{"id":"https://openalex.org/W2000254080","doi":"https://doi.org/10.1016/j.microrel.2010.06.006","title":"Fine pitch copper wire bonding in high volume production","display_name":"Fine pitch copper wire bonding in high volume production","publication_year":2010,"publication_date":"2010-07-07","ids":{"openalex":"https://openalex.org/W2000254080","doi":"https://doi.org/10.1016/j.microrel.2010.06.006","mag":"2000254080"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2010.06.006","doi":"https://doi.org/10.1016/j.microrel.2010.06.006","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2010.06.006","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047941080","display_name":"Bernd K. Appelt","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Bernd K. Appelt","raw_affiliation_strings":["ASE Group, 3590 Peterson Way, Santa Clara, CA 95054, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASE Group, 3590 Peterson Way, Santa Clara, CA 95054, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001754078","display_name":"Andy Tseng","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Andy Tseng","raw_affiliation_strings":["ASE Group, 3590 Peterson Way, Santa Clara, CA 95054, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASE Group, 3590 Peterson Way, Santa Clara, CA 95054, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018335479","display_name":"Chun\u2010Hsiung Chen","orcid":"https://orcid.org/0000-0003-3774-7039","observed_orcids":["https://orcid.org/0000-0003-3774-7039"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Hsiung Chen","raw_affiliation_strings":["ASE Group, 26 Chin 3rd Rd., Nantze Export Zone, Kaohsiung 81170, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASE Group, 26 Chin 3rd Rd., Nantze Export Zone, Kaohsiung 81170, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103561002","display_name":"Yi\u2010Shao Lai","orcid":"https://orcid.org/0000-0003-3550-9256","observed_orcids":["https://orcid.org/0000-0003-3550-9256"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi-Shao Lai","raw_affiliation_strings":["ASE Group, 26 Chin 3rd Rd., Nantze Export Zone, Kaohsiung 81170, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASE Group, 26 Chin 3rd Rd., Nantze Export Zone, Kaohsiung 81170, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5047941080"],"corresponding_institution_ids":[],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":5.6364,"has_fulltext":false,"cited_by_count":56,"citation_normalized_percentile":{"value":0.95982738,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"51","issue":"1","first_page":"13","last_page":"20"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0017999999690800905,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper-wire-bonding","display_name":"copper wire bonding","score":0.9860000014305115},{"id":"https://openalex.org/keywords/gold-wire-bonding","display_name":"gold wire bonding","score":0.7820000052452087},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.6759999990463257},{"id":"https://openalex.org/keywords/long-term-reliability","display_name":"long-term reliability","score":0.7540000081062317},{"id":"https://openalex.org/keywords/reliability-testing","display_name":"reliability testing","score":0.7039999961853027},{"id":"https://openalex.org/keywords/interfacial-analysis","display_name":"interfacial analysis","score":0.7459999918937683},{"id":"https://openalex.org/keywords/production-yield","display_name":"production yield","score":0.7160000205039978},{"id":"https://openalex.org/keywords/high-volume-manufacturing","display_name":"high-volume manufacturing","score":0.6830000281333923}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8560746908187866},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.85393226146698},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.7632588148117065},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7256733179092407},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.70011305809021},{"id":"https://openalex.org/C2988571348","wikidata":"https://www.wikidata.org/wiki/Q2811078","display_name":"Copper wire","level":3,"score":0.6479257345199585},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6072388291358948},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4212311804294586},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.4128803610801697},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3693617582321167},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3568217158317566},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2858245372772217},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.216228187084198},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1879117786884308},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1848004162311554},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07432931661605835},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07046809792518616},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2010.06.006","doi":"https://doi.org/10.1016/j.microrel.2010.06.006","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2010.06.006","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W39910357","https://openalex.org/W1677974497","https://openalex.org/W1969566876","https://openalex.org/W1971897257","https://openalex.org/W1978381258","https://openalex.org/W1988628975","https://openalex.org/W2021740954","https://openalex.org/W2035916504","https://openalex.org/W2046861037","https://openalex.org/W2047510016","https://openalex.org/W2054152862","https://openalex.org/W2057898574","https://openalex.org/W2071342108","https://openalex.org/W2100292623","https://openalex.org/W2101078257","https://openalex.org/W2105758691","https://openalex.org/W2112372294","https://openalex.org/W2123047790","https://openalex.org/W2142352610","https://openalex.org/W2142635684","https://openalex.org/W2163030515","https://openalex.org/W2167945889","https://openalex.org/W2168410586","https://openalex.org/W2169309602","https://openalex.org/W2171980082","https://openalex.org/W2540911031","https://openalex.org/W2541287809","https://openalex.org/W2543831348"],"related_works":["https://openalex.org/W2140035681","https://openalex.org/W2082778718","https://openalex.org/W2114917534","https://openalex.org/W2086624303","https://openalex.org/W2019902180","https://openalex.org/W1990596417","https://openalex.org/W2047919374","https://openalex.org/W2142635684","https://openalex.org/W2039324412","https://openalex.org/W45047440"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":5},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":10},{"year":2013,"cited_by_count":10},{"year":2012,"cited_by_count":7}],"updated_date":"2026-09-26T08:19:03.415552","created_date":"2016-06-24T00:00:00"}