,218],"reduced":[206],"computational":[207],"cost":[208],"approach":[213],"simulating":[215],"chemical":[217],"electrochemical":[219],"mechanisms.":[220]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":1}],"updated_date":"2026-10-13T10:08:12.033832","created_date":"2016-06-24T00:00:00"}