{"id":"https://openalex.org/W2000583405","doi":"https://doi.org/10.1109/icept.2011.6066860","title":"Improvement of the second bond strength in copper wire bonding on pre-plated leadframe","display_name":"Improvement of the second bond strength in copper wire bonding on pre-plated leadframe","publication_year":2011,"publication_date":"2011-08-01","ids":{"openalex":"https://openalex.org/W2000583405","doi":"https://doi.org/10.1109/icept.2011.6066860","mag":"2000583405"},"language":"en","primary_location":{"id":"doi:10.1109/icept.2011.6066860","doi":"https://doi.org/10.1109/icept.2011.6066860","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept.2011.6066860","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 12th International Conference on Electronic Packaging Technology and High Density Packaging","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036902548","display_name":"Bing An","orcid":"https://orcid.org/0000-0002-1085-0602","observed_orcids":["https://orcid.org/0000-0002-1085-0602"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bing An","raw_affiliation_strings":["School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]},{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062346824","display_name":"Lan Ding","orcid":"https://orcid.org/0000-0002-7423-2061","observed_orcids":["https://orcid.org/0000-0002-7423-2061"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lan Ding","raw_affiliation_strings":["School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]},{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063258745","display_name":"Techun Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Techun Wang","raw_affiliation_strings":["ASE Assembly and Test (Shanghai) Limited, Shanghai, China","ASE Assembly & Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASE Assembly and Test (Shanghai) Limited, Shanghai, China","institution_ids":["https://openalex.org/I2799432993"]},{"raw_affiliation_string":"ASE Assembly & Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079818917","display_name":"Tailieh Lu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tailieh Lu","raw_affiliation_strings":["ASE Assembly and Test (Shanghai) Limited, Shanghai, China","ASE Assembly & Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASE Assembly and Test (Shanghai) Limited, Shanghai, China","institution_ids":["https://openalex.org/I2799432993"]},{"raw_affiliation_string":"ASE Assembly & Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065328826","display_name":"Liangquan Sun","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liangquan Sun","raw_affiliation_strings":["School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]},{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102861731","display_name":"Yiping Wu","orcid":"https://orcid.org/0000-0002-5242-4740","observed_orcids":["https://orcid.org/0000-0002-5242-4740"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yiping Wu","raw_affiliation_strings":["School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]},{"raw_affiliation_string":"School of Materials Science and Engineering, Huazhong University of  Science and Technology,Wuhan 430074,China)","institution_ids":["https://openalex.org/I47720641"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4237,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.46083656,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper-wire-bonding","display_name":"copper wire bonding","score":0.9990000128746033},{"id":"https://openalex.org/keywords/vacuum-heat-treatment","display_name":"vacuum heat treatment","score":0.890999972820282},{"id":"https://openalex.org/keywords/interfacial-adhesion","display_name":"interfacial adhesion","score":0.8740000128746033},{"id":"https://openalex.org/keywords/strain-hardening","display_name":"strain hardening","score":0.5759999752044678},{"id":"https://openalex.org/keywords/oxidation-sensitivity","display_name":"oxidation sensitivity","score":0.6349999904632568}],"concepts":[{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.8927696943283081},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7499147653579712},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.7170403003692627},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5440099239349365},{"id":"https://openalex.org/C159096172","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bond strength","level":4,"score":0.5388370156288147},{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.5244907736778259},{"id":"https://openalex.org/C2988571348","wikidata":"https://www.wikidata.org/wiki/Q2811078","display_name":"Copper wire","level":3,"score":0.5138311982154846},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.49226489663124084},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.18320882320404053},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.14791610836982727},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.10175526142120361},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icept.2011.6066860","doi":"https://doi.org/10.1109/icept.2011.6066860","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept.2011.6066860","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 12th International Conference on Electronic Packaging Technology and High Density Packaging","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4943999946117401}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W45047440","https://openalex.org/W1546651064","https://openalex.org/W2000254080","https://openalex.org/W2010691317","https://openalex.org/W2012208481","https://openalex.org/W2016024668","https://openalex.org/W2048127341","https://openalex.org/W2050129640","https://openalex.org/W2075287884","https://openalex.org/W2089280292","https://openalex.org/W2108058911","https://openalex.org/W6676014080"],"related_works":["https://openalex.org/W2143254856","https://openalex.org/W4240838372","https://openalex.org/W1972819627","https://openalex.org/W2545206252","https://openalex.org/W6981360658","https://openalex.org/W2155717529","https://openalex.org/W4410230862","https://openalex.org/W1640760718","https://openalex.org/W2541425900","https://openalex.org/W1515030280"],"abstract_inverted_index":{"Due":[0],"to":[1,36,61,84,100,126],"the":[2,12,18,32,38,47,51,54,69,73,77,81,85,93,106,144,165,171,176,183,187,198,202],"low":[3,70,86],"cost":[4],"and":[5,8,76,87,134,170,196],"high":[6,58],"mechanical":[7],"electrical":[9],"properties":[10],"of":[11,53,113,149,190,201],"copper":[13,24,74,108,116,191],"wire":[14,25,40,75,109,117,146,155,192],"as":[15,17,57],"well":[16],"environmental":[19],"friendly":[20],"pre-plated":[21],"frame":[22],"(PPF),":[23],"bonding":[26,41,89,118,193],"on":[27,194],"PPF":[28,78,107,115],"has":[29],"been":[30],"considered":[31],"most":[33],"promising":[34],"candidate":[35],"replace":[37],"gold":[39],"in":[42,46],"actual":[43],"volume":[44],"production":[45],"coming":[48],"years.":[49],"However,":[50],"nature":[52],"copper,":[55],"such":[56],"hardness,":[59],"sensitivity":[60],"oxidation,":[62],"work":[63],"hardening":[64],"effect":[65],"etc.,":[66],"coupled":[67],"with":[68],"adhesion":[71,189],"between":[72],"surface":[79],"are":[80],"main":[82,154],"causes":[83],"unstable":[88],"strength,":[90],"especially":[91],"at":[92,131],"second":[94,166,203],"bond.":[95],"The":[96,153,179],"proposed":[97],"solution":[98],"is":[99],"introduce":[101],"a":[102,127],"heat":[103,129,162,177,184],"treatment":[104,130,185],"after":[105,160,175],"bonding.":[110],"Two":[111],"kinds":[112],"unsealed":[114],"samples":[119,151],"prepared":[120],"under":[121],"different":[122],"parameters":[123],"were":[124],"submitted":[125],"vacuum":[128,161],"200":[132],"\u00b0C":[133],"10-3":[135],"Pa":[136],"for":[137],"10":[138],"min.":[139],"It":[140],"was":[141],"found":[142],"that":[143,182],"average":[145],"pull":[147,156],"strengths":[148],"both":[150],"increased.":[152],"break":[157],"modes":[158],"changed":[159],"treatment,":[163],"i.e.,":[164],"bond":[167],"lift-off":[168],"disappeared":[169],"heel":[172],"breaks":[173],"decreased":[174],"treatment.":[178],"results":[180],"indicate":[181],"enhances":[186],"interfacial":[188],"PPF,":[195],"increases":[197],"tensile":[199],"strength":[200],"bonds.":[204]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":1}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2016-06-24T00:00:00"}