{"id":"https://openalex.org/W1998993146","doi":"https://doi.org/10.4028/www.scientific.net/msf.792.215","title":"Simplified Calculation Method of Planar Coil Impedance Considering the Eddy Current Distribution by Using Finite Element Method","display_name":"Simplified Calculation Method of Planar Coil Impedance Considering the Eddy Current Distribution by Using Finite Element Method","publication_year":2014,"publication_date":"2014-08-11","ids":{"openalex":"https://openalex.org/W1998993146","doi":"https://doi.org/10.4028/www.scientific.net/msf.792.215","mag":"1998993146"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/msf.792.215","doi":"https://doi.org/10.4028/www.scientific.net/msf.792.215","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.792.215","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"},"parent_works":[],"lineage":["https://openalex.org/W1998993146"],"child_works_count":0,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.4028/www.scientific.net/msf.792.215","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109122165","display_name":"Hiroyuki Wakiwaka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I137975476","display_name":"Shinshu University","ror":"https://ror.org/0244rem06","country_code":"JP","type":"education","lineage":["https://openalex.org/I137975476"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hiroyuki Wakiwaka","raw_affiliation_strings":["Shinshu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shinshu University","institution_ids":["https://openalex.org/I137975476"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Daisuke Ito","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I137975476","display_name":"Shinshu University","ror":"https://ror.org/0244rem06","country_code":"JP","type":"education","lineage":["https://openalex.org/I137975476"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Daisuke Ito","raw_affiliation_strings":["Shinshu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shinshu University","institution_ids":["https://openalex.org/I137975476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007295925","display_name":"Kunihisa Tashiro","orcid":"https://orcid.org/0000-0003-0793-882X","observed_orcids":["https://orcid.org/0000-0003-0793-882X"]},"institutions":[{"id":"https://openalex.org/I137975476","display_name":"Shinshu University","ror":"https://ror.org/0244rem06","country_code":"JP","type":"education","lineage":["https://openalex.org/I137975476"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kunihisa Tashiro","raw_affiliation_strings":["Shinshu University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shinshu University","institution_ids":["https://openalex.org/I137975476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086817006","display_name":"Hisashi Yajima","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2800964503","display_name":"SMC Corporation (Japan)","ror":"https://ror.org/03gfc4s78","country_code":"JP","type":"company","lineage":["https://openalex.org/I2800964503"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hisashi Yajima","raw_affiliation_strings":["SMC Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMC Corporation","institution_ids":["https://openalex.org/I2800964503"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040009910","display_name":"Yuji Manta","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2800964503","display_name":"SMC Corporation (Japan)","ror":"https://ror.org/03gfc4s78","country_code":"JP","type":"company","lineage":["https://openalex.org/I2800964503"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuji Manta","raw_affiliation_strings":["SMC Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMC Corporation","institution_ids":["https://openalex.org/I2800964503"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113556228","display_name":"Takehiko Kanazawa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2800964503","display_name":"SMC Corporation (Japan)","ror":"https://ror.org/03gfc4s78","country_code":"JP","type":"company","lineage":["https://openalex.org/I2800964503"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takehiko Kanazawa","raw_affiliation_strings":["SMC Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMC Corporation","institution_ids":["https://openalex.org/I2800964503"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073378740","display_name":"Nobuhiro Fujiwara","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2800964503","display_name":"SMC Corporation (Japan)","ror":"https://ror.org/03gfc4s78","country_code":"JP","type":"company","lineage":["https://openalex.org/I2800964503"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Nobuhiro Fujiwara","raw_affiliation_strings":["SMC Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SMC Corporation","institution_ids":["https://openalex.org/I2800964503"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5109122165"],"corresponding_institution_ids":["https://openalex.org/I137975476"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":"792","issue":null,"first_page":"215","last_page":"220"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9810000061988831,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9810000061988831,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12692","display_name":"Magnetic Field Sensors Techniques","score":0.008500000461935997,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11778","display_name":"Electrical and Bioimpedance Tomography","score":0.00419999985024333,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/planar-coils","display_name":"planar coils","score":0.7789999842643738},{"id":"https://openalex.org/keywords/eddy-current-sensors","display_name":"eddy current sensors","score":0.7080000042915344},{"id":"https://openalex.org/keywords/coil-impedance","display_name":"coil impedance","score":0.953000009059906},{"id":"https://openalex.org/keywords/eddy-current-distribution","display_name":"eddy current distribution","score":0.9929999709129333},{"id":"https://openalex.org/keywords/metal-plates","display_name":"metal plates","score":0.8849999904632568},{"id":"https://openalex.org/keywords/mutual-inductance","display_name":"mutual inductance","score":0.8740000128746033},{"id":"https://openalex.org/keywords/equivalent-circuit-model","display_name":"equivalent circuit model","score":0.9539999961853027},{"id":"https://openalex.org/keywords/simplified-analysis-method","display_name":"simplified calculation method","score":0.7590000033378601},{"id":"https://openalex.org/keywords/sensor-design-optimization","display_name":"sensor design optimization","score":0.8119999766349792}],"concepts":[{"id":"https://openalex.org/C131357438","wikidata":"https://www.wikidata.org/wiki/Q208598","display_name":"Eddy current","level":2,"score":0.9088380336761475},{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.842261791229248},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.7107821702957153},{"id":"https://openalex.org/C6441794","wikidata":"https://www.wikidata.org/wiki/Q1420867","display_name":"Eddy-current testing","level":3,"score":0.7007490396499634},{"id":"https://openalex.org/C2777897478","wikidata":"https://www.wikidata.org/wiki/Q23718891","display_name":"Eddy-current sensor","level":3,"score":0.6744980812072754},{"id":"https://openalex.org/C134786449","wikidata":"https://www.wikidata.org/wiki/Q3391255","display_name":"Planar","level":2,"score":0.6562872529029846},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6558659076690674},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.553610622882843},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.5313637256622314},{"id":"https://openalex.org/C34800285","wikidata":"https://www.wikidata.org/wiki/Q5159395","display_name":"Conductor","level":2,"score":0.47264498472213745},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.417725145816803},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.34737518429756165},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.276503324508667},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23550447821617126},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.15858304500579834},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15068450570106506},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1505039632320404},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.07221990823745728},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/msf.792.215","doi":"https://doi.org/10.4028/www.scientific.net/msf.792.215","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.792.215","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4028/www.scientific.net/msf.792.215","doi":"https://doi.org/10.4028/www.scientific.net/msf.792.215","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.792.215","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2100788482","https://openalex.org/W2324299068"],"related_works":["https://openalex.org/W2324299068","https://openalex.org/W2388698184","https://openalex.org/W2067463961","https://openalex.org/W2163652477","https://openalex.org/W2371953208","https://openalex.org/W25382197","https://openalex.org/W2799446091","https://openalex.org/W1723791449","https://openalex.org/W2045607031"],"abstract_inverted_index":{"Eddy":[0],"current":[1,47,88,167,181],"sensors":[2],"have":[3],"various":[4],"uses.":[5],"However,":[6],"there":[7],"are":[8],"few":[9],"studies":[10],"which":[11],"show":[12],"theinfluence":[13],"of":[14,20,35,78,85,136,155,164,178],"a":[15,21,29,36,50,69,79,156,160],"conductor":[16],"on":[17],"the":[18,41,64,76,83,86,104,108,122,137,165],"impedance":[19,34,77,120],"detector":[22],"coil":[23,38,56,71,81,106,158],"using":[24],"theoretical":[25],"formulae.":[26],"This":[27,115,169],"papershows":[28],"simplified":[30,99,116,170],"calculation":[31,171],"method":[32,172],"for":[33,175],"planar":[37,55,80,105,157],"while":[39],"considering":[40,82],"influenceof":[42],"eddy":[43,46,87,166,180],"current.":[44],"An":[45],"distribution":[48],"in":[49],"metal":[51,65,109],"plate":[52,66,110],"facing":[53],"to":[54,67,132],"was":[57,143],"calculatedusing":[58],"finite":[59,126],"element":[60,127],"method.":[61,128],"It":[62],"assumed":[63],"be":[68,149],"one-turn":[70],"that":[72],"can":[73,89,118,148],"change":[74],"shape.Therefore,":[75],"influence":[84],"beestimated":[90],"from":[91,111],"an":[92,112,179],"equivalent":[93],"circuit.":[94],"In":[95],"addition,":[96],"calculations":[97],"were":[98],"by":[100,145],"estimating":[101],"mutualinductance":[102],"between":[103],"and":[107],"area":[113],"ratio.":[114],"calculationmethod":[117],"estimate":[119],"with":[121],"same":[123],"accuracy":[124],"as":[125],"The":[129,140],"calculatedvalue":[130],"agrees":[131],"within":[133],"\u00b12.44":[134],"%":[135],"measured":[138],"value.":[139],"computation":[141],"time":[142],"shortened":[144],"1/20.Therefore,":[146],"it":[147],"immediately":[150],"estimated":[151],"how":[152],"each":[153],"parameter":[154],"or":[159],"target":[161],"influencesthe":[162],"characteristic":[163],"sensor.":[168,182],"is":[173],"useful":[174],"anoptimum":[176],"design":[177]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-11-14T11:04:58.165337","created_date":"2016-06-24T00:00:00"}